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Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper

    Buy cheap Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper from wholesalers
     
    Buy cheap Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper from wholesalers
    • Buy cheap Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper from wholesalers
    • Buy cheap Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper from wholesalers
    • Buy cheap Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper from wholesalers
    • Buy cheap Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper from wholesalers
    • Buy cheap Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper from wholesalers
    • Buy cheap Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper from wholesalers
    • Buy cheap Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper from wholesalers
    • Buy cheap Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper from wholesalers
    • Buy cheap Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper from wholesalers

    Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper

    Ask Lasest Price
    Brand Name : Bicheng
    Model Number : BIC-266.V1.0
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
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    Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper

    Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper

    (Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)


    General description

    This type of flexible circuit is for the application of AC power systems. It’s a 2 layer polyimide FPC at 0.3mm thick with 2 oz copper. The base laminate is from Shengyi.On head of its back is 0.1mm FR-4 stiffener. It’s fabricated per IPC 6012 Class 2 using supplied Gerber data. FR-4 as stiffener is applied on the back side.


    Parameter and data sheet

    Size of Flexible PCB130.66 X 40.67mm
    Number of Layers2
    Board TypeFlexible PCB
    Board Thickness0.30mm
    Board MaterialPolyimide 50µm
    Board Material SupplierITEQ
    Tg Value of Board Material60℃
    PTH Cu thickness≥20 µm
    Inner Iayer Cu thicknesN/A
    Surface Cu thickness70 µm
    Coverlay ColourYellow
    Number of Coverlay2
    Thickness of Coverlay25 µm
    Stiffener MaterialFR-4
    Stiffener Thickness0.2mm
    Type of Silkscreen InkIJR-4000 MW300
    Supplier of SilkscreenTAIYO
    Color of SilkscreenWhite
    Number of Silkscreen1
    Peeling test of CoverlayNo peelable
    Legend Adhesion3M 90℃ No peeling after Min. 3 times test
    Surface FinishImmersion Gold
    Thickness of Nickle/GoldAu: 0.03µm(Min.); Ni 2-4µm
    RoHS RequiredYes
    Famability94-V0
    Thermal Shock TestPass, -25℃±125℃, 1000 cycles.
    Thermal StressPass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.
    Function100% Pass electrical test
    WorkmanshipCompliance with IPC-A-600H & IPC-6013C Class 2


    Features and benefits

    Excellent flexibility

    Reducing the volume

    Weight reduction

    Consistency of assembly

    Increased reliability

    The end can be whole soldered

    Low cost

    Continuity of processing

    On-time service

    Quick Lead time: 3-5 days


    Applications

    General purpose LED soft light strip, mobile phone antenna flex board, industrial control, temperature controller soft board


    Copper Foils

    There are two different types of copper foils: Electro-Deposited (ED) copper foils and Rolled and annealed (RA) copper foils.


    Electro-Deposited copper foils are produced by depositing copper on a stainless steel drum that rotates in a plating tank with anodes of very pure copper. The thickness of the copper foil is determined by the length of the plating process, i.e. the rotation speed of the drum. The copper is then removed from the drum and wound on a roll. The finished copper foil is very smooth on the drum side and fairly rough on the other side. The rough side has the advantage of giving better adhesion to the base

    laminate.


    The main characteristic of ED copper is its grain structure, which is vertical in nature because of the electrolytic process. This implies a relatively low ductility of the copper foil, thus it is not recommended for dynamic applications. The drawing below shows the vertical grain structure of ED copper.


    Common foil thicknesses for flexible circuits are 17.5, 35, 70, 105 and 175 µm (0.5, 1, 2, 3 and 5 oz.).



    RA Copper

    This copper is a rolled and annealed copper foil produced from electrolytically deposited cathode copper, which is melted and cast into ingots. The ingots are first hot-rolled to a certain size, and milled on all surfaces. The copper is then cold-rolled and annealed, until the desired thickness is obtained.


    Contrary to electro-deposited copper, rolled and annealed copper has a horizontal grain structure as shown below. The horizontal grain structure provides for much higher flexibility and a better flex life endurance than ED copper, therefore RA copper always should be used for dynamic applications.


    A disadvantage of RA copper is that the bonding surface is fairly smooth, so that a relatively low adhesion is obtained. The bond, however, can be enhanced by an electrolytic copper flash without deteriorating the flexing characteristics of the copper foil.


    Common foil thicknesses for flexible circuits are 17.5, 35, 70, 105 and 175 µm (0.5, 1, 2, 3 and 5 oz.)



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