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Pick And Place Smt Pcba Process Ems Components Assembly Printed Circuit Board Soldering

    Buy cheap Pick And Place Smt Pcba Process Ems Components Assembly Printed Circuit Board Soldering from wholesalers
     
    Buy cheap Pick And Place Smt Pcba Process Ems Components Assembly Printed Circuit Board Soldering from wholesalers
    • Buy cheap Pick And Place Smt Pcba Process Ems Components Assembly Printed Circuit Board Soldering from wholesalers
    • Buy cheap Pick And Place Smt Pcba Process Ems Components Assembly Printed Circuit Board Soldering from wholesalers
    • Buy cheap Pick And Place Smt Pcba Process Ems Components Assembly Printed Circuit Board Soldering from wholesalers

    Pick And Place Smt Pcba Process Ems Components Assembly Printed Circuit Board Soldering

    Ask Lasest Price
    Brand Name : YDY
    Model Number : M-016
    Certification : ISO13485, IATF16949, ISO9001,IOS14001
    Price : Negotiable
    Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram
    Supply Ability : 50000pcs/month
    Delivery Time : 1-20 working days
    • Product Details
    • Company Profile

    Pick And Place Smt Pcba Process Ems Components Assembly Printed Circuit Board Soldering

    SMT PCBA Surface Mount Circuit Board Assemblies Dynamic Flex Board​


    Shenzhen Yideyi Technology Co., Ltd is a professional PCBA solution provider,specilizes in PCB production,components procurement,PCBA assembly and a series service of customized flexible LED strips.


    Our products are widely used in meter, medical, solar energy, mobile, communication, industrial control, power electronics,security, consuming, computer, automotive, aerospace, military and so on. Over 75% of our products are exported to Europe, North America, Japan and other Asia Pacific countries. Based on many years of development, we have high-qualified management team, experienced R&D team and skilled employees,and possess advantaged supply chain, commitment to quality,and dedication to our customers service. Encouraging innovation and keeping improving. Besides achieving corporate and customer values, we also create a favorable atmosphere for employees to achieve personal values.


    Our goal is to be the leading PCB solutions provider in the electronics industry with first-class products and services.


    SMT PCBA capabilities:


    • SMT assembly including BGA assembly

    • Accepted SMD chips: 01005,BGA,QFP,QFN,TSOP

    • Component height: 0.2-25mm

    • Min packing: 0201

    • Min distance among BGA : 0.25-2.0mm

    • Min BGA size: 0.1-0.63mm

    • Min QFP space: 0.35mm

    • Min assembly size: (X*Y): 50*30mm

    • Max assembly size: (X*Y): 350*550mm

    • Pick-placement precision: ±0.01mm

    • Placement capability: 0805, 0603, 0402, 0201

    • High pin count press fit available

    • SMT capacity per day: 800,000 point


    Advantages:


    • Strict product liability, taking IPC-A-160 standard

    • Engineering pretreatment before production

    • Production process control (5Ms)

    • 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC

    • 100% AOI inspection, including X-ray, 3D microscope and ICT

    • High-voltage test, impedance control test

    • Micro section, soldering capacity, thermal stress test, shocking test

    • In-house PCB production

    • No minimum order quantity and free sample

    • Focus on low to medium volume production

    • Quick and on-time delivery


    Each board is carefully examined by our dedicated inspection team using AOI and high magnification viewers.

    Using our X-Ray machine, we test PCBs to component level and all wiring is fully inspected and tested. Flash

    testing and earth bonding tests can also be undertaken where required.


    PCB Assembly Manufacturing Procedures:

    Program Management


    PCB Files → DCC → Program Organizing → Optimization → Checking


    SMT Management

    PCB Loader → Screen Printer → Checking → SMD Placement → Checking → Air Reflow → Vision Inspection → AOI → Keeping


    PCBA Management

    THT→Soldering Wave (Manual Welding) → Vision Inspection → ICT → Flash → FCT → Checking → Package → Shipment


    Technical Requirement for PCB Assembly:


    Professional Surface-mounting and Through-hole soldering Technology

    Various sizes like 1206,0805,0603,0402,0201 components SMT technology

    ICT(In Circuit Test),FCT(Functional Circuit Test) technology.

    PCB Assembly With UL,CE,FCC,Rohs Approval

    Nitrogen gas reflow soldering technology for SMT.

    High Standard SMT&Solder Assembly Line

    High density interconnected board placement technology capacity.


    DIP capability:


    • A-8 of semi-assembly work line with 3 set wave soldering machines

    • B-4 of high/low-temperature burn-in test ovens for the burn-in tested required products

    • All products are 100% inspected and tested during the DIP process


    All our products follow IPC class and are approved by UL, RoHS and ISO9001. Also our executives and technicians are experienced people who have been engaged in PCB industry for more than twenty years so we have rich production management experience and professional PCB skills. We ensure the quality of PCB products by continuously introducing new equipment′s and new technologies and using high quality materials. With professional technicians we can provide early design consultation and technical support, so that customers can be more worry-free. With qualified and reliable products, advanced technology and value-added service, we won the trusts and supports of customers and established a good reputation in the industry.



    SMT PCBA Manufacture Capacity


    ProcessItemMass production capability
    SMTPrintingMax PCB weight8kg
    Solder paste printing tolerance±25μm(6σ)
    System repeat calibration tolerance±10μm(6σ)
    Scraper pressure detectionpressure closed-loop control system
    SPIDetect Min BGA PAD to PAD distance100μm
    x-axis and Y-axis tolerance0.5μm
    False Rate≤0.1%
    MountComponent size0.3*0.15 mm²--200*125 mm²
    Component max height25.4mm
    Populate Max component weight100g
    BGA/CSP Min PAD spacing, and Min PAD diameter0.30mm,0.15mm
    Populate tolerance±22μm(3σ),±0.05°(3σ)
    PCB board size50*50 mm²-850*560 mm²
    PCB thickness0.3mm--6mm
    Max PCB weight6kg
    Populate Max components type500
    AOIDetect Min components01005
    Detect false typeIncorrect conponents,missing components,opposite direction,,component shift,Tombstone,Mounting on side,unsoldering,insufficient solder,Lead raised,Solder ball
    Foot warping detection3D Detection function
    ReflowTemperature Accuracy±1ºC
    Welding protectionnitrogen protection;(remaining oxygen<3000ppm)
    Nitrogen ControlNitrogen closed-loop control system,±200ppm
    3D X-RayMagnificationGeometric Magnification;:2000 times;System Magnification:12000times
    Resolution1μm /nm
    Rotation Angle &Slanting PerspectiveAny ±45°+360°rotation
    DIPPreelaborationAutomatic forming technologyComponent Automatic forming
    DIPDIP technologyAutomatic Insertion machine
    Wave solderingWave soldering typeOrdinary wave soldering
    Inclination angle of transport guide rail4--7°
    Temperature accuracy±3ºC
    Soldering protectionnitrogen protection
    Non-welding pressure contact technologyMax PCB board size800*600mm²
    Press down height accuracy±0.02mm
    Pressure Range0-50KN
    Pressure AccuracyStandard value:±2%
    Hold time0-9.999S
    Conformal coating technologyMax PCB board size500*475*6mm
    Max PCB board weight5kg
    Min Nozzle size2mm
    Other characteristicConformal coating pressure Programmable control
    ICT testtest levelDevice level test,Test hardware connection status.
    Test point>4096
    Test contentContact test ,Open/short test,Resistance capacitance test test,diode, triode,mosfet test,No power on hybrid test,Boundary scan chain test,Power on mixed mode test.
    Assembly and testProduction typeTouchPadMass production
    TWSMass production
    Baby CameraMass production
    Gaming controllerMass production
    Life WatchMass production
    FT testtest levelPCB board system level test.Test System function status.
    Temperature cycling testTemperature range-60ºC--125ºC
    Rise/lower temperature rate>10ºC/min
    Temperature tolerance≤2ºC



    We are devoted to be a trusted partner of our customers.



    Package &Shipping Methods:


    1. Vacuum package with silica gel, Carton box with packing belt.

    2. By DHL, UPS, FedEx, TNT

    3. By EMS

    4. By sea for mass quantity according to customer's requirement


    FAQ:


    Q1. How to keep our product information and design file secret ?
    We are willing to sign a NDA effect by customers side local law and promising to keep customers data in high confidential level.


    Q2. What file formats do you accept for production?

    Gerber file: CAM350 RS274X

    PCB file: Protel 99SE, P-CAD 2001 PCB

    BOM: Excel (PDF,word,txt)


    Q3. Please note that the following detail will speed up evaluation:
    Material:
    Board thickness:
    Copper thickness:Surface finish:
    Solder mask color:
    Silkscreen color:


    Q4. How to make sure the PCBAs are completely well recieved?
    We will pack with aluminum bag, and insert card, up and bottom card with stable cartons.

    Q5. How to ship the PCBAs?
    For small packages, we will ship the boards to you by DHL,UPS,FEDEX,TNT. Door to door service! For mass production, we could ship by air, by sea.


    Q6. How to make sure the function is fine?
    We could make sample/prototype and do functional testing before mass production.


    Q7. What Trade Terms do you accept?

    Payment: T/T in advance (Western Union , paypal is welcomed)


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