Introducing our newly shipment PCB which made of TLX-8 material.
TLX-8 is an exceptional PTFE fiberglass laminate PCB designed to
provide reliability and versatility in various RF applications.
Engineered with a wide range of available thicknesses and copper
cladding options, TLX-8 offers outstanding mechanical reinforcement
and excels in challenging environments. Whether it's withstanding
extreme temperatures, resisting vibration during space launches, or
maintaining radiation resistance in space, TLX-8 delivers
exceptional performance.
TLX-8 offers several key benefits. Firstly, it ensures superior
Passive Intermodulation (PIM) values, measured lower than -160
dBc*, which ensures exceptional signal integrity and minimizes
signal interference. Secondly, TLX-8 exhibits outstanding
mechanical strength and thermal stability, making it ideal for
applications subjected to harsh conditions. Its low and stable
dielectric constant guarantees reliable signal transmission and
optimal impedance control for high-frequency performance.
One of the notable features of TLX-8 is its dimensional stability,
which allows it to maintain precise and reliable circuit
performance even in demanding environments. Additionally, TLX-8 has
low moisture absorption properties, enhancing its reliability and
making it suitable for applications exposed to humid conditions.
The tightly controlled dielectric constant of TLX-8 provides
consistent performance and predictable electrical characteristics.
Moreover, the low Dissipation Factor (DF) ensures minimal signal
loss, facilitating efficient transmission of high-frequency
signals.
| TLX-8 TYPICAL VALUES |
| Property | Test Method | Unit | Value | Unit | Value |
| DK @10 GHz | IPC-650 2.5.5.3 | | 2.55 | | 2.55 |
| Df @1.9 GHz | IPC-650 2.5.5.5.1 | | 0.0012 | | 0.0012 |
| Df @10 GHz | IPC-650 2.5.5.5.1 | | 0.0017 | | 0.0017 |
| Dielectric Breakdown | IPC-650 2.5.6 | kV | >45 | kV | >45 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
| Flexural Strength(MD) | ASTM D 709 | psi | 28,900 | N/mm2 | |
| Flexural Strength(CD) | ASTM D 709 | psi | 20,600 | N/mm2 | |
| Tensile Strength(MD) | ASTM D 902 | psi | 35,600 | N/mm2 | |
| Tensile Strength(CD) | ASTM D 902 | psi | 27,500 | N/mm2 | |
| Elongation at Break(MD) | ASTM D 902 | % | 3.94 | % | 3.94 |
| Elongation at Break(CD) | ASTM D 902 | % | 3.92 | % | 3.92 |
| Young's Modulus(MD) | ASTM D 902 | kpsi | 980 | N/mm2 | |
| Young's Modulus(CD) | ASTM D 902 | kpsi | 1,200 | N/mm2 | |
| Young's Modulus(MD) | ASTM D 3039 | kpsi | 1,630 | N/mm2 | |
| Poisson's Ratio | ASTM D 3039 | | 0.135 | N/mm | |
| Peel Stength(1 oz.ed) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 15 | N/mm | |
| Peel Stength(1 oz.RTF) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 17 | N/mm | |
| Peel Stength(½ oz.ed) | IPC-650 2.4.8.3(Elevated Temp.) | Ibs./linear inch | 14 | N/mm | |
| Peel Stength(½ oz.ed) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 11 | N/mm | |
| Peel Stength(1 oz.rolled) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 13 | N/mm | 2.1 |
| Thermal Conductivity | ASTM F433/ASTM 1530-06 | W/M*K | 0.19 | W/M*K | 0.19 |
| Dimensional Stability(MD) | IPC-650 2.4.39 Sec.5.5(After Bake.) | mils/in. | 0.06 | mm/M | |
| Dimensional Stability(CD) | IPC-650 2.4.39 Sec.5.4(After Bake.) | mils/in. | 0.08 | mm/M | |
| Dimensional Stability(MD) | IPC-650 2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.09 | mm/M | |
| Dimensional Stability(CD) | IPC-650 2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.1 | mm/M | |
| Surface Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) | Mohm | 6.605 x 108 | Mohm | 6.605 x 108 |
| Surface Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) | Mohm | 3.550 x 106 | Mohm | 3.550 x 106 |
| Volume Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) | Mohm/cm | 1.110 x 1010 | Mohm/cm | 1.110 x 1010 |
| Volume Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) | Mohm/cm | 1.046 x 1010 | Mohm/cm | 1.046 x 1010 |
| CTE(X axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 21 | ppm/℃ | 21 |
| CTE(Y axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 23 | ppm/℃ | 23 |
| CTE(Z axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 215 | ppm/℃ | 215 |
| Density(Specific Gravity) | ASTM D 792 | g/cm3 | 2.25 | g/cm3 | 2.25 |
| Td(2% Weight Loss) | IPC-650 2.4.24.6(TGA) | ℃ | 535 | ℃ | |
| Td(5% Weight Loss) | IPC-650 2.4.24.6(TGA) | ℃ | 553 | ℃ | |
| Flammability Rating | UL-94 | | V-0 | | V-0 |
In terms of safety, TLX-8 complies with the UL 94 V0 rating,
ensuring high fire resistance in critical applications. It is
specifically designed for low layer count microwave designs,
offering optimal performance and ease of integration. The
electrical properties of TLX-8 include a dielectric constant of
2.55 ± 0.04 at 10 GHz and a Dissipation Factor of 0.0018 at 10 GHz.
The dimensional stability and coefficient of thermal expansion
(CTE) of TLX-8 are within acceptable ranges for reliable
performance.
This RF PCB is constructed as 2-layer rigid boards with a copper
weight of 1oz (1.4 mils) on the outer layers. The board dimensions
are 111.54mm x 116.75 mm with a finished thickness of 0.8mm. The
minimum trace/space is 6/5 mils, and the minimum hole size is
0.25mm. The PCBs undergo thorough testing, including a 100%
electrical test prior to shipment, ensuring their quality and
reliability.
TLX-8 PCBs are suitable for a wide range of applications, such as
radar systems, mobile communications, microwave test equipment, and
microwave transmission devices. Whether you need reliable circuitry
for these applications or require exceptional performance in
challenging RF environments, TLX-8 PCBs provide the reliability and
performance you need.
