1.5mm Thickness 3.0W/m.K Thermal Conductivity Pad Cooling Gap Filler For High-speed hard drive

Product feature

■ Thermal conductivity: 3.0W/m.K
■ Soft and highly compliant
■ Naturally tacky, easing application
■ Low pressure versus deflection
■ High heat transfer efficiency, low thermal resistance, stable performance
■ Excellent electrical insulation to protect electronic equipment

Typical applications

■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ Industrial: LEDs, Power Supplies and Conversion
■ Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, LCDs, and Graphic Cards

Purchase information:

Shenzhen Aochuan Technology Co., Ltd. was founded in 2004, headquartered in Shenzhen Mission Hills. Aochuan Technology is committed to becoming the world's leading supplier of thermal materials and solutions. The company possesses the ISO9001, ISO14001, IATF16949 quality management system certifications, with all products going through UL, SGS, RoHS certification.

AOK designs, develops and manufactures Thermal Interface Materials for industry leaders around the globe. Our core capabilities allow AOK to provide customers with customized solutions to meet their specific application needs.

Aochuan was founded in 2004. After 18 years, we have set up world class R&D system that made Aochuan leader of Thermal Interface Materials Industry in China.

Global Sales offices in Shenzhen, Heyuan, Taiwan, Toronto Canada North America, Europe
GMP 100,000 class Clean Workshop. over 12,000 m² independent park, 7 automated production lines, more than 5,000 tons annual production capacity

Long term partner : JLR, Commscope, OSRAM, BYD, ZTE, Hikvision, TP-LINK, Dahua, Delta, Foxconn ect.