PCB Solder Paste Stencil SMT Assembly Laser Cut Stencil
1.1 General description
This is a type of solder paste SMT stencil (100% laser cut) built
on 0.1mm stainless steel foil with aluminum frame 420 mm x 520 mm x
20mm dimension. It’s fabricated per IPC 7525A using supplied Gerber
data, squeegee area locating in the center. Fiducal marks are
half-etch dented suit for the SMT machine. It’s packed with KK
carton (hard card) and usually 2 stencils are packed for shipment.
1.2 Features and benifits
The data file is used directly to produce and reduce the error
rate;
The opening position accuracy of SMT template is very high: the
whole process error is ≤ ±4 μ m;
The opening of SMT template has geometric figure, which is
advantageous to the printing and forming of tin paste;
Focus on low to medium volume production;
Quick turnaround prototype;
Door to door shipment service;
Competitive price;
On-time service;
More than 15 years of experience;
1.3 Applications
SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip.
1.4 Parameter and data sheet
| Dimension: | 370mm x 470mm, 420mm x 520mm, 550mm x 650mm |
| Structure | Stencil foils with aluminum frame |
| Base material | Stainless steel shim |
| Foil Thickness | 0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm |
| Aperture configured | Laser cut |
| Appearance | Engraving and electro polishing |
| Fiducial mark | Through hole |
| Service area: | Worldwide |
| Quantity of open pads: | 1152 |
| Advantages: | a) High precision dimension; b) Good shape on the window; c) Hole
wall is smoother. |
| Application: | CSP, BGA, 0.5mm QFP etc. package |
1.5 Opening Holes Design for SMT Stencil
