Resin Bond Dicing Blades
Product overview
Resin bond dicing blades without steel core is mainly used for
precision cutting and slotting for semiconductor, optical glass,
quartz glass,ceramics and so on.
Main features
Sharpness cutting and elastic bond can improve the surface quality.
High precision, less dressing or no need to dress.
Widely used, variety specifications, short delivery time.
Application
ZS001 series is suitable for semiconductor components(KFN,DFN),
which can avoid burrs, and improve efficiency and life.
ZS002 series is suitable for optical glass, which can avoid chip
and improve yield.
ZS003 series is suitable for quartz glass, which can avoid chips
and improve efficiency, and finish of product.
ZS004 series is suitable for ceramics, which can avoid chips and
cracks, and improve the processing quality.
Other series are suitable for slotting and cutting of crystal,
magnetic materials, carbide and some other difficult to cut metal
materials with excellent cutting quality.
