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UL Laser Cut Solder Paste Stencils 0.1mm Circuit Board Stencil

    Buy cheap UL Laser Cut Solder Paste Stencils 0.1mm Circuit Board Stencil from wholesalers
     
    Buy cheap UL Laser Cut Solder Paste Stencils 0.1mm Circuit Board Stencil from wholesalers
    • Buy cheap UL Laser Cut Solder Paste Stencils 0.1mm Circuit Board Stencil from wholesalers
    • Buy cheap UL Laser Cut Solder Paste Stencils 0.1mm Circuit Board Stencil from wholesalers
    • Buy cheap UL Laser Cut Solder Paste Stencils 0.1mm Circuit Board Stencil from wholesalers
    • Buy cheap UL Laser Cut Solder Paste Stencils 0.1mm Circuit Board Stencil from wholesalers
    • Buy cheap UL Laser Cut Solder Paste Stencils 0.1mm Circuit Board Stencil from wholesalers
    • Buy cheap UL Laser Cut Solder Paste Stencils 0.1mm Circuit Board Stencil from wholesalers

    UL Laser Cut Solder Paste Stencils 0.1mm Circuit Board Stencil

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    Brand Name : Bicheng
    Model Number : BIC-956.V1.0
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
    • Company Profile

    UL Laser Cut Solder Paste Stencils 0.1mm Circuit Board Stencil


    SMT PCB Assembly Solder Paste Stencil | PCB Stencil Laser Cut
    1.1 General description
    This is a type of solder paste SMT stencil (100% laser cut) built on 0.1mm stainless steel foil with aluminum frame 420 mm x 520 mm x 20mm dimension. It’s fabricated per IPC 7525A using supplied Gerber data, squeegee area locating in the center. Fiducal marks are through holes to suit for the SMT machine. It’s packed with KK carton (hard card) and usually 2 stencils are packed for shipment.
    1.2 Features and benifits
    The data file is used directly to produce and reduce the error rate;
    The opening position accuracy of SMT template is very high: the whole process error is ≤ ±4 μ m;
    The opening of SMT template has geometric figure, which is advantageous to the printing and forming of tin paste;
    Engineering design prevents problems from occurring in pre production;
    Team with passion, discipline, responsibility and honesty;
    Door to door shipment service;
    More than 15 years of experience;
    Hassle-free, one-to-one after-sales service;
    1.3 Applications
    SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip.
    1.4 Parameter and data sheet
    Dimension:370mm x 470mm, 420mm x 520mm, 550mm x 650mm
    StructureStencil foils with aluminum frame
    Base materialStainless steel shim
    Foil Thickness0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm
    Aperture configuredLaser cut
    AppearanceEngraving and electro polishing
    Fiducial markThrough hole
    Service area:Worldwide
    Quantity of open pads:1421
    Advantages:a) High precision dimension; b) Good shape on the window; c) Hole wall is smoother.
    Application:CSP, BGA, 0.5mm QFP etc. package
    1.5 Opening Holes Design for SMT Stencil
    Component TypePitchSoldering WidthSoldering LengthOpening WidthOpening LengthShim Thickness
    PLCC1.27mm0.65mm2.00mm0.60mm1.95mm0.15-0.25mm
    QFP0.635mm0.35mm1.50mm0.32mm1.45mm0.15-0.18mm
    QFP0.50mm0.254-0.33mm1.25mm0.22-0.25mm1.20mm0.12-0.15mm
    QFP0.40mm0.25mm1.25mm0.20mm1.20mm0.10-0.12mm
    QFP0.30mm0.20mm1.00mm0.15mm0.95mm0.07-0.12mm
    04020.50mm0.65mm0.45mm0.60mm0.12-0.15mm
    02010.25mm0.40mm0.23mm0.35mm0.07-0.12mm
    BGA1.27mm0.80mm0.75mm0.75mm0.15-0.20mm
    BGA1.00mm0.38mm0.35mm0.35mm0.10-0.12mm
    BGA0.50mm0.30mm0.28mm0.28mm0.07-0.12mm
    Flip Chip0.25mm0.12mm0.12mm0.12mm0.12mm0.08-0.10mm
    Flip Chip0.20mm0.10mm0.10mm0.10mm0.10mm0.05-0.10mm

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