Customized Semiconductor Chip Sorting Machine Auto Discharge Sequence Equipment

Semiconductor Automatic Discharge Sequence Equipment

Advantage

1. Use imported raw materials, use imported advanced equipment manufacturing and detection, high equipment accuracy and stable performance;

2. Customized on demand, advanced technology, strong wear resistance, high service life, and ensuring equipment quality.

3. Advanced equipment, responsible for installing, debugging and training, providing high -quality services permanently, worry -free after -sales.

Customization:

Brand Name: TJIN

Model Number: 005

Place of Origin: China

Certification: ISO9001

Minimum Order Quantity: 1

Packaging Details: Wooden Packaging

Delivery Time: 40 days

Payment Terms: TT

Model: CSM-15

Material: Stainless Steel

Air Pressure: 0.6-0.8MPa

Weight: 500kg

Sorting Size Range: 1mm - 20mm

Key Features:

• IC scheduler for efficient sorting
• Automatic Layup Machine for quick and accurate placement of chips
• High Efficiency with sorting size range of 1mm - 20mm
• Customizable according to specific needs and requirements

Packing and Shipping:

The Chip Sorting Machine will be packaged and shipped in a sturdy cardboard box to ensure safe delivery. The packaging will also include foam padding and bubble wrap to protect the machine from any damage during transit. The box will be clearly labeled with the product name and handling instructions.

Inside the box, you will find the Chip Sorting Machine disassembled into its individual components, along with an instruction manual for easy assembly. Each component will be wrapped in plastic to prevent any scratches or damage during shipping.

The package will also include all necessary tools and accessories required for assembly, such as screws, bolts, and an Allen wrench. These will be packaged separately in a small box to avoid any confusion.

Once the machine is fully assembled, it will be placed in a protective plastic cover and secured with straps to prevent any movement during shipping.

The shipping of the Chip Sorting Machine will be done through a reputable courier service, and a tracking number will be provided to the customer for easy monitoring of the shipment. The estimated delivery time will be communicated to the customer at the time of purchase.

In case of any damage or issues during shipping, please contact our customer service team immediately for assistance. We strive to ensure that our products reach our customers in perfect condition, and we will do our best to resolve any issues that may arise during shipping.

Technical Parameters:

Applications:

The TJIN-005 Chip Sorting Machine is a highly efficient and precise semiconductor automatic laminator designed for the semiconductor industry. It is a type of Automatic Layup Machine and Automatic laminating machine that is used for sorting and organizing chips based on their size and other specifications. The machine is manufactured by TJIN, a leading company in the field of semiconductor equipment, with ISO9001 certification ensuring high-quality standards.

The TJIN-005 Chip Sorting Machine is used in the production process of semiconductors, where thousands of chips need to be sorted and organized in a short period of time. It is an essential equipment in semiconductor factories, helping to increase efficiency and accuracy in the production process. The machine is suitable for sorting chips with a size range of 1mm to 20mm and has a sorting capacity of up to 15,000 chips per hour.

Imagine a semiconductor factory that produces millions of chips every day. To ensure the quality of the chips, they need to be sorted according to their size before they can be used in electronic devices. This is where the TJIN-005 Chip Sorting Machine comes in. In the factory, the chips are first collected and placed into the machine's hopper. The machine then uses air pressure of 0.6-0.8MPa to blow the chips onto the sorting tray. The chips are then sorted based on their size and sent to different trays for packaging.

The sorting process is completed in a matter of minutes, thanks to the high sorting accuracy of 99.9% of the TJIN-005 Chip Sorting Machine. This ensures that only the chips with the desired size are used in the production process, reducing waste and increasing efficiency. The machine also has a power consumption of only 2.5kW, making it energy-efficient and cost-effective for the factory.

The TJIN-005 Chip Sorting Machine comes with wooden packaging to ensure the safety of the machine during transportation. The minimum order quantity is one machine, and the delivery time is 40 days from the date of order. The payment terms are TT, providing a secure and reliable payment method for customers.

In conclusion, the TJIN-005 Chip Sorting Machine is a highly advanced and efficient equipment that plays a crucial role in the production of semiconductors. With its high sorting accuracy, fast sorting speed, and energy efficiency, it is the ideal choice for semiconductor factories looking to improve their production process and increase their output.

Our company is a leading enterprise in China that has long been committed to the R & D, production, manufacturing and sales of the semiconductor's leading frame mold and (integrated circuit IC) the post-process packaging equipment . 

As a professional semiconductor semiconductor package equipment is used in precision processing made by semiconductor equipment corporation，it need semiconductor tooling，spares part，and as well as plastic molding kit. We have advanced production equipment and technical teams that can service according to customer needs.

In terms of foreign trade development, we have rich experience and wide customer network. In the 13 years since the establishment of the company, our products have been successfully exported to more than 50 countries and regions such as Russia, France, Germany, Japan, the United States, Brazil, India, Thailand, Hong Kong, Malaysia, and Saudi Arabia and have received the unanimous praise from global customers.

We make a series of molds required to include the Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold and other semiconductor's post—processes. Whether it is semiconductor separate devices, capacitors, inductors, resistors, bridge circuits, vehicle electrons, etc., or the LED industry, the LED industry's MicroLED & mini-led solid packaging. We not only provide a plan for your newly developed products, but also provide suggestions from the aspects of improving product quality and improving costs for the products that exist in production.

If you are interested it, we can talk in detail and look forward to cooperating with you.