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Single Zone Auto SMT Assembly Machine Desk Lead Free Drawer Reflow Oven

    Buy cheap Single Zone Auto SMT Assembly Machine Desk Lead Free Drawer Reflow Oven from wholesalers
     
    Buy cheap Single Zone Auto SMT Assembly Machine Desk Lead Free Drawer Reflow Oven from wholesalers
    • Buy cheap Single Zone Auto SMT Assembly Machine Desk Lead Free Drawer Reflow Oven from wholesalers

    Single Zone Auto SMT Assembly Machine Desk Lead Free Drawer Reflow Oven

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    Brand Name : CHIMALL
    Model Number : 200C
    Supply Ability : 50 Set/Sets per Day
    Price : Negotiable
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    Single Zone Auto SMT Assembly Machine Desk Lead Free Drawer Reflow Oven

    Single Zone Auto SMT Assembly Machine Desk Lead Free Drawer Reflow Oven


    FEATHERS


    1. Number of temperature control segments: 1-128; up to 8*16 segments of program can be set and stored in the reflow soldering machine according to practical needs.

    2. Number of temperature zones: Single zone with multiple temperature segment control.

    3. Temperature control system: Automatic temperature control using microcomputer; non-contact SSR output.

    4. Temperature rise time: 90s to enter into temperature keeping zone.

    5. Temperature range: Room temperature to 300°C.

    6. Heat source: Infrared + hot air convection.

    7. Temperature curve: 1-8 pieces of temperature curve can be set in the reflow soldering machine according to needs. User can select the temperature curve according to the accuracy for product soldering. There are four default pieces of curve, e.g. leaded, lead-free, cure etc. in the machine for selection. Cure 1: about 90s for temperature keeping at 150°C; cure 2: about 5 min for temperature keeping at 150°C.

    8. Cooling system: Cross-flow type balanced rapid cooling.

    9. Separate air exhausting duct for cooling: The ON/OFF of air duct is automatically controlled through the electric controlled door to effectively ensure the airtightness of hot room.

    10. External RS232 interface, input of K-type thermocouple, drive for solid state relay, cooling signal and ringing signal.


    PARAMETERS


    1. PCB maximum area

    350mm x 250mm

    2. Max heating temperature

    300

    3. Power supply

    AC220V/ 50Hz

    4. Maximum Power

    4.2 KW, average 1.5 KW

    5. Weight

    about 45kg

    6. Outline dimensions

    620mm x 460mm x 385mm

    7. Accuracy of temperature

    ±1°C

    8. Soldering time

    6min±1min

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