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8KW CCD Automatic Align Semiconductor Wafer Cutting Machine

    Buy cheap 8KW CCD Automatic Align Semiconductor Wafer Cutting Machine from wholesalers
     
    Buy cheap 8KW CCD Automatic Align Semiconductor Wafer Cutting Machine from wholesalers
    • Buy cheap 8KW CCD Automatic Align Semiconductor Wafer Cutting Machine from wholesalers

    8KW CCD Automatic Align Semiconductor Wafer Cutting Machine

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    Brand Name : YUSHUNLI
    Model Number : ADS2000
    Certification : CE
    Price : USD1000~10000
    Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram
    Supply Ability : 60Sets/Month
    Delivery Time : 5-7work days
    • Product Details
    • Company Profile

    8KW CCD Automatic Align Semiconductor Wafer Cutting Machine

    Automatic Semiconductor Wafer Cutting Machine For PCB, IR Filter, Sapphire Glass And Ceramic
    Features of products
    • Using touching LCD to operate. The interface design is simple and easy. Provide a variety of languages such as Chinese,English, Korean, etc.
    • Feeding, position align, cutting, cleaning / drying and unloading all automatically completed.
    • Can meet the high precision cutting maximum diameter of 300 mm materials.
    • Double spindle cutting simultaneously, more than 85% higher than that of single spindle cutting capacity.
    • CCD automatic align.
    • Real-time monitoring system of the pressure, water pressure, current, etc., to avoid damage to the air spindle.
    • Dicing spindle: 2.4 kw × 2set (Max: 60,000 rpm)
    • Repeat positioning accuracy : 0.001mm
    • Cutting speed: 0.05 ~ 400 mm/sec
    • Each magazine can be stored 20 ~ 30 layers of frame.
    • Standard collocation of using blade size: 2 Inch(Max:3 Inch)
    Specs:
    x-axis
    Working stroke
    500mm
    cutting speed
    0.05 ~ 400mm/sec
    resolution
    0.0001mm
    y-axis
    Working stroke
    650mm
    resolution
    0.0001mm
    Repeat positioning accuracy
    0.001 / 310mm
    z-axis
    Working stroke
    60 (2 Inch blades)mm
    resolution
    0.0001m
    Θ-axis
    Angle of rotation
    360deg

    Dimensions of processing
    Φ300mm
    Dimensions of working platform
    Φ350
    power
    2.4×2 set KW
    speed
    5,000 ~ 60,000 rpm
    power supply
    3P , 220 (50 ~ 60 Hz) V
    machine power
    8KW
    Power air pressure
    0.6 ~ 0.68MPa
    Air consumption
    250L/min
    Cutting water consumption
    6.5L/min
    cooling water consumption
    2.5L/min
    (W×D×H) physical dimension
    1262×1704×2023
    machine net weight
    1000KG

    Process description
    1.Mechanism remove it from magazine,and send it to the temporary table.
    2.Unloading robot will move the dicing material to chunk. for dicing process.
    3.Feeding robot move the dicing material to the cleaning platform for cleaning and drying process.
    4.Unloading robot send material having been cleaned and dried to the temporary table.
    5.Robot send the dicing material to the magazine .
    Optional equipment
    1,Function of blade damage detection;
    2,Automatic setting function;
    3,Dicing visual function;
    4, Using dicing blade with 3 Inch.
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