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Through hole Stencil For PCB Assembly Electro Polishing Solder Paste Stencil

    Buy cheap Through hole Stencil For PCB Assembly Electro Polishing Solder Paste Stencil from wholesalers
     
    Buy cheap Through hole Stencil For PCB Assembly Electro Polishing Solder Paste Stencil from wholesalers
    • Buy cheap Through hole Stencil For PCB Assembly Electro Polishing Solder Paste Stencil from wholesalers
    • Buy cheap Through hole Stencil For PCB Assembly Electro Polishing Solder Paste Stencil from wholesalers
    • Buy cheap Through hole Stencil For PCB Assembly Electro Polishing Solder Paste Stencil from wholesalers
    • Buy cheap Through hole Stencil For PCB Assembly Electro Polishing Solder Paste Stencil from wholesalers
    • Buy cheap Through hole Stencil For PCB Assembly Electro Polishing Solder Paste Stencil from wholesalers
    • Buy cheap Through hole Stencil For PCB Assembly Electro Polishing Solder Paste Stencil from wholesalers
    • Buy cheap Through hole Stencil For PCB Assembly Electro Polishing Solder Paste Stencil from wholesalers

    Through hole Stencil For PCB Assembly Electro Polishing Solder Paste Stencil

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    Brand Name : Bicheng
    Model Number : BIC-957.V1.0
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
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    Through hole Stencil For PCB Assembly Electro Polishing Solder Paste Stencil


    SMT Stencil For PCB Assembly Solder Paste Laser Profile
    1.1 General description
    This is a type of solder paste SMT stencil (100% laser cut) built on 0.1mm stainless steel foil with aluminum frame 420 mm x 520 mm x 20mm dimension. It’s fabricated per IPC 7525A using supplied Gerber data, squeegee area locating in the center. Fiducal marks are through holes to suit for the SMT machine. It’s packed with KK carton (hard card) and usually 2 stencils are packed for shipment.
    1.2 Features and benifits
    The data file is used directly to produce and reduce the error rate;
    The opening position accuracy of SMT template is very high: the whole process error is ≤ ±4 μ m;
    The opening of SMT template has geometric figure, which is advantageous to the printing and forming of tin paste;
    Engineering design prevents problems from occurring in pre production;
    Money-saving, Worry-saving and Labor-saving;
    Door to door shipment service;
    More than 9000 types per month;
    No minimum order quantity. 1 piece is available;
    1.3 Application
    SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip.
    1.4 Parameter and data sheet
    Dimension:370mm x 470mm, 420mm x 520mm, 550mm x 650mm
    StructureStencil foils with aluminum frame
    Base materialStainless steel shim
    Foil Thickness0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm
    Aperture configuredLaser cut
    AppearanceEngraving and electro polishing
    Fiducial markThrough hole
    Service area:Worldwide
    Quantity of open pads:1533
    Advantages:a) High precision dimension; b) Good shape on the window; c) Hole wall is smoother.
    Application:CSP, BGA, 0.5mm QFP etc. package
    1.5 Opening Holes Designs for SMT Stencil
    Component TypePitchSoldering WidthSoldering LengthOpening WidthOpening LengthShim Thickness
    PLCC1.27mm0.65mm2.00mm0.60mm1.95mm0.15-0.25mm
    QFP0.635mm0.35mm1.50mm0.32mm1.45mm0.15-0.18mm
    QFP0.50mm0.254-0.33mm1.25mm0.22-0.25mm1.20mm0.12-0.15mm
    QFP0.40mm0.25mm1.25mm0.20mm1.20mm0.10-0.12mm
    QFP0.30mm0.20mm1.00mm0.15mm0.95mm0.07-0.12mm
    04020.50mm0.65mm0.45mm0.60mm0.12-0.15mm
    02010.25mm0.40mm0.23mm0.35mm0.07-0.12mm
    BGA1.27mm0.80mm0.75mm0.75mm0.15-0.20mm
    BGA1.00mm0.38mm0.35mm0.35mm0.10-0.12mm
    BGA0.50mm0.30mm0.28mm0.28mm0.07-0.12mm
    Flip Chip0.25mm0.12mm0.12mm0.12mm0.12mm0.08-0.10mm
    Flip Chip0.20mm0.10mm0.10mm0.10mm0.10mm0.05-0.10mm

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