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Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler

    Buy cheap Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler from wholesalers
     
    Buy cheap Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler from wholesalers
    • Buy cheap Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler from wholesalers
    • Buy cheap Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler from wholesalers

    Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler

    Ask Lasest Price
    Brand Name : AOK
    Model Number : TF300
    Certification : RoHS, Reach, UL
    Payment Terms : T/T
    Delivery Time : 13-15 working days
    • Product Details
    • Company Profile

    Heatproof Multiscene 2 Part Gap Filler, Anti Seismic Thermally Conductive Filler

    Two Part Thermal Gel Materials Liquid Gap Fillers With Light Blue For Control Modules


    AttributeValueTest Method
    CompositionCeramic filler + Silicone-
    Color/Component AWhiteVisual
    Color/Component BLight BuleVisual
    Density(g/cc)3ASTM D792
    Usage Temperature(℃)-40~150--
    Electrical
    Breakdown Voltage(kv/mm)≥7.0ASTM D149
    Dielectric Constant(@10mhz)7.3ASTM D150
    Volume Resistivity(Ω.cm)1.0*1013ASTM D257
    FlammabilityV-0UL94
    Thermal
    Thermal conductivity(W/m.K)3.0ASTM D5470
    Viscosity/Component A (cps)400000ASTM D2196
    Viscosity/Component B (cps)400000ASTM D2196
    Hradness,after cure(shore OO)40ASTM D22240

    Product feature
    ■ Thermal conductivity: 1.5,2.0,3.0,3.5W/m.K
    ■ Room temperature cure
    ■ Highly compliant
    ■ Low pressure vs. deflection
    ■ High volume applications


    Features & Benefits

    1 High thermal conductivity, low thermal resistance, excellent wettability
    2 Low pressure to electronic components
    3 Manageable raw material stock ,lower composite cost
    4 For vehicle electronic products
    5 Can fill any uneven gaps
    6 Automatic point dispensing available, any thickness or size available
    7 High reliability, thermal conductive gel is equal to thermal conductive silicon pad after curing, no volatility.


    Typical Applications

    1 Communication equipment
    2 Power equipment
    3 Medical instrument
    4 New energy vehicle
    5 Filling any gap between friable component and shell


    Purchase information
    Packing specification: 50ml(25ml each part) / 400ml(200ml each part)/20kg (10kg each part)


    Directions for use
    • Working hours @ 25
    C : 1 hour
    • Dry to touch @ 25
    C : 1 hour
    • Full cure @ 25
    C : 12-16 hours
    • Full cure @ 100
    C : 1 hour


    Storage & Shelf life
    Store in a cool, dry, well ventilated place. Shelf life of the product is 6 months after date of shipment.


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