C11000 PCB Copper Foil

C11000 PCB Copper Foil

Material introduction:C11000(Cu ETP)

Cu ETP is an electrolytically refined oxygen-containing copper. It has good electrical conductivity but compared with other high conductivity copper due to the high residua oxygen content of the alloy it is not suitable for processing (annealing welding etc.) and use in high temperature ( temperature greater than 370 ° C ) reducing gas. Because it is prone to hydrogen embrittlement when the material is heated to 600 ° C or higher the oxygen inside the material will form water vapor with the hydrogen in the air causing the internal structure of the material to be brittle and cremated so hydrogen embrittlement occurs.

Material Features:

1. Cu copper content is greater than 99.9% oxygen content 5-40 PPM
2. Compared with oxygen-free copper C10200 OFC the processing cost is lower.
3. Not suitable for use at temperatures above 370 ° C prone to hydrogen embrittlement
4. Widely used in electronic parts of electrical components, electrical products

Physical properties

Mechanical Properties

Chemical composition

Application

Conductive parts, exchanger coils, heat exchangers

We work at developing, producing and circulating metallic materials. We delivers a wide range of copper and its alloy products to demanding customers in the electro-technical industry.

Our product-range includes copper and copper alloy in the shape of foil, strip and sheet with a great variety of standards, ingredients and purposes. Our products have broadly been used in aviation, space industry, shipbuilding, military industry, metallurgy, electronics industry, electric goods producing, telecommunications, decoration engineering, plumbing and sanitary.