Gold Plating SMD Ceramic Hybrid Integrated Circuit Package

Technical characteristics:

Micro channel heat sink

Flatness of chip mounting area ≤ 2 um

Roughness of chip mounting area ≤ 0.3 um

Plating thickness: Ni (2-5um)

Au (0.05-0.15um)

Water flow ≥ 300ml/min


High thermal conductivity aluminum nitride ceramic heat sink

Types of Ceramic: Aluminum Nitride AlN

Thermal conductivity: 200 W/m.K

Roughness of metallized area: Ra 0.5um Max

Flatness of metallized area: 5um Max

Copper thickness accuracy: 75±10 um

Preset gold tin solder: Au (75±5wt%) Sn

Founded in 1988 in Hefei, JOPTEC is a global leader in R&D and manufacturing of hermetic metal-glass packages for hybrid integrated circuits, high power laser, optical communication, infrared detector and other optoelectronic devices. With the continuous investment in new technologies and facilities, JOPTEC now covers an area of 21,000 square meters and has developed a complete and mature process for the design, manufacturing, testing and quality inspection for hermetic metal-glass packages. Over the past few decades, JOPTEC’s capability, quality consistency and reliability have been recognized by customers worldwide that range from major international companies of high power laser, optical communication, defense and aerospace agencies to medical and research establishments.