Thermoplastics Semicon Molding Device Semiconductor Processing Equipment 200MPa

Semicon Molding Device

【Features】

● Semiconductor plastic sealing equipment is also known as full-automatic plastic sealing machine, automatic plastic sealing of chips, semiconductor devices and other products.

● Full servo control system, PLC (OMRON) + upper computer;

● WIN10 + 15-inch touch screen + touch keyboard.

● CCD image detection, feeding anti-reverse detection

● Standardized mold structure, convenient replacement;

● High-efficiency cake loading component, aluminum cassette loading;

● Support flexible expansion of up to 4 groups of presses to realize high UPH;

● Equipped with vision system to recognize the feeding direction;

● Automatic cassette loading, double cassette stacked loading;

● Optionally equipped with mold vacuum function, isolation mold function, and detection function after plastic sealing;

● Use of imported raw materials, high precision, stable performance, quality assurance;

● Customized according to needs, no worry after-sales.

Performance Parameters

● Closing pressure: 98-1764kN;

● Injection pressure: 4.9-29.4kN adjustable;

Applicable leadframe/substrate size: 20-90mm wide, 124-300mm long;

● Applicable plastic sealing material size: diameter φ 11-20mm, length 12-35mm;

Technical Parameters:

Applications:

Brand Name: TJIN

Model Number: 001

Place of Origin: China

Certification: ISO9001

Minimum Order Quantity: 1

Packaging Details: Wooden Packaging

Delivery Time: 40 days

Payment Terms: TT

Heating Power: 12 KW

Control System: PLC

Clamping Force: 1000 KN

Max. Mold Height: 400 Mm

Type: Vertical Injection Molding Machine

The Semiconductor Molding Machine from TJIN is a highly efficient and advanced machine designed specifically for the molding of semiconductor materials. It is suitable for use in various industries such as electronics, automotive, and medical.

• Auto Packaging Equipment: The machine comes equipped with auto packaging equipment, making the packaging process quick and efficient.
• High Precision Molding: With a control system that utilizes PLC technology, the machine ensures high precision molding of semiconductor materials, resulting in high-quality products.
• Fast Delivery Time: With a delivery time of only 40 days, customers can receive their orders in a timely manner, reducing downtime and increasing productivity.
• Easy to Use: The machine is designed to be user-friendly, with a simple interface and easy-to-follow instructions, making it easy for operators to use.
• Durable and Reliable: Made with high-quality materials and advanced technology, the machine is built to last and can withstand heavy usage, ensuring long-term reliability.
• Vertical Design: The vertical design of the machine allows for a smaller footprint, making it suitable for use in smaller spaces.
• ISO9001 Certified: The machine is certified by ISO9001, ensuring that it meets international standards of quality and safety.

• Electronics Industry - The Semiconductor Molding Machine is ideal for molding semiconductor materials used in electronic devices such as computers, smartphones, and other gadgets.
• Automotive Industry - The machine can also be used for molding semiconductor components used in cars and other vehicles, ensuring high-quality and precise production.
• Medical Industry - With its high precision molding capabilities, the machine is suitable for molding semiconductor materials used in medical devices such as pacemakers and insulin pumps.

The machine is carefully packaged in wooden packaging to ensure safe transportation. It can be delivered within 40 days after placing the order, making it an ideal choice for customers with urgent production needs.

To place an order for the Semiconductor Molding Machine from TJIN, please contact us with your specific requirements and we will provide you with a competitive quote. The minimum order quantity is 1 machine, and payment can be made via TT.

Experience the precision and efficiency of the TJIN Semiconductor Molding Machine and take your production to the next level. Contact us today!

Customization:

Brand Name: TJIN

Model Number: 001

Place of Origin: China

Certification: ISO9001

Minimum Order Quantity: 1

Packaging Details: Wooden Packaging

Delivery Time: 40 days

Payment Terms: TT

• Auto Transfer Molding
• Auto Packaging Equipment
• Auto Packaging Equipment
• Injection Unit: Single
• Max. Mold Height: 400 Mm
• Screw Diameter: 35 Mm
• Cooling System: Water
• Control System: PLC

Packing and Shipping:

• Each unit is packaged in a sturdy cardboard box to ensure safe transportation.
• The packaging also includes foam inserts to protect the delicate components of the machine.
• For international shipping, the machine will be packed in a wooden crate for extra protection.
• The package will be labeled with the product name, model number, and any necessary handling instructions.
• For domestic shipping, the machine will be shipped via a trusted courier service with tracking information provided.
• International shipping will be arranged through a reputable freight forwarder to ensure timely and secure delivery.

FAQ:

• Q: What is the brand name of this product?
• A: The brand name is TJIN.
• Q: What is the model number of this product?
• A: The model number is 001.
• Q: Where is this product manufactured?
• A: This product is manufactured in China.
• Q: Does this product have any certifications?
• A: Yes, it is certified with ISO9001.
• Q: What is the minimum order quantity for this product?
• A: The minimum order quantity is 1.
• Q: How is this product packaged?
• A: It is packaged in wooden packaging.
• Q: What is the estimated delivery time for this product?
• A: The estimated delivery time is 40 days.
• Q: What are the accepted payment terms for this product?
• A: The accepted payment terms are TT (telegraphic transfer).

Our company is a leading enterprise in China that has long been committed to the R & D, production, manufacturing and sales of the semiconductor's leading frame mold and (integrated circuit IC) the post-process packaging equipment . 

As a professional semiconductor semiconductor package equipment is used in precision processing made by semiconductor equipment corporation，it need semiconductor tooling，spares part，and as well as plastic molding kit. We have advanced production equipment and technical teams that can service according to customer needs.

In terms of foreign trade development, we have rich experience and wide customer network. In the 13 years since the establishment of the company, our products have been successfully exported to more than 50 countries and regions such as Russia, France, Germany, Japan, the United States, Brazil, India, Thailand, Hong Kong, Malaysia, and Saudi Arabia and have received the unanimous praise from global customers.

We make a series of molds required to include the Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold and other semiconductor's post—processes. Whether it is semiconductor separate devices, capacitors, inductors, resistors, bridge circuits, vehicle electrons, etc., or the LED industry, the LED industry's MicroLED & mini-led solid packaging. We not only provide a plan for your newly developed products, but also provide suggestions from the aspects of improving product quality and improving costs for the products that exist in production.

If you are interested it, we can talk in detail and look forward to cooperating with you.