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Rogers 4003 20mil High Frequency PCB Double Sided RF PCB Repeater PA

    Buy cheap Rogers 4003 20mil High Frequency PCB Double Sided RF PCB Repeater PA from wholesalers
     
    Buy cheap Rogers 4003 20mil High Frequency PCB Double Sided RF PCB Repeater PA from wholesalers
    • Buy cheap Rogers 4003 20mil High Frequency PCB Double Sided RF PCB Repeater PA from wholesalers

    Rogers 4003 20mil High Frequency PCB Double Sided RF PCB Repeater PA

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    Brand Name : Bicheng
    Model Number : BIC-007.V1.0
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
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    Rogers 4003 20mil High Frequency PCB Double Sided RF PCB Repeater PA


    High Frequency PCB Double Sided RF PCB Repeater PA

    (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


    RO4003C hydrocarbon ceramic laminates are designed to offer superior high frequency performance and low cost circuit fabrication. The selection of laminates typically available to designers is significantly reduced once operational frequencies increase to 500 MHz and above.


    Designers of RF microwave circuits, matching networks, and controlled impedance transmission lines can rely on the features of RO4003C material. Higher operating frequencies prevent the use of standard circuit board materials in many applications, while low dielectric loss enables RO4003C material to be employed in those applications.


    The dielectric constant is consistent across a wide frequency range and has one of the lowest temperature coefficients of any circuit board material. The thermal coefficient of expansion (CTE) of the RO4003C material offers the PCB designers a number of significant advantages. Due to its identical expansion coefficient to that of copper, RO4003C exhibits high dimensional stability, a quality required for the creation of mixed dielectric multi-layer boards.


    The low Z-axis CTE of RO4003C provides reliable plated through-hole quality, even in severe thermal shock applications. RO4003C material has a Tg of >280C so its expansion characteristics remain stable over the entire range of PCB processing temperatures.


    PCB Specifications

    PCB SIZE67 x 72mm=1up
    BOARD TYPEDouble sided PCB
    Number of Layers2 layers
    Surface Mount ComponentsYES
    Through Hole ComponentsNO
    LAYER STACKUPcopper ------- 35um(1 oz)+plate TOP layer
    RO4003C 0.508mm
    copper ------- 35um(1oz) + plate BOT Layer
    TECHNOLOGY
    Minimum Trace and Space:7.9 mil / 5.9 mil
    Minimum / Maximum Holes:0.4 mm / 0.4 mm
    Number of Different Holes:1
    Number of Drill Holes:3
    Number of Milled Slots:0
    Number of Internal Cutouts:0
    Impedance Control:no
    Number of Gold finger:0
    BOARD MATERIAL
    Glass Epoxy:RO4003C Tg280, er<3.48, Rogers Corp.
    Final foil external:1.5 oz
    Final foil internal:N/A
    Final height of PCB:0.6 mm ±0.1
    PLATING AND COATING
    Surface FinishImmersion gold, 37%
    Solder Mask Apply To:N/A
    Solder Mask Color:N/A
    Solder Mask Type:N/A
    CONTOUR/CUTTINGRouting
    MARKING
    Side of Component LegendN/A
    Colour of Component LegendN/A
    Manufacturer Name or Logo:N/A
    VIAPlated through hole(PTH), minimum size 0.4mm.
    FLAMIBILITY RATINGN/A
    DIMENSION TOLERANCE
    Outline dimension:0.0059"
    Board plating:0.0029"
    Drill tolerance:0.002"
    TEST100% Electrical Test prior shipment
    TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
    SERVICE AREAWorldwide, Globally.

    Typical applications are as follows:

    • Automotive Radar and Sensors
    • Cellular Base Station Antennas
    • Direct Broadcast Satellites
    • Low Noise Block


    Data Sheet of Rogers 4003C (RO4003C)

    RO4003C Typical Value
    PropertyRO4003CDirectionUnitsConditionTest Method
    Dielectric Constant,εProcess3.38±0.05Z10 GHz/23IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign3.55Z8 to 40 GHzDifferential Phase Length Method
    Dissipation Factortan,δ0.0027
    0.0021
    Z10 GHz/23
    2.5 GHz/23
    IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε+40Zppm/-50to 150IPC-TM-650 2.5.5.5
    Volume Resistivity1.7 x 1010MΩ.cmCOND AIPC-TM-650 2.5.17.1
    Surface Resistivity4.2 x 109COND AIPC-TM-650 2.5.17.1
    Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
    Tensile Modulus19,650(2,850)
    19,450(2,821)
    X
    Y
    MPa(ksi)RTASTM D 638
    Tensile Strength139(20.2)
    100(14.5)
    X
    Y
    MPa(ksi)RTASTM D 638
    Flexural Strength276
    (40)
    MPa
    (kpsi)
    IPC-TM-650 2.4.4
    Dimensional Stability<0.3X,Ymm/m
    (mil/inch)
    after etch+E2/150IPC-TM-650 2.4.39A
    Coefficient of Thermal Expansion11
    14
    46
    X
    Y
    Z
    ppm/-55to288IPC-TM-650 2.4.41
    Tg>280 TMAAIPC-TM-650 2.4.24.3
    Td425 TGAASTM D 3850
    Thermal Conductivity0.71W/M/oK80ASTM C518
    Moisture Absorption0.06%48hrs immersion 0.060"
    sample Temperature 50
    ASTM D 570
    Density1.79gm/cm323ASTM D 792
    Copper Peel Stength1.05
    (6.0)
    N/mm
    (pli)
    after solder float 1 oz.
    EDC Foil
    IPC-TM-650 2.4.8
    FlammabilityN/AUL 94
    Lead-free Process CompatibleYes


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