Industrial SOP4/6/8 MGP Semiconductor Mold Smooth Surface Finish

SOP4/6/8 MGP Mold

Technical Parameters

1. Plastic dual -oil cylinder with a built -in gear shift drive multi -injection molding design;

2. The roughness of the cavity can achieve 0.2um.max;

3. Special products can increase the design of vacuum and built -in core pumping mechanisms;

4. According to the size of different lead frames, 8 tablets/12 pieces/16 tablets per mold can be achieved.

Customization:

Brand Name: TJIN

Model Number: 007

Place of Origin: China

Certification: ISO9001

Minimum Order Quantity: 1

Packaging Details: Wooden Packaging

Delivery Time: 40 days

Payment Terms: TT

Mold Standard: DME, HASCO, LKM Or Customized

Lead Time: 4-8 Weeks

Ejection System: Ejector Pin, Ejector Sleeve, Ejector Blade, Etc.

Surface Treatment: Mirror Polishing

Design Software: UG, ProE, Solidworks, AutoCAD

TJIN understands the importance of durability and longevity for our customers' molds. That's why we offer high-life MGP mold customization service that ensures your mold can withstand repeated use without compromising its quality.

Our team of skilled engineers will carefully design and manufacture your MGP mold using the best materials and techniques, guaranteeing its long-lasting performance.

Precision is crucial in the manufacturing industry, and we at TJIN are committed to delivering high-precision MGP molds for our customers. Our state-of-the-art equipment and advanced technology allow us to achieve the utmost accuracy and consistency in the production of your mold.

Our experienced technicians will meticulously inspect and test your mold to ensure it meets the highest standards of precision, providing you with a mold that produces perfect results every time.

Choose TJIN for your MGP mold customization needs and experience the best in high-quality, high-life, and high-precision molds. Contact us today to request a quote!

Packing and Shipping:

At MGP Mold, we take great care in packaging and shipping our products to ensure they arrive at their destination safely and in pristine condition. Our packaging and shipping process follows strict guidelines to guarantee the highest quality of our products upon arrival.

Firstly, our team carefully inspects each mold to ensure it is free from any defects or damages before packaging. Then, the mold is wrapped in protective material and placed in a sturdy box or crate, depending on the size and weight of the mold. The box is then sealed securely to prevent any movement during transportation.

In addition, delicate or fragile parts of the mold are given extra protection with bubble wrap or foam inserts. This ensures that the mold is well-protected and can withstand any handling during shipping.

We offer various shipping methods to cater to the needs of our customers. These include air freight, sea freight, and ground transportation. The shipping method will depend on the size, weight, and urgency of the order.

For international orders, we ensure that all necessary customs documents and declarations are completed accurately and efficiently to avoid any delays or issues at customs. We also work closely with our shipping partners to track the progress of the shipment and provide updates to our customers.

Our delivery time varies depending on the shipping method and the destination of the order. We strive to process and ship orders as quickly as possible, but delivery time may also be affected by factors such as customs clearance and unforeseen delays during transit.

For urgent orders, we offer expedited shipping options at an additional cost. Please contact our customer service team for more information on expedited shipping.

At MGP Mold, we value the importance of proper packaging and shipping to ensure the satisfaction of our customers. We take great pride in our packaging process and shipping methods, and we are committed to delivering our products in a timely and efficient manner.

FAQ:

• Q: What is the brand name of this product?
  A: The brand name of this product is TJIN.
• Q: What is the model number of this product?
  A: The model number of this product is 007.
• Q: Where is this product made?
  A: This product is made in China.
• Q: Does this product have any certifications?
  A: Yes, this product is certified with ISO9001.
• Q: What is the minimum order quantity for this product?
  A: The minimum order quantity for this product is 1.
• Q: How is this product packaged for delivery?
  A: This product is packaged in wooden packaging.
• Q: What is the estimated delivery time for this product?
  A: The estimated delivery time for this product is 40 days.
• Q: What are the available payment terms for this product?
  A: The available payment terms for this product are TT (Telegraphic Transfer).

Superiority

1. Use imported raw materials, use imported advanced equipment manufacturing and testing;

2. Customized on demand, the mold accuracy is high, the performance is stable, and the life of the mold is high;

Technical Parameters:

Our company is a leading enterprise in China that has long been committed to the R & D, production, manufacturing and sales of the semiconductor's leading frame mold and (integrated circuit IC) the post-process packaging equipment . 

As a professional semiconductor semiconductor package equipment is used in precision processing made by semiconductor equipment corporation，it need semiconductor tooling，spares part，and as well as plastic molding kit. We have advanced production equipment and technical teams that can service according to customer needs.

In terms of foreign trade development, we have rich experience and wide customer network. In the 13 years since the establishment of the company, our products have been successfully exported to more than 50 countries and regions such as Russia, France, Germany, Japan, the United States, Brazil, India, Thailand, Hong Kong, Malaysia, and Saudi Arabia and have received the unanimous praise from global customers.

We make a series of molds required to include the Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold and other semiconductor's post—processes. Whether it is semiconductor separate devices, capacitors, inductors, resistors, bridge circuits, vehicle electrons, etc., or the LED industry, the LED industry's MicroLED & mini-led solid packaging. We not only provide a plan for your newly developed products, but also provide suggestions from the aspects of improving product quality and improving costs for the products that exist in production.

If you are interested it, we can talk in detail and look forward to cooperating with you.