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Small Laser Glass Cutting And Spliting Machine With Diving Mask Glass Cut

    Buy cheap Small Laser Glass Cutting And Spliting Machine With Diving Mask Glass Cut from wholesalers
     
    Buy cheap Small Laser Glass Cutting And Spliting Machine With Diving Mask Glass Cut from wholesalers
    • Buy cheap Small Laser Glass Cutting And Spliting Machine With Diving Mask Glass Cut from wholesalers

    Small Laser Glass Cutting And Spliting Machine With Diving Mask Glass Cut

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    Brand Name : CKD
    Model Number : CC-GD9
    Certification : ISO / CE / FDI
    Price : Negotiated
    Payment Terms : L/C, D/A, D/P, T/T
    Supply Ability : 50 Sets Per Month
    Delivery Time : 15-45 days
    • Product Details
    • Company Profile

    Small Laser Glass Cutting And Spliting Machine With Diving Mask Glass Cut

    Specification of the UV Laser cutting machine

    The high-performance , multi-purpose glass laser cutting machine , and non-contract working platform is processed with high speed digital galvanometer and avoid the hidden damage caused by the stress processing of tool and molds; the use of 1064nm infrared picosecond laser with short wavelength , high energy density and small area that heat affected has eliminated the cooling water , cleaning water , cutting and dust accompanied with machanical processing and quickly destroy the molecular structure of the material to achieve cold processing ; it can identify DXF and GERBER files and eliminate molds to achieve rapid prototyping, cutting and drilling , so it is especially suitable for the processing of complex , sophisticated and difficult products ; the processing of mobile phone camera module sub-board , fingerprint identification module cutting , TF card type memory card , FPC flexible circuit board high-speed laser cutting with the cutting thickness of 1mm has no burr with high precision and small range that heat affected ; the control software based independently on the WINDOWS research and development, with all Chinese layout and a key fool operation , is simple and quick .
    Designed with high-rigidity and high-safety structure, it is beautiful, durable and safe .
    According to customer requirements, part of the machine can be customized.
    Machine scope

    Strengthened and non-strengthened glass cutting (mobile phone glass cover , car glass cover , camera glass cover, etc.) , sapphire glass cutting ( mobile phone sapphire cover , camera sapphire glass cover, sapphire light bar ( LED light bar ) , etc.) , LCD glass cutting ( abnormal LCD screen inverted R/U/C angle , LCD screen slitting , etc. ) , other optical glass cutting ( filter cutting, mirror cutting, etc., prisms, etc.)

    *After placing an order, the delivery lead time is usually within 15 working days
    Laser type
    Picosecond Pulsed Laser
    Laser power
    10W-100W
    Laser wavelength
    1060nm
    Pulse frequency
    1Hz-1000kHz
    Cutting speed
    0-300mm/s adjustable
    Cutting thickness
    ≤10mm
    Cutting accuracy
    ≤±20um,The highest accuracy is ±5um
    X/Y stroke
    500x650mm
    Weight
    About 2000KG
    Warranty service
    1 years
    Power supply
    AC220V±5%
    Cooling method
    Water cooling
    Length, width, height
    1568 / 1550 / 1800(mm)
    Cutting thickness schedule
    Laser power
    Frequency
    Cutting thickness
    Cutting speed
    10W
    100K
    ≤0.7mm
    ≤500mm/s
    20W
    100K
    ≤1.5mm
    ≤500mm/s
    30W
    50K
    ≤4.5mm
    ≤300mm/s
    50W
    20K
    ≤19mm
    ≤120mm/s
    80W
    50K
    ≤10mm
    ≤300mm/s

    Application areas:
    This equipment is used for all kinds of glass cutting, smart home display cutting, camera lens laser cutting, coated lens cutting, heterosexual glass laser cutting, LCD screen laser cutting, automobile central control glass cutting, mobile phone glass cover cutting, photovoltaic glass cutting and Glass cutting and drilling, etc., can be widely used in high-precision marking and cutting of glass, drilling and cutting of sapphire, marking/drilling/cutting of ceramics, cutting of LCD/OLED display panels, LED wafer dicing and Cutting and other processing fields. The laser equipment automatically locates and cuts by vision, with high speed and high positioning accuracy. When moving, there is no contact between the stator and the mover, so there is no wear and tear for a long time, and basically no maintenance is required.


    SUBSEQUENT SPLIT PROCESSING
    1 . Non-strengthened glass : CO2 laser can be used to heat along the cutting line, so that the glass will be heated to produce stress and separate the shards / after cutting , it will be strengthened twice to produce stress shards ;
    2 . Tempered glass : After cutting, the self-strengthening stress is released and the splinters are separated automatically ;
    3 . LCD screen glass : mechanical pulling , firing pin split / ultrasonic split ;
    4 . Filter glass : mechanical knife lobes , etc.;
    5 . Camera protection glass : laser cracking or soaking in chemical medicine , etc.
    * Whether the equipment needs a C02 laser splitter , please contact our customer service to confirm !

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