Integrated Circuit IC Lead Frame Stamping Mold Wear Resistance

PRODUCT ADVANTAGES

1. High product precision

2. Professional precision manufacturing and long mold life

3. Food packaging hardware punching and cutting molds

Customization:

Brand Name: TJIN

Model Number: 006

Place of Origin: China

Certification: ISO9001

Minimum Order Quantity: 1

Packaging Details: Wooden Packaging

Delivery Time: 40 days

Payment Terms: TT

Application: IC Lead Frame Stamping

Runner System: Hot Runner/Cold Runner

Cavity Number: Single

Tolerance: ±0.01mm

Mold Cooling System: Water Cooling

Hige-Quality Lead Frame Mold

Semicon IC Lead Frame Mold

Packing and Shipping:

FAQ:

• Q: What is the brand name of this product?
  A: The brand name of this product is TJIN.
• Q: What is the model number of this product?
  A: The model number of this product is 006.
• Q: Where is this product manufactured?
  A: This product is manufactured in China.
• Q: Does this product have any certification?
  A: Yes, this product is certified with ISO9001.
• Q: What is the minimum order quantity for this product?
  A: The minimum order quantity for this product is 1.
• Q: How is this product packaged for delivery?
  A: This product is packaged in wooden packaging.
• Q: What is the estimated delivery time for this product?
  A: The estimated delivery time for this product is 40 days.
• Q: What are the available payment terms for this product?
  A: The available payment terms for this product are TT (Telegraphic Transfer).

【Features】

1. Has high -precision and high strength and other characteristics

2. Professional precision manufacturing molds have high abrasion resistance with high life span

3. Material: Imported raw materials

4. Accuracy: Gensory value reaches ± 0.001mm

5. Small degrees: The line cut uses the original Japanese SODICK GF scheme electrode wire to ensure good surface smoothness.

6. Careful service: source manufacturer supply, quality and low price, intimate after -sales, no worry -free after -sales;

7. Guarantee quality: reliable quality, integrity operation, multiple specifications, delivery on time;

8. Customized according to the specific needs of customers

Technical Parameters:

Our company is a leading enterprise in China that has long been committed to the R & D, production, manufacturing and sales of the semiconductor's leading frame mold and (integrated circuit IC) the post-process packaging equipment . 

As a professional semiconductor semiconductor package equipment is used in precision processing made by semiconductor equipment corporation，it need semiconductor tooling，spares part，and as well as plastic molding kit. We have advanced production equipment and technical teams that can service according to customer needs.

In terms of foreign trade development, we have rich experience and wide customer network. In the 13 years since the establishment of the company, our products have been successfully exported to more than 50 countries and regions such as Russia, France, Germany, Japan, the United States, Brazil, India, Thailand, Hong Kong, Malaysia, and Saudi Arabia and have received the unanimous praise from global customers.

We make a series of molds required to include the Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold and other semiconductor's post—processes. Whether it is semiconductor separate devices, capacitors, inductors, resistors, bridge circuits, vehicle electrons, etc., or the LED industry, the LED industry's MicroLED & mini-led solid packaging. We not only provide a plan for your newly developed products, but also provide suggestions from the aspects of improving product quality and improving costs for the products that exist in production.

If you are interested it, we can talk in detail and look forward to cooperating with you.