C1100 C1020 Thin Insulated Copper Foil Rolls
Quick Detail:
Model No. | LLF-750 | LLF-1100 | LLF-1300 | LLF-1600 |
Foil Grade | O, H14 | O, H14 | O, H14 | O, H14 |
Foil Thickness | 0.006-0.02mm | 0.006-0.02mm | 0.006-0.02mm | 0.006-0.02mm |
Foil Width | 650mm | 1000mm | 1250mm | 1500mm |
Foil O.D | Φ650mm | Φ 650mm | Φ 650mm | Φ 650mm |
Slitting Width | ≥10mm | ≥10mm | ≥10mm | ≥10mm |
Slitting Speed | 0-250m/min | 0-250m/min | 0-250m/min | 0-250m/min |
Total Power | 13kw/380V | 18.5kw/380V | 18.5kw/380V | 26kw/380V |
Core I.D | 3", 6" | 3", 6" | 3", 6" | 3", 6" |
Description:
1. Grade: C1100 , C1020
2. Thickness: 0.005mm- 1.2mm
3. Width: 400mm max
4. Chemical Composition: C1100: Cu >99.90%, C1020: Cu >99.96%, C1220: Cu >99.97%; P 0.015-0.04%
5. Oxygen content: C1100: O < 500PPM, C1020: O < 50PPM
6. Temper: O, 1/4H, 1/2H, H
Chemical composition
| Cu | O | P |
C1100 | 99.90% | 500PPM | - |
C1020 | 99.96% | 50PPM | - |
C1220 | 99.97% | - | 0.015-0.04% |
Item
| rolled copper foil |
Standard | GB/T5231-2001,GB/T1527-2006,JISH3250-2006, JISH3300-2006,ASTM B152M,ASTM B187,ASTM B75M-02, ASTM B42-02,etc. |
Material | C1100,C1020,C1220 |
Size | Thickness:0.005mm- 1.2mm Width:400mm max Length:as customers’ requirement. |
Surface | bright |
Application | Copper foil can be made to do all sorts of drawing and bending
stress components,such as manufacturing pins,
rivets,gasket,nuts,conduits,the barometer spring,screen, adiator parts,etc. |
Export to | copper foil is mainly exported to the following countries :
America,Australia,Brazil,Canada,Peru,Iran,Italy,India, United
Kingdom,Arab,etc. |
Package | Standard export package or as required. |
Price term | EXW,FOB,CIF,CFR,CNF,etc. |
Payment | L/C,T/T,etc. |
Certificates | SGS&ISO&GL&BV,etc. |
Contact | If you have any question,please feel free to contact me We promise your inquiry or requirements will get prompt attention. |
Applications for Copper Foil:
1. Electric and electric springs, switches
2. Lead frames
3. Connectors and oscillation reeds
4. PCB field
5. Communication cable
6. Cable armoring
7. Mobile phone main board
8. Ion battery production lamination with PI film
9. PCB collector (electrode backing) materials
Our product
Manufacturing of Copper Foil:
