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2.5 KN/M 1W/m.K Ultra Soft Thermal Pad Heat Conductivity For Telecommunications

    Buy cheap 2.5 KN/M 1W/m.K Ultra Soft Thermal Pad Heat Conductivity For Telecommunications from wholesalers
     
    Buy cheap 2.5 KN/M 1W/m.K Ultra Soft Thermal Pad Heat Conductivity For Telecommunications from wholesalers
    • Buy cheap 2.5 KN/M 1W/m.K Ultra Soft Thermal Pad Heat Conductivity For Telecommunications from wholesalers
    • Buy cheap 2.5 KN/M 1W/m.K Ultra Soft Thermal Pad Heat Conductivity For Telecommunications from wholesalers

    2.5 KN/M 1W/m.K Ultra Soft Thermal Pad Heat Conductivity For Telecommunications

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    Brand Name : AOK
    Model Number : UTP100
    Certification : RoHS, Reach, UL
    Payment Terms : T/T
    Delivery Time : 13-15 working days
    • Product Details
    • Company Profile

    2.5 KN/M 1W/m.K Ultra Soft Thermal Pad Heat Conductivity For Telecommunications

    Ultra Soft Thermal Pad High Temperature Resist Adhesive with 1 W/m.K thermal conductivity

    AttributeValueTest Method
    CompositionCeramic Filler, Silicone, and Reinforced Fiberglass-
    ColorWhite and Brick RedVisual
    Thickness(mm)0.5~12.0ASTM D374
    Density(g/cc)2.5ASTM D792
    Hardness(shore oo)30±5ASTM D2240
    Tensile Strength(KN/m)2.5ASTM D624
    Elongation(%)60ASTM D412
    Usage Temperature(℃)-40~150--
    Electrical
    Breakdown Voltage(kv/mm)≥7.0ASTM D149
    Dielectric Constant(@10mhz)5.7ASTM D150
    Volume Resistivity(Ω.cm)1.0*1013ASTM D257
    FlammabilityV-0UL94
    Thermal
    Thermal conductivity(W/m.K)1.0±0.1ASTM D5470

    Product feature:
    ■ Thermal Conductivity:1.0 W/mK
    ■ Ultra soft and highly compliant
    the material is soft, good compression performance, good thermal insulation performance, adjustable thickness range is relatively large, suitable for filling the cavity, both sides have natural viscosity, operability and maintainability;
    ■ High cut through resistance
    ■ High breakdown voltage
    thermal silicone sheet on the structure of the process difference bridge, reduce the process difference requirements of the radiator and heat dissipation structure;
    ■ Elongation 60%


    Typical applications:
    ■ Networking and Telecommunications
    ■ IT: Notebooks, Tablets, Power Conversion
    ■ IT: Industrial: LEDs, Power Supplies and Conversion
    ■ IT: Automotive: Control Modules, Turbo Actuators
    ■ Consumer Electronics: Gaming Systems, and LCDs


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