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Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Circuit Board DK3.0 DF 0.001 Microwave PCB

    Buy cheap Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Circuit Board DK3.0 DF 0.001 Microwave PCB from wholesalers
     
    Buy cheap Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Circuit Board DK3.0 DF 0.001 Microwave PCB from wholesalers
    • Buy cheap Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Circuit Board DK3.0 DF 0.001 Microwave PCB from wholesalers
    • Buy cheap Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Circuit Board DK3.0 DF 0.001 Microwave PCB from wholesalers
    • Buy cheap Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Circuit Board DK3.0 DF 0.001 Microwave PCB from wholesalers

    Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Circuit Board DK3.0 DF 0.001 Microwave PCB

    Ask Lasest Price
    Brand Name : Bicheng
    Model Number : BIC-037.V1.0
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
    • Company Profile

    Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Circuit Board DK3.0 DF 0.001 Microwave PCB


    Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Circuit Board DK3.0 DF 0.001 Microwave PCB

    (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


    Rogers RO3003 high-frequency circuit materials are ceramic-filled PTFE composites specifically designed for commercial microwave and RF applications. These materials offer exceptional electrical and mechanical stability while maintaining competitive prices. The consistent mechanical properties of RO3003 allow designers to develop multi-layer board designs without encountering warpage or reliability issues.


    RO3003 materials exhibit a coefficient of thermal expansion (CTE) of 17 ppm/℃ in the X and Y axes. This CTE is matched to that of copper, ensuring excellent dimensional stability. After etching and baking processes, RO3003 materials typically experience minimal etch shrinkage of less than 0.5 mils per inch, further enhancing their dimensional stability.


    Furthermore, RO3003 laminates have a Z-axis CTE of 24 ppm/℃. This characteristic contributes to exceptional plated through-hole reliability, even in harsh environments, ensuring robust and reliable performance.


    Rogers RO3003 high-frequency circuit materials provide exceptional electrical and mechanical stability, making them ideal for applications such as datalink on cable systems, patch antennas for wireless communications, power backplanes, and remote meter readers.


    PCB Specifications

    PCB SIZE100 x 100mm=1PCS
    BOARD TYPEDouble sided PCB
    Number of Layers2 layers
    Surface Mount ComponentsNO
    Through Hole ComponentsNO
    LAYER STACKUPcopper ------- 35 um(1 oz)
    RO3003 0.254mm
    copper ------- 35 um(1 oz)
    TECHNOLOGY
    Minimum Trace and Space:5mil / 5mil
    Minimum / Maximum Holes:0.3mm / 0.8mm
    Number of Different Holes:N/A
    Number of Drill Holes:N/A
    Number of Milled Slots:N/A
    Number of Internal Cutouts:N/A
    Impedance Control:N/A
    Number of Gold finger:N/A
    BOARD MATERIAL
    Glass Epoxy:RO3003 0.254mm
    Final foil external:1oz
    Final foil internal:N/A
    Final height of PCB:0.3 mm ±0.1
    PLATING AND COATING
    Surface FinishN/A
    Solder Mask Apply To:N/A
    Solder Mask Color:N/A
    Solder Mask Type:N/A
    CONTOUR/CUTTINGRouting
    MARKING
    Side of Component LegendN/A
    Colour of Component LegendN/A
    Manufacturer Name or Logo:N/A
    VIAN/A
    FLAMIBILITY RATINGUL 94-V0 Approval MIN.
    DIMENSION TOLERANCE
    Outline dimension:0.0059"
    Board plating:0.0029"
    Drill tolerance:0.002"
    TESTN/A
    TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
    SERVICE AREAWorldwide, Globally.

    Data Sheet of Rogers 3003 (RO3003)

    RO3003 Typical Value
    PropertyRO3003DirectionUnitsConditionTest Method
    Dielectric Constant,εProcess3.0±0.04Z10 GHz/23IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign3Z8GHz to 40 GHzDifferential Phase Length Method
    Dissipation Factor,tanδ0.001Z10 GHz/23IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε-3Zppm/10 GHz -50to 150IPC-TM-650 2.5.5.5
    Dimensional Stability0.06
    0.07
    X
    Y
    mm/mCOND AIPC-TM-650 2.2.4
    Volume Resistivity107MΩ.cmCOND AIPC 2.5.17.1
    Surface Resistivity107COND AIPC 2.5.17.1
    Tensile Modulus930
    823
    X
    Y
    MPa23ASTM D 638
    Moisture Absorption0.04%D48/50IPC-TM-650 2.6.2.1
    Specific Heat0.9j/g/kCalculated
    Thermal Conductivity0.5W/M/K50ASTM D 5470
    Coefficient of Thermal Expansion
    (-55 to 288
    )
    17
    16
    25
    X
    Y
    Z
    ppm/23/50% RHIPC-TM-650 2.4.4.1
    Td500 TGAASTM D 3850
    Density2.1gm/cm323ASTM D 792
    Copper Peel Stength12.7Ib/in.1oz,EDC After Solder FloatIPC-TM 2.4.8
    FlammabilityV-0UL 94
    Lead-free Process CompatibleYes


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