LED WHITE DIFFUSED CHIP SMD HSMW-CL25 0.25mm White Leadframe-Based
Surface Mount ChipLED
Advantages :
• High package thermal dissipation capability due to the superior package leadframe design
• Small footprint to overcome space count
• Low thickness to overcome space constrains
• Short lead times and competitive pricing
Description :
The HSMW-CL25 series of parts is designed with an ultra small form
factor to allow this miniaturization. The HSMW-CL25 series is the
thinnest available top emitting package in the market with high
brightness InGaN die technology. The leadframe construction of this
package allows the
part to transfer heat from the package, thus it is able to survive
temperature conditions of -40°C to 85°C despite its small size.
The target applications are Keypad backlighting, Push button
backlighting and Status indicators.
The target markets are Mobile Handsets, Communications,Office
Automation, Industrial and Commercial automations, Home Market
appliances, Networking, Medical Instruments, and Mobile Computing.
This product is competitively priced, and production is geared
towards short lead times and ample capacity.
Features :
• Small size top firing
• Small 1.6 (L) x 0.8 (W) x 0.25 (H) mm package
• Diffused optics
• Compatible with IR Reflow
• High brightness using InGaN die technology
• Available in 8mm Tape on 7” (178 mm) Diameter Reels
Absolute Maximum Ratings :
for product datasheet, CONTACT US directly.
