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RO3003 Rogers PCB Board

    Buy cheap RO3003 Rogers PCB Board from wholesalers
     
    Buy cheap RO3003 Rogers PCB Board from wholesalers
    • Buy cheap RO3003 Rogers PCB Board from wholesalers
    • Buy cheap RO3003 Rogers PCB Board from wholesalers
    • Buy cheap RO3003 Rogers PCB Board from wholesalers
    • Buy cheap RO3003 Rogers PCB Board from wholesalers
    • Buy cheap RO3003 Rogers PCB Board from wholesalers
    • Buy cheap RO3003 Rogers PCB Board from wholesalers
    • Buy cheap RO3003 Rogers PCB Board from wholesalers

    RO3003 Rogers PCB Board

    Ask Lasest Price
    Brand Name : Bicheng
    Model Number : BIC-095.V1.0
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
    • Company Profile

    RO3003 Rogers PCB Board


    Rogers RO3003 High Frequency PCB with 10mil, 20mil, 30mil and 60mil Thick Coating Immersion Gold, Immersion Silver, Immersion Tin and HASL

    (PCB's are custom-made products, the picture and parameters shown are just for reference)


    Hello Everyone,

    Today we’re going to talk about RO3003 high frequency PCBs.


    RO3003 high frequency circuit laminates are ceramic-filled PTFE composites intended for using in commercial microwave and RF applications. Its obvious characteristic is that the electrical performance is exceptional and the mechanical property is stable and consistent. This allows our designers to develop multi-layer board design feeling free and free, without encountering warpage or reliability problems.


    Let’s look at some features and applications.



    First of all, low dielectric loss, DF=0.001, it can be used in applications up to 77 GHz.


    Secondly, Stable dielectric constant versus temperature and frequency, it’s ideal material for band pass filters, microstrip patch antennas, and voltage controlled oscillators.


    Thirdly, excellent mechanical properties versus temperature, it’s reliable stripline and multi-layer board constructions.


    Fourthly, Uniform mechanical properties, it’s suitable for use with epoxy glass multi-layer board hybrid designs.


    Finally, low in-plane expansion coefficient matches to copper, it allows for more reliable surface mounted assemblies; ideal for applications sensitive to temperature change and exhibit excellent dimensional stability.


    Our PCB Capability (RO3003)

    PCB Capability
    PCB Material:Ceramic-filled PTFE composite
    Designator:RO3003
    Dielectric constant:3.0 ±0.04 (process)
    3.0 (design)
    Layer count:1 Layer, 2 Layer, Multilayer, Hybrid PCB
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
    PCB thickness:10mil (0.254mm), 20mil (0.508mm)
    30mil (0.762mm), 60mil (1.524mm)
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, OSP etc..
      

    RO3003 high frequency PCBs are available with double sided, multi-layer and hybrid construction, copper ranges from 0.5oz to 2oz, thickness from 0.3mm to 1.6mm, maximum size 400 by 500mm, surface finish with bare copper, hot air leveling, immersion gold etc.



    The typical Applications are automotive radar applications, power amplifiers and antennas, direct broadcast satellite etc.


    The basic colour of RO3003 PCB is white.


    The manufacturing process of RO3003 high frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume manufacturing process winning advantageous market.


    Should you have any questions, please feel free to contact us.


    Thank you for your reading.


    Appendix: Data Sheet of RO3003

    RO3003 Typical Value
    PropertyRO3003DirectionUnitsConditionTest Method
    Dielectric Constant,εProcess3.0±0.04Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign3Z8GHz to 40 GHzDifferential Phase Length Method
    Dissipation Factor,tanδ0.001Z10 GHz/23℃IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε-3Zppm/℃10 GHz -50℃to 150℃IPC-TM-650 2.5.5.5
    Dimensional Stability0.06
    0.07
    X
    Y
    mm/mCOND AIPC-TM-650 2.2.4
    Volume Resistivity107MΩ.cmCOND AIPC 2.5.17.1
    Surface Resistivity107COND AIPC 2.5.17.1
    Tensile Modulus930
    823
    X
    Y
    MPa23℃ASTM D 638
    Moisture Absorption0.04%D48/50IPC-TM-650 2.6.2.1
    Specific Heat0.9j/g/kCalculated
    Thermal Conductivity0.5W/M/K50℃ASTM D 5470
    Coefficient of Thermal Expansion
    (-55 to 288℃)
    17
    16
    25
    X
    Y
    Z
    ppm/℃23℃/50% RHIPC-TM-650 2.4.4.1
    Td500℃ TGAASTM D 3850
    Density2.1gm/cm323℃ASTM D 792
    Copper Peel Stength12.7Ib/in.1oz,EDC After Solder FloatIPC-TM 2.4.8
    FlammabilityV-0UL 94
    Lead-free Process CompatibleYes

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