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Low Density Molybdenum Copper Alloy Plate For Electronic Components

    Buy cheap Low Density Molybdenum Copper Alloy Plate For Electronic Components from wholesalers
     
    Buy cheap Low Density Molybdenum Copper Alloy Plate For Electronic Components from wholesalers
    • Buy cheap Low Density Molybdenum Copper Alloy Plate For Electronic Components from wholesalers
    • Buy cheap Low Density Molybdenum Copper Alloy Plate For Electronic Components from wholesalers
    • Buy cheap Low Density Molybdenum Copper Alloy Plate For Electronic Components from wholesalers
    • Buy cheap Low Density Molybdenum Copper Alloy Plate For Electronic Components from wholesalers
    • Buy cheap Low Density Molybdenum Copper Alloy Plate For Electronic Components from wholesalers

    Low Density Molybdenum Copper Alloy Plate For Electronic Components

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    Brand Name : JINXING
    Model Number : Molybdenum Copper Alloy
    Certification : ISO 9001
    Price : 30~150USD/kg
    Payment Terms : L/C, D/A, D/P, T/T, Western Union
    Supply Ability : 10000kgs/M
    Delivery Time : 10~25 work days
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    Low Density Molybdenum Copper Alloy Plate For Electronic Components

    Molybdenum Copper Plate Mo60Cu40 / Mo70Cu30 / Mo80Cu20 heat sink sealing

    Molybdenum Copper Plates can be processed with the content (Mo85Cu15 , Mo80Cu20 , Mo70Cu30 , Mo60Cu40 , Mo50Cu50) MoCu 85/15 Molybdenum-Copper Composite Material , MoCu 70/30 Molybdenum-Copper Composite Material , MoCu 65/35 Molybdenum-Copper Composite Material , Molybdenum-Copper Composite AMC 7525


    Description


    Molybdenum Copper Plate is used to manufacture military high-power microelectronic devices as heat sink sealing materials and molybdenum-copper alloy sheets for sealing and structural materials of aluminum oxide ceramics. It is also suitable for manufacturing high thermal conductivity expansion sealing heat in civil high-power microelectronic devices. Sedimentary molybdenum copper alloy plate


    TypeMo Wt%Cu Wt%g/cm3W/(M.K)
    (10-6/K)
    Mo85Cu1585± 1Balance10160 - 1806.8
    Mo80Cu20801Balance9.9170 - 1907.7
    Mo70Cu30701Balance9.8180 - 2009.1
    Mo60Cu40601Balance9.66210 - 25010.3
    Mo50Cu5050 ±0.2Balance9.54230 - 27011.5
    Material Notes:Characteristics:
    • High thermal conductivity
    • Low thermal expansion
    • Low density
    Applications:
    • Electronic components - passive cooling elements
    • Automotive industry - carrier plates for IGBT modules in electric drives

    Related

    • Molybdenum Copper Wafer substrate

    • Molybdenum Copper Heat sink

    • Molybdenum Copper Rod

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