3 Layer Hybrid PCB Board Made On 13.3mil RO4350B and 31mil
RT/Duroid 5880 for Multicoupler Antenna
(PCB's are custom-made products, the picture and parameters shown
are just for reference)
The hybrid PCB can be a mixture of FR-4 and high frequency
material, and a mixture of high frequency material with different
dielectric constant (DK), for example RT/duroid 5880 and RO4350B
etc.
Today we’ll talk about a type of mixed high frequency PCB made on
13.3mil (0.338mm) RO4350B and 31mil (0.787mm) RT/duroid 5880. It’s
for the application of multi-coupler antenna.
This is a 3-layer board that one layer is etched off. The basic
specifications are as follows:
Base material: RO4350B 13.3mil (0.338mm) + RT/duroid 5880 31 mil
(0.787mm)
Dielectric constant: 3.48+/-0.05
Layer count: 3 layers
Via type: Through holes, blind vias
Format: 160mm x 90mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35μm | Inner layer 35μm
Solder mask / Legend: Green / White
Final PCB height: 1.3 mm
Standard: IPC 6012 Class 2
Packing: 20 panels are packed for shipment.
Lead time: 20 working days
Shelf life: 6 months
Features and benefits
1) Lowest electrical loss for reinforeced PTFE material
2) Enhanced electrical performance;
3) 16000 square meter workshop;
4) 30000 square meter month capability;
5) 8000 types of PCB's per month;
6) More than 17 years of PCB experience;
Applications
Point to Point Digital Radio Antennas, WiFi Amplifier,
Tower-mounted Booster, Power Amplifier, RF Module
Properties of RT/duroid 5880
| RT/duroid 5880 Typical Value |
| Property | RT/duroid 5880 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 2.20
2.20±0.02 spec. | Z | N/A | C24/23/50
C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5 |
| Dielectric Constant,εDesign | 2.2 | Z | N/A | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor,tanδ | 0.0004
0.0009 | Z | N/A | C24/23/50
C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5 |
| Thermal Coefficient of ε | -125 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 2 x 107 | Z | Mohm cm | C/96/35/90 | ASTM D 257 |
| Surface Resistivity | 3 x 107 | Z | Mohm | C/96/35/90 | ASTM D 257 |
| Specific Heat | 0.96(0.23) | N/A | j/g/k
(cal/g/c) | N/A | Calculated |
| Tensile Modulus | Test at 23℃ | Test at 100℃ | N/A | MPa(kpsi) | A | ASTM D 638 |
| 1070(156) | 450(65) | X |
| 860(125) | 380(55) | Y |
| Ultimate Stress | 29(4.2) | 20(2.9) | X |
| 27(3.9) | 18(2.6) | Y |
| Ultimate Strain | 6 | 7.2 | X | % |
| 4.9 | 5.8 | Y |
| Compressive Modulus | 710(103) | 500(73) | X | MPa(kpsi) | A | ASTM D 695 |
| 710(103) | 500(73) | Y |
| 940(136) | 670(97) | Z |
| Ultimate Stress | 27(3.9) | 22(3.2) | X |
| 29(5.3) | 21(3.1) | Y |
| 52(7.5) | 43(6.3) | Z |
| Ultimate Strain | 8.5 | 8.4 | X | % |
| 7.7 | 7.8 | Y |
| 12.5 | 17.6 | Z |
| Moisture Absorption | 0.02 | N/A | % | 0.62"(1.6mm) D48/50 | ASTM D 570 |
| Thermal Conductivity | 0.2 | Z | W/m/k | 80℃ | ASTM C 518 |
| Coefficient of Thermal Expansion | 31
48
237 | X
Y
Z | ppm/℃ | 0-100℃ | IPC-TM-650 2.4.41 |
| Td | 500 | N/A | ℃ TGA | N/A | ASTM D 3850 |
| Density | 2.2 | N/A | gm/cm3 | N/A | ASTM D 792 |
| Copper Peel | 31.2(5.5) | N/A | Pli(N/mm) | 1oz(35mm)EDC foil
after solder float | IPC-TM-650 2.4.8 |
| Flammability | V-0 | N/A | N/A | N/A | UL 94 |
| Lead-free Process Compatible | Yes | N/A | N/A | N/A | N/A |
