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Customized Size IC Lead Frame Stamping Mold With Nickel Plating

    Buy cheap Customized Size  IC Lead Frame Stamping Mold With Nickel Plating from wholesalers
     
    Buy cheap Customized Size  IC Lead Frame Stamping Mold With Nickel Plating from wholesalers
    • Buy cheap Customized Size  IC Lead Frame Stamping Mold With Nickel Plating from wholesalers

    Customized Size IC Lead Frame Stamping Mold With Nickel Plating

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    Brand Name : TJIN
    Model Number : 006
    Certification : ISO9001
    Delivery Time : 40 days
    Payment Terms : TT
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    Customized Size IC Lead Frame Stamping Mold With Nickel Plating

    Water Cooling System IC Lead Frame Stamping Mold Customized Size 4-6 Weeks Lead Time

    Product Description:

    IC Lead Frame Stamping Mold

    The IC Lead Frame Stamping Mold is a high-quality and durable mold designed for producing high-precision IC lead frames. This mold is customized according to the specific requirements of each customer, ensuring efficient and accurate production of IC lead frames.

    Mold Size

    The size of the mold can be customized to meet the specific needs of the customer. The mold size can range from small to large, depending on the size of the IC lead frame required. This flexibility in size allows for a wide range of production possibilities.

    Surface Treatment

    The mold is treated with nickel plating, providing a smooth and durable surface. This surface treatment increases the longevity of the mold, ensuring consistent and high-quality production of IC lead frames.

    Mold Design

    The IC Lead Frame Stamping Mold is designed using advanced 3D/2D technology, allowing for precise and accurate mold design. This ensures that the final product meets the exact specifications and requirements of the customer.

    Mold Cooling System

    The mold is equipped with a water cooling system, which helps to maintain a consistent temperature during production. This cooling system is essential in ensuring the efficient production of high-quality IC lead frames.

    Mold Type

    The IC Lead Frame Stamping Mold is a type of stamping mold, which is commonly used in the production of IC lead frames. This type of mold is ideal for high-precision and efficient production of IC lead frames.

    Key Benefits
    • High-quality and durable mold
    • High-precision IC lead frame production
    • Flexible mold size options
    • Advanced 3D/2D mold design
    • Efficient cooling system
    • Ideal for stamping mold production

    Overall, the IC Lead Frame Stamping Mold is a top-of-the-line product that offers high-quality and efficient production of IC lead frames. Its customizable size, advanced design, and durable surface make it an essential tool in the production of electronic components.

    Features:

    • Product Name: IC Lead Frame Stamping Mold
    • Material: Steel
    • Tolerance: ±0.01mm
    • Mold Material: NAK80, S136, SKD61, Etc.
    • Mold Type: Stamping Mold
    • Surface Treatment: Nickel Plating

    Key Features:

    • High-Precision IC Lead Frame Mold
    • High-Life IC Lead Frame Mold
    • Semicon IC Lead Frame Mold

    Technical Parameters:

    Applications:

    IC Lead Frame Stamping Mold - Perfect for High-Life Electronics

    Brand Name: TJIN

    Model Number: 006

    Place of Origin: China

    Certification: ISO9001

    Minimum Order Quantity: 1

    Packaging Details: Wooden Packaging

    Delivery Time: 40 days

    Payment Terms: TT

    Mold Material: NAK80, S136, SKD61, Etc.

    Mold Cooling System: Water Cooling

    Lead Time: 4-6 Weeks

    Tolerance: ±0.01mm

    Surface Treatment: Nickel Plating

    Product Description

    The TJIN 006 IC Lead Frame Stamping Mold is a high-quality mold designed for the production of lead frames used in integrated circuits (IC). Made from top-grade materials such as NAK80, S136, and SKD61, this mold ensures precision and durability for long-lasting use.

    Application

    This product is widely used in the electronics industry, specifically in the production of integrated circuits. The lead frame mold is an essential tool in the manufacturing process of ICs, ensuring the precise and efficient production of lead frames. It is suitable for use in various electronic devices such as smartphones, computers, and other high-life electronics.

    Product Features
    • High-quality materials: The mold is made from top-grade materials such as NAK80, S136, and SKD61, ensuring durability and precision in the production process.
    • Water cooling system: The mold is equipped with a water cooling system, which helps to maintain a stable temperature during the production process, ensuring high-quality output.
    • High precision: The mold has a tolerance of ±0.01mm, ensuring the precise production of lead frames for ICs.
    • Nickel plating surface treatment: The mold is treated with nickel plating, providing a smooth and durable surface for efficient production.
    • Fast lead time: With a lead time of 4-6 weeks, this mold enables quick and efficient production of lead frames for ICs.
    Why Choose TJIN 006 IC Lead Frame Stamping Mold?

    Our lead frame mold is the perfect choice for high-life electronics due to its high precision, durability, and efficiency. With our state-of-the-art technology and top-grade materials, we guarantee the best quality mold for your production needs. Trust TJIN for all your IC lead frame stamping mold requirements and experience the difference in your production process.

    Customization:

    IC Lead Frame Stamping Mold Customization Service for TJIN

    Brand Name: TJIN

    Model Number: 006

    Place of Origin: China

    Certification: ISO9001

    Minimum Order Quantity: 1

    Packaging Details: Wooden Packaging

    Delivery Time: 40 days

    Payment Terms: TT

    Mold Size: Customized

    Hardness: HRC 50-60

    Mold Type: Stamping Mold

    Mold Base: LKM, DME, HASCO, Etc.

    Tolerance: ±0.01mm

    At TJIN, we offer customized services for our IC Lead Frame Stamping Mold to meet the specific needs of our clients. Our Semicon IC Lead Frame Mold is designed with precision and is suitable for various applications in the semiconductor industry. We understand the importance of customization and strive to provide high-quality solutions that meet the unique requirements of our customers.

    Packing and Shipping:

    IC Lead Frame Stamping Mold Packaging and Shipping

    The IC Lead Frame Stamping Mold is carefully packaged to ensure safe delivery to our customers. The mold is first wrapped in protective materials, such as bubble wrap or foam, to prevent any damage during transit. It is then placed in a sturdy cardboard box with additional padding to further protect it.

    The package is labeled with the product name and description, as well as any necessary handling instructions. We also include a packing slip with the customer's order information for easy identification.

    For shipping, we use trusted and reliable shipping carriers to ensure timely and secure delivery. Customers can choose from a variety of shipping options based on their location and preferred delivery speed.

    With our careful packaging and efficient shipping methods, we guarantee that our IC Lead Frame Stamping Mold will arrive at your doorstep in perfect condition.

    FAQ:

    • Q: What is the brand name of this product?
      A: The brand name is TJIN.
    • Q: What is the model number of this product?
      A: The model number is 006.
    • Q: Where is this product made?
      A: This product is made in China.
    • Q: Does this product have any certifications?
      A: Yes, it is certified with ISO9001.
    • Q: What is the minimum order quantity for this product?
      A: The minimum order quantity is 1.
    • Q: How is this product packaged?
      A: It is packaged in wooden packaging.
    • Q: How long is the delivery time for this product?
      A: The delivery time is 40 days.
    • Q: What are the payment terms for this product?
      A: The payment terms are TT (telegraphic transfer).
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