Heat Resistant Black JEDEC Trays for Electronic Parts
The JEDEC was founded in 1958 as part of the Federation of
Electronics Industry Associations (EIA) to set standards for the
emerging semiconductor industry. JEDEC standard mainly includes
terminology, definition, product characteristic description and
operation, test method, production support function and so on.
These standards also avoid the production of marginal standards and
ensure that all standards are formed based on a broad industry
consensus. This also makes it easier for the JEDEC standard to gain
widespread adoption in the marketplace.
The Details of the HN22039 JEDEC Tray
HN22024 trays are molded from industrial raw materials with
specific matrix pockets corresponding to the dimensions of the
customer's electronics. At the same time, the adsorption area is
designed in the middle of the tray cavity, so as to facilitate the
automatic equipment to pick up the installed products. The proper
pocket size not only fits the product perfectly, but also provides
comprehensive protection in different environments.
In addition, the tray material PES has low water absorption,
avoiding the impact of wet environment on customers' products. At
the same time, general electronic products also need to be baked
before assembly to avoid moisture inside the product. This means
that the tray also needs to have good temperature resistance. The
45 degree chamfering design is also easier for equipment to
identify and locate, so as to achieve the effect of automatic use
and reduce labor costs.
| Outline Line Size | 322.6*135.9*12.19mm | Brand | Hiner-pack |
| Model | HN22039 | Package Type | N/A |
| Cavity Size | 7.80*18.35*2.8mm | Matrix QTY | 11*6=66PCS |
| Material | PES | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS SGS |
The Application of the HN22039 Matrix Tray
Electronic Component Power Supply
Optical Industry Military Industry
| Material | Bake Temperature | Surface Resistance |
| PPE | Bake 125°C~Max 150°C | 1.0*10E6Ω~1.0*10E10Ω |
| MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
| IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
| Color, temperature and other special requirements can be customized |
Our Service
1. We have sample stock, also can help the client to choose which
type is suitable for them.
2. We will reply you in any time if you have questions.
3. Choose suitable product for clients according to clients'
requirement.
4. After mold customization, free samples will be provided until
the customer tests OK, so as to remove the mass production quality
concerns of customers before quantity.
FAQ
1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as
possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us
with Skype / Email / Phone / Whats app, in case of any delays.
2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.
3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear
description of the IC or component.Provide one-stop service from
design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one
which is the most convenient or cost effective for you.
5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products
comply with the international JEDEC standards, to ensure 100%
qualified rate.
