Borosilicate Lid Glass Wafer With Ultra Thin Thickness For Fiber Optic AWG Application

Borosilicate Lid glass wafer with ultra thin thickness for fiber optic AWG application

Glass Wafer

We are one of the world’s leading glass wafer suppliers, provide thin & ultra-thin glass wafers and substrates which are made of different materials, such as Borofloat, Fused Silica & Quartz, BK7, Soda Lime etc for MEMS, fiber optic AWG, LCD panels and OLED substrates application. These wafers are all SEMI Standards including dimensional, flat and notch specifications, also we offer custom specifications designed to your unique needs including alignment marks, holes, pockets, edge profile, thickness, flatness, surface quality, cleanliness or any other details critical to your application, including semiconductor, medical science, communications, lasers, infrared, electronics, measuring instruments, military, and aerospace.

Glass Wafer Process

Wafer Cutting: blank wafer are ready through that thick sheets are water jetted and blocks are wire sawn

Ground Edge: the wafer edge is cylindrical grounded on the Edge Grinding Station.

Wafer Lapping: the wafer is lapped to appointed thickness.

Wafer Polishing: Polishing the wafer gives it the mirrored, super-flat surface required for the fabrication.

Wafer Cleaning: it is the removal of chemical and particle impurities without altering or damaging the wafer surface or substrate on multiple cleaning lines.

Wafer Inspection: inspect to various quality levels under the appropriate lighting condition in the Class 100 Clean Room.

Wafer Packaging: All wafers are packed in the single wafer containers.

Xiamen Powerway Advanced Material Co.,Limited(PAM-XIAMEN) is a high-tech enterprise for compound semiconductor material integrating semiconductor crystal growth, process development and epitaxy, specializing in the research and production of compound semiconductor wafers, there are two main field: SiC&GaN material(SiC wafer and epitaxy, GaN wafer and epi wafer) and III-V material (III-V substrate and epi service: InP wafer, GaSb wafer, GaAs wafer, InAs wafer and InSb wafer). Our wafers are widely used in LED semiconductor lighting,wireless communication, solar power, infrared device, laser, detectors and semiconductor power devices, including power devices, high temperature devices and photoelectric devices, therein, GaN wafer including GaN on Si,GaN on SiC and GaN on Sapphire are for Mini / micro LED, power electronics and microwave RF.

As a leading professional company, we are committed to constantly improving the quality of existing products. PAM-XIAMEN has a strong technical R & D team, composed of graduate students, doctors, masters, and has a strong R & D strength. The technical backbone of the company has been engaged in material preparation and related equipment design and development for almost 30years, and has in-depth research on the physical, chemical and electrical properties of materials, material preparation process. The accumulation of many years of theoretical deposition and practical experience of scientific and technological personnel makes the company have unique insights and unique advantages in the development of relevant materials and equipment, while ensuring that the product performance and equipment design scheme of the company meet the actual technical and technological needs of users.