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FR4 TG180 Material HDI Printed Circuit Boards 16L High Speed For Electronics

    Buy cheap FR4 TG180 Material HDI Printed Circuit Boards 16L High Speed For Electronics from wholesalers
     
    Buy cheap FR4 TG180 Material HDI Printed Circuit Boards 16L High Speed For Electronics from wholesalers
    • Buy cheap FR4 TG180 Material HDI Printed Circuit Boards 16L High Speed For Electronics from wholesalers
    • Buy cheap FR4 TG180 Material HDI Printed Circuit Boards 16L High Speed For Electronics from wholesalers
    • Buy cheap FR4 TG180 Material HDI Printed Circuit Boards 16L High Speed For Electronics from wholesalers
    • Buy cheap FR4 TG180 Material HDI Printed Circuit Boards 16L High Speed For Electronics from wholesalers

    FR4 TG180 Material HDI Printed Circuit Boards 16L High Speed For Electronics

    Ask Lasest Price
    Price : usd2.18/pcs
    Payment Terms : T/T, Western Union
    Supply Ability : 200K/pcs per month
    Delivery Time : 25-30day
    Brand Name : China chao sheng
    Model Number : CSPCB1518
    Certification : ISO/UL/RoHS/TS
    • Product Details
    • Company Profile

    FR4 TG180 Material HDI Printed Circuit Boards 16L High Speed For Electronics

    FR4 TG180 High Speed HDI Printed Circuit Boards 16L Third Order For Consumer Electronics circuit board pcb PCB laminate


    We are reliable and competitive manufacturer of PCBs with advanced technology,experienced workers,professional salesteam and competitive prices and high quality,we mainly specialize in 1 layer,2 layers,4 layers to 10 layers,12 layers,we offer HAL,OSP,immersion gold,etc,no MOQ , rosh compliant, all we need is your gerber file and quantity,then we will quote best price and do best for you,it is very easy,welcome to inquire anytime, tks for your interest.

    Printed circuit board (pcb) and PCBA products
    Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
    Flexible circuit board (FPC) and FPCA product areas
    CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.


    Process parameters:

    ContentCapability
    MaterialFR4, TG130, TG140, TG160, TG170
    Surface treatmentHASL,Chemical Tin,ENIG(Immersion GOLD),OSP,IMT,Plating silver,GOLD Finger
    LayersSingle-sided,double-sided,4 layers, 6,8,10,12 Layers
    Maxi. board size800mmX508mm
    Line width/space0.1mm/ 0.1mm
    Board thickness0.2mm-4mm
    Min.tolerance of Board thickness+/-8% - 10%
    Copper foil thickness

    Out Layer:17.5um/35um/70um/105um/140um/175um

    Inner Layer:17.5um/35um/70um/105um/140um

    Outline ToleranceCNC routing:+/-0.1mm , Punching: +/-0.1mm
    V-CUT registration+/-0.15mm
    PTH hole copper thickness15um-50um
    Warp and twist<=1%
    Min registration of hole position+/-3mil(+/-0.76mm)
    Min punching hole0.8mm(Board thickness below 1.0mm .)
    Min Punching Square slot(Board thickness below 1.0mm, 1.0mmX1.0mm)
    Registration of printed circuit+/-0.076mm
    Min drill hole diameter0.2mm
    Min tolerance of hole diameter+/-0.05mm
    Thickness of surface treatment

    Plating Gold:(Ni4um-6um ,Au 0.1um-0.5um)

    Immersion GOLD: (Ni 5um-6um,Au:0.0254um-0.127um)

    Plating Silver:(Ag 5um-8um)

    V-CUT degree tolerance+/-5(degree)
    V-CUT Board thickness0.6mm-3.2mm
    Min Legend width0.1mm
    Min Solder mask width0.1mm
    Min Solder mask ring0.05mm

    Our Quality processes include

    1. IQC: Incoming Quality Control (Incoming Materials Inspection)
    2. First Article Inspection for every process
    3. IPQC: In Process Quality Control
    4. QC: 100% Test & Inspection
    5. QA: Quality Assurance based on QC inspection again
    6. Workmanship: IPC-A-610, ESD
    7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004
    8. Quality Assurance:
      Our Quality processes include:
      1. IQC: Incoming Quality Control (Incoming Materials Inspection)
      2. First Article Inspection for every process
      3. IPQC: In Process Quality Control
      4. QC: 100% Test & Inspection
      5. QA: Quality Assurance based on QC inspection again
      6. Workmanship: IPC-A-610, ESD
      7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004


      Certificates:
      ISO9001-2008
      ISO/TS16949
      UL
      IPC-A-600G and IPC-A-610E Class II compliance
      Customer's requirements


      Quick Detail:

      1. PCB Assembly on SMT and DIP

      2. PCB schematic drawing/ layout /producing

      3. PCBA clone/change board

      4. Components sourcing and purchasing for PCBA

      5. Enclosure design and plastic injection molding

      6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,

      7. IC programming

      Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray

      PCB, FPC product application field

      Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products

      FAQ:

      Q: What files do you use in PCB fabrication?

      A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

      Q: Is it possible you could offer sample?

      A: Yes, we can custom you sample to test before mass production

      Q: When will I get the quotation after sent Gerber, BOM and test procedure?

      A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

      Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

      A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

      Q: How can I make sure the quality of my PCB?

      PCB, FPC process production capability

      Technical ltemMassProductAdvanced Technology
      201620172018
      Max.Layer Count26L36L80L
      Through-hole plate2~45L2~60L2~80L
      Max.PCBSize(in)24*52"25*62"25*78.75"
      The layer number of FPC1~36L1~50L1~60L
      Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
      Layeredplatelayer2~12L2~18L2~26L
      Max.PCBSize(in)9"*48"9"*52"9"*62"
      Combination of hard and soft layers3~26L3~30L3~50L
      Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
      HDI PCB4~45L4~60L4~80L
      Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
      Max.PCBSize(in)24"*43"24"*49"25"*52"
      MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
      Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
      Build-up MaterialFR-4FR-4FR-4
      BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
      Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
      Min.18L(mm)0.632.0~8.00.51~10.0mm
      Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
      MAX(mm)3.510.0mm10.0mm
      Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
      Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
      BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
      Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
      Gold thick1~40u"1~60u"1~120u"
      Nithick76~127u"76~200u"1~250u"
      Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
      Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
      Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
      DieletricThickness38(1.5)32(1.3)32(1.3)
      125(5)125(5)125(5)
      SKipviaYesYesYes
      viaoNhie(laserviaon BuriedPTH)YesYesYes
      Laser Hole FillingYesYesYes
      TechnicalltemMass ProductAdvanced Technolgy
      2017year2018year2019year
      Drill hole depth ratioThroughHole2017year.40:1.40:1
      Aspet RatioMicro Via.35:11.2:11.2:1
      Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
      Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
      Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
      BGAPitch mm(Mil)0.30.30.3
      Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
      Line Width Control∠2.5MIL±0.50±0.50±0.50
      2.5Mil≤L/W∠4mil±0.50±0.50±0.50
      ≦3mil±0.60±0.60±0.60
      Laminated structureLayer by layer3+N+34+N+45+N+5
      Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
      Multi-layer overlayN+NN+NN+N
      N+X+NN+X+NN+X+N
      sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
      Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
      PTH filling processPTH resin plug hole + plating fill
      Electroplated hole/copper plug hole
      PTH resin plug hole + plating fill
      Electroplated hole/copper plug hole
      PTH resin plug hole + plating fill
      Electroplated hole/copper plug hole

      PCB, FPC main material supplier

      NOsupplierSupply material nameMaterial origin
      1JapanHigh frequency materials, PI, covering membrane,Copper berthMitsubishi Japan
      2dupontHigh frequency materials, PI, covering film, dry film,Copper berthJapan
      3panasonicHigh frequency materials, PI, covering membrane,Copper berthJapan
      4SanTiePI, covering membraneJapan
      5Born goodFR-4,PI,PP,Copper berthshenzhen, China
      6A rainbowPI, covering membrane,Copper berthTaiwan
      7teflonHigh frequency materialsThe United States
      8RogersHigh frequency materialsThe United States
      9Nippon SteelPI, covering membrane,Copper berthTaiwan
      10sanyoPI, covering membrane,Copper berthJapan
      11South AsiaFR-4,PI,PP,Copper berthTaiwan
      12doosanFR-4,PPSouth Korea
      13Tai Yao plateFR-4,PP,Copper berthTaiwan
      14AlightFR-4,PP,Copper berthTaiwan
      15YaoguangFR-4,PP,Copper berthTaiwan
      16YalongFR-4,PPThe United States
      17ISOALFR-4,PPJapan
      18OAKBuried, buried resistance, PPJapan
      19United States 3MFR-4,PPThe United States
      20BergsCopper and aluminum matrixJapan
      21The suninkTaiwan
      22MuratainkJapan
      23generous andbenevolentPI, covering membrane,Copper berthChina's jiangxi
      24YasenPPI, covering membraneChina jiangsu
      25Yong Sheng TaiinkChina guangdong panyu
      26mitainkJapan
      27Transcriptceramic materialTaiwan
      28HOMEceramic materialJapan
      29Fe-Ni-MnAlloy Invar, Section SteelTaiwan
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