Specific Gravity 2.7 G/Cc Heat Sink Thermal Pad In Mother Board

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Ziitek TIF140-20-10UF is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

<Naturally tacky needing no further adhesive coating
<Available in varies thicknesses
<Broad range of hardnesses available

<mainboard/mother board

<notebook

<power supply

<Heat pipe thermal solutions

<Memory Modules

<Mass storage devices

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

TIF™ series Individual die cut shapes can be supplied.