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Heat Sink Package Tungsten Copper Alloy Polished Grinding

    Buy cheap Heat Sink Package Tungsten Copper Alloy Polished Grinding from wholesalers
     
    Buy cheap Heat Sink Package Tungsten Copper Alloy Polished Grinding from wholesalers
    • Buy cheap Heat Sink Package Tungsten Copper Alloy Polished Grinding from wholesalers
    • Buy cheap Heat Sink Package Tungsten Copper Alloy Polished Grinding from wholesalers

    Heat Sink Package Tungsten Copper Alloy Polished Grinding

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    Brand Name : JINXING
    Model Number : Copper Tungsten / WCu alloy
    Certification : ISO 9001
    Price :
    Payment Terms : L/C, D/A, D/P, T/T, Western Union
    Supply Ability : 10000kgs/M
    Delivery Time : 10~25 work days
    • Product Details
    • Company Profile

    Heat Sink Package Tungsten Copper Alloy Polished Grinding

    Tungsten Copper Heat Sink Package Sheet,Tungsten Copper Shim,Tungsten Copper Sheet

    Product Introduction:

    W-Cu heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape, these features make the application of this composite with great convenience

    Tungsten Copper Heat Sink Package Sheet Advantages

    · High thermal conductivity

    · Excellent hermeticity

    · Excellent flatness, surface finish, and size control

    · Semi-finished or finished (Ni/Au plated) products available

    Tungsten Copper Heat Sink Package Sheet are used to conduct heat away from computer chips and integrated circuits, preventing thermal damage. Depending on the electronic device, heat sinks come in different sizes and shapes. Tungsten-copper composites, with copper content (by weight) of 15 to 20 percent, are often used to make heat sinks. Our products are widely used in applications such as optoelectronics packages, Microwave Packages, C Packages, Laser Submounts, etc.

    hysical Properties of Major Products

    MarkWt%(W)Wt%(Cu)Density
    at 20ºC
    Thermal conductivity at 25ºCCoefficient of thermal expansion at 20ºC
    W90Cu1090±1rest17.0g/cm3180-1906.5
    W85Cu1585±1rest16.4g/cm3190-2007.0
    W80Cu2080±1rest15.6g/cm3200-2108.3
    W75Cu2575±1rest14.9g/cm3220-2309.0
    W50Cu5050±1rest12.2g/cm3310-34012.5

    Tungsten Copper Heat Sink Package Sheet Picture


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