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2.4KW 60000rpm Wafer Cutting Machine For PCB

    Buy cheap 2.4KW 60000rpm Wafer Cutting Machine For PCB from wholesalers
     
    Buy cheap 2.4KW 60000rpm Wafer Cutting Machine For PCB from wholesalers
    • Buy cheap 2.4KW 60000rpm Wafer Cutting Machine For PCB from wholesalers

    2.4KW 60000rpm Wafer Cutting Machine For PCB

    Ask Lasest Price
    Brand Name : YUSHUNLI
    Model Number : SDS1000
    Certification : CE
    Price : USD1000~40000
    Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram
    Supply Ability : 200Sets/Month
    Delivery Time : 5-7work days
    • Product Details
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    2.4KW 60000rpm Wafer Cutting Machine For PCB

    2.4 KW Semiconductor Wafer Cutting Machine For PCB, IR Filter, Sapphire Glass And Ceramic
    Features of products
    • Using touching LCD to operate. The interface design is simple and easy. Provide a variety of languages such as Chinese, English, Korean, etc.
    • Can meet the high precision cutting maximum diameter of 300 mm materials.
    • High rigidity structure design is adopted to ensure high precision and high stability of cutting process.
    •Cutting spindle: 2.4 kw × 1set (Max: 60,000 rpm)
    •Repeat positioning accuracy : 0.001mm
    •Cutting speed: 0.05 ~ 400 mm/sec
    •Standard collocation of using blade size:2 Inch (Max:3 Inch)
    • CCD automatic align.
    • Real-time monitoring system of air pressure, water pressure,current, etc., to avoid damage to the air spindle.
    x-axis
    Working stroke
    340MM
    cutting speed
    0.05 ~ 400mm/sec

    resolution

    0.0001MM

    y-axis
    Working stroke
    310MM
    resolution
    0.0001MM
    Repeat positioning accuracy
    0.001 / 310MM

    z-axis
    Working stroke
    60 (2 InchBlade)mm
    resolution
    0.0001mm

    Θ-axis
    Angle of rotation
    360deg
    Specifications:
    Dimensions of processing
    Φ300mm
    Dimensions of working platform
    Φ350mm
    power
    2.4KW
    speed
    5,000 ~ 60,000 rpm
    power supply
    3P , 220 (50 ~ 60 Hz)v
    Power air pressure
    0.5 ~ 0.6 MPa
    Air consumption
    200L/min
    Cutting water consumption
    4.0L/min
    cooling water consumption
    1.5L/min
    (W×D×H) physical dimension
    1040×1080×1750mm
    machine net weight
    850KG

    Features of products

    • Using touching LCD to operate. The interface design is simple and easy. Provide a variety of languages such as Chinese,English, Korean, etc.
    • Feeding, position align, cutting, cleaning / drying and unloading all automatically completed
    • Can meet the high precision cutting maximum diameter of 300 mm materials.
    • Double spindle cutting simultaneously, more than 85% higher than that of single spindle cutting capacity.
    Quality 2.4KW 60000rpm Wafer Cutting Machine For PCB for sale
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