Our company is a leading enterprise in China that has long been
committed to the R & D, production, manufacturing and sales of the
semiconductor's leading frame mold and (integrated circuit IC) the
post-process packaging equipment .
As a professional semiconductor semiconductor package equipment is used in precision processing made by semiconductor equipment
corporation，it need semiconductor tooling，spares part，and as well
as plastic molding kit. We have advanced production equipment
and technical teams that can service according to customer
needs.
In terms of foreign trade development, we have rich experience and
wide customer network. In the 13 years since the establishment of
the company, our products have been successfully exported to more
than 50 countries and regions such as Russia, France, Germany,
Japan, the United States, Brazil, India, Thailand, Hong Kong,
Malaysia, and Saudi Arabia and have received the unanimous praise
from global customers.
We make a series of molds required to include the Auto Molding
system , Trim & Form singulation System ,Lead frame stamp tools,MGP
mold and other semiconductor's post—processes. Whether it is
semiconductor separate devices, capacitors, inductors, resistors,
bridge circuits, vehicle electrons, etc., or the LED industry, the
LED industry's MicroLED & mini-led solid packaging. We not
only provide a plan for your newly developed products, but also
provide suggestions from the aspects of improving product quality
and improving costs for the products that exist in production.
If you are interested it, we can talk in detail and look forward to
cooperating with you.
