3.0W Gray Easy Release Construction Silicone Pads for IT
Infrastructure
The TIF1160-30-02US is not only designed to take advantage of the gap heat transfer, to
fill gaps, complete the heat transfer between heating and cooling
parts, but also played insulation, damping, sealing and so on, to
meet the equipment miniaturization and ultra-thin design
Requirements, which is a highly technology and use, and the
thickness of the wide range of applications, is also an excellent
thermal conductivity filler material.
TIF100-30-02US-Datasheet-REV02.pdf
Features
> Good thermal conductive: 3.0 W/mK
>Thickness:4.0mmT
>hardness:20 shore 00
>Colour: Gray
>Moldability for complex parts
>Soft and compressible for low stress applications
>Naturally tacky needing no further adhesive coating
Applications
>Automotive electronics
>Set top boxes
>Audio and video components
>IT infrastructure
>GPS navigation and other portable devices
>CD-Rom, DVD-Rom cooling
Typical Properties of TIF1160-30-02US Series |
Color | Gray | Visual | Composite Thickness | Thermal Impedance@10psi
(℃-in²/W) |
Construction &
Compostion | Ceramic filled silicone elastomer | *** | 10mils / 0.254 mm | 0.16 |
20mils / 0.508 mm | 0.20 |
Specific gravity | 2.9 g/cc | ASTM D297 | 30mils / 0.762 mm | 0.31 |
40mils / 1.016 mm | 0.36 |
| Thickness | 4.0mmT | *** | 50mils / 1.270 mm | 0.42 |
60mils / 1.524 mm | 0.48 |
Hardness | 20 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 0.53 |
80mils / 2.032 mm | 0.63 |
| Outgasing (TML) | 0.35% | ASTM E595 | 90mils / 2.286 mm | 0.73 |
100mils / 2.540 mm | 0.81 |
Continuos Use Temp | -40 to 160℃ | *** | 110mils / 2.794 mm | 0.86 |
120mils / 3.048 mm | 0.93 |
Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 | 130mils / 3.302mm | 1.00 |
140mils /3.556 mm | 1.08 |
Dielectric Constant | 3.8 MHz | ASTM D150 | 150mils / 3.810 mm | 1.13 |
160mils / 4.064 mm | 1.20 |
Volume Resistivity | 1.0X1012
Ohm-cm | ASTM D257 | 170mils / 4.318 mm | 1.24 |
180mils / 4.572 mm | 1.32 |
Fire rating | 94 V0 | equivalent
UL | 190mils / 4.826 mm | 1.41 |
200mils / 5.080 mm | 1.52 |
Thermal conductivity | 3.0 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Company Profile
With professional R&D capabilities and over 13 year experiences
in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages.
Our goal is to provide quality & competitive products to our
customers worldwide aiming for long-term business cooperation.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
FAQ:
Q:Do big buyers have promotional prices?
A: Yes, if you are a big buyer in a certain area, Ziitek will
provide you with promotional prices, which will help you start your
business here. Buyers with long-term cooperation will have better
prices.
