Pulse periodic reverse rectifier 25v 5000a
Specification
| SPECIFICATIONS FOR GKDH25-5000CVC |
| Input AC | 415V±10% | 3 phase | 50/60Hz |
| Output DC | Volt | 0~25V Adjustable |
| Current | 0~5000A Adjustable |
| Power | 125KW |
| Efficiency | >85% |
| output Frequency | 40KHz fixed |
| Protection | Short circuit protection
Overheating protection
Phase lack protection
Input over/low voltage protection |
Working Condition
(Temperature) | -10℃~50℃ | Control mode | Panel control
Remote control |
| Net weight | 400kg | Working mode | Constant Voltage(CV)
Constant Current(CC) |
| Dimension(mm) | 1300*1210*1079mm | Cooling way | air cooling |
| Reverse time | 0~9999minuts adjustable | reverse way | manual /automatic |
Pulse periodic reverse rectifier 25v 5000a Features
1. Small size, light weight, electricity-saving, high accuracy
2. The communication interface can be provided
3. Duration control can be provided
4. Douch screen can be provided
5. Control mode: Local control or Remote control(the length of
cable is determined by customers)
6. Japan IGBT(the default choice) or Germany IGBT are adopted
7. After being phosphated, galvanized and plastic sprayed, the
chassis has excellent corrosion resistence function
8. Easy to operate and repaire
Pulse periodic reverse rectifier 25v 5000a picture:
Installation
Advantages Pulse periodic reverse rectifier 25v 5000a
In operation and application, there is almost no difference between
pulse reverse plating and DC acid copper system. The main visible
difference is rectification. With PPR system, rectifier is
controlled by software, and all working methods and batch files can
be pre programmed. In addition, like the traditional acid copper
system, PPR system also uses whitening agent, carrier and wetting
additive system, and can analyze the additive package
comprehensively. Traditional acid copper plating also uses two or
three maintenance additives.
Pulse reverse current will cause desorption of special additives
above the threshold current density. This desorption increases the
"resistance" in the high current density (HCD) region, thus
increasing the "throwing force" of the electrolyte.
Productivity comparison of existing electroplating production
lines.
Compared with the traditional acid copper plating, PPR system uses
a lower concentration of copper, thus reducing the amount of sludge
generated in the process. Due to the improved method of throwing
the coating into the low current density (LCD) area, PPR system
needs less time to achieve the minimum copper thickness.
Equipment requirements
The PPR system requires the use of rectifier in square wave form
and special cable to avoid inductance. (coaxial cable or twisted
pair welding cable is recommended.) Tanks with weirs are also
required because pulse plating consumes higher additive rates than
DC acid plating.
