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12 Layers Fabrication Surface Mount Pcb Assembly 5G High Frequency Mixed Pressure

    Buy cheap 12 Layers Fabrication Surface Mount Pcb Assembly 5G High Frequency Mixed Pressure from wholesalers
     
    Buy cheap 12 Layers Fabrication Surface Mount Pcb Assembly 5G High Frequency Mixed Pressure from wholesalers
    • Buy cheap 12 Layers Fabrication Surface Mount Pcb Assembly 5G High Frequency Mixed Pressure from wholesalers
    • Buy cheap 12 Layers Fabrication Surface Mount Pcb Assembly 5G High Frequency Mixed Pressure from wholesalers
    • Buy cheap 12 Layers Fabrication Surface Mount Pcb Assembly 5G High Frequency Mixed Pressure from wholesalers
    • Buy cheap 12 Layers Fabrication Surface Mount Pcb Assembly 5G High Frequency Mixed Pressure from wholesalers

    12 Layers Fabrication Surface Mount Pcb Assembly 5G High Frequency Mixed Pressure

    Ask Lasest Price
    Brand Name : China chao sheng
    Model Number : cspcb1517
    Certification : ISO/UL/RoHS/TS
    Price : 2.20usd/PCS
    Payment Terms : T/T, Western Union
    Supply Ability : 200K/pcs per month
    Delivery Time : 15-18day
    • Product Details
    • Company Profile

    12 Layers Fabrication Surface Mount Pcb Assembly 5G High Frequency Mixed Pressure

    12 layers PCB Rigid Flex Board Pcb Fabrication Assembly 5G High Frequency Mixed Pressure HDI Printedprinted circuit board pcb multilayer


    We are reliable and competitive manufacturer of PCBs with advanced technology,experienced workers,professional salesteam and competitive prices and high quality,we mainly specialize in 1 layer,2 layers,4 layers to 10 layers,60 layersHDI,we offer HAL,OSP,immersion gold,etc,no MOQ , rosh compliant, all we need is your gerber file and quantity,then we will quote best price and do best for you,it is very easy,welcome to inquire anytime, tks for your interest.

    pcb board

    Process parameters:

    ContentCapability
    MaterialFR4, TG130, TG140, TG160, TG170 TG180 TG240
    Surface treatmentHASL,Chemical Tin,ENIG(Immersion GOLD),OSP,IMT,Plating silver,GOLD Finger
    LayersSingle-sided,double-sided,4 layers, 6,8,10,20 30 40 60 Layers
    Maxi. board size800mmX508mm
    Line width/space0.1mm/ 0.1mm
    Board thickness0.2mm-4mm
    Min.tolerance of Board thickness+/-8% - 10%
    Copper foil thickness

    Out Layer:17.5um/35um/70um/105um/140um/175um

    Inner Layer:17.5um/35um/70um/105um/140um

    Outline ToleranceCNC routing:+/-0.1mm , Punching: +/-0.1mm
    V-CUT registration+/-0.15mm
    PTH hole copper thickness15um-50um
    Warp and twist<=1%
    Min registration of hole position+/-3mil(+/-0.76mm)
    Min punching hole0.8mm(Board thickness below 1.0mm .)
    Min Punching Square slot(Board thickness below 1.0mm, 1.0mmX1.0mm)
    Registration of printed circuit+/-0.076mm
    Min drill hole diameter0.2mm
    Min tolerance of hole diameter+/-0.05mm
    Thickness of surface treatment

    Plating Gold:(Ni4um-6um ,Au 0.1um-0.5um)

    Immersion GOLD: (Ni 5um-6um,Au:0.0254um-0.127um)

    Plating Silver:(Ag 5um-8um)

    V-CUT degree tolerance+/-5(degree)
    V-CUT Board thickness0.6mm-3.2mm
    Min Legend width0.1mm
    Min Solder mask width0.1mm
    Min Solder mask ring0.05mm
    1. Printed circuit board (pcb) and PCBA products
      Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
      Flexible circuit board (FPC) and FPCA product areas
      CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

    Certificates:
    ISO9001-2008
    ISO/TS16949
    UL
    IPC-A-600G and IPC-A-610E Class II compliance
    Customer's requirements


    Quick Detail:

    1. PCB Assembly on SMT and DIP

    2. PCB schematic drawing/ layout /producing

    3. PCBA clone/change board

    4. Components sourcing and purchasing for PCBA

    5. Enclosure design and plastic injection molding

    6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,

    7. IC programming

    Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray

    PCB, FPC product application field

    Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products

    FAQ:

    Q: What files do you use in PCB fabrication?

    A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

    Q: Is it possible you could offer sample?

    A: Yes, we can custom you sample to test before mass production

    Q: When will I get the quotation after sent Gerber, BOM and test procedure?

    A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

    Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

    A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

    Q: How can I make sure the quality of my PCB?

    PCB, FPC process production capability

    Technical ltemMassProductAdvanced Technology
    201620172018
    Max.Layer Count26L36L80L
    Through-hole plate2~45L2~60L2~80L
    Max.PCBSize(in)24*52"25*62"25*78.75"
    The layer number of FPC1~36L1~50L1~60L
    Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
    Layeredplatelayer2~12L2~18L2~26L
    Max.PCBSize(in)9"*48"9"*52"9"*62"
    Combination of hard and soft layers3~26L3~30L3~50L
    Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
    HDI PCB4~45L4~60L4~80L
    Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
    Max.PCBSize(in)24"*43"24"*49"25"*52"
    MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
    Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
    Build-up MaterialFR-4FR-4FR-4
    BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
    Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
    Min.18L(mm)0.632.0~8.00.51~10.0mm
    Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
    MAX(mm)3.510.0mm10.0mm
    Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
    Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
    BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
    Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
    Gold thick1~40u"1~60u"1~120u"
    Nithick76~127u"76~200u"1~250u"
    Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
    Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
    Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
    DieletricThickness38(1.5)32(1.3)32(1.3)
    125(5)125(5)125(5)
    SKipviaYesYesYes
    viaoNhie(laserviaon BuriedPTH)YesYesYes
    Laser Hole FillingYesYesYes
    TechnicalltemMass ProductAdvanced Technolgy
    2017year2018year2019year
    Drill hole depth ratioThroughHole2017year.40:1.40:1
    Aspet RatioMicro Via.35:11.2:11.2:1
    Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
    Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
    Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
    BGAPitch mm(Mil)0.30.30.3
    Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
    Line Width Control∠2.5MIL±0.50±0.50±0.50
    2.5Mil≤L/W∠4mil±0.50±0.50±0.50
    ≦3mil±0.60±0.60±0.60
    Laminated structureLayer by layer3+N+34+N+45+N+5
    Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
    Multi-layer overlayN+NN+NN+N
    N+X+NN+X+NN+X+N
    sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
    Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
    PTH filling processPTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole

    PCB, FPC main material supplier

    NOsupplierSupply material nameMaterial origin
    1JapanHigh frequency materials, PI, covering membrane,Copper berthMitsubishi Japan
    2dupontHigh frequency materials, PI, covering film, dry film,Copper berthJapan
    3panasonicHigh frequency materials, PI, covering membrane,Copper berthJapan
    4SanTiePI, covering membraneJapan
    5Born goodFR-4,PI,PP,Copper berthshenzhen, China
    6A rainbowPI, covering membrane,Copper berthTaiwan
    7teflonHigh frequency materialsThe United States
    8RogersHigh frequency materialsThe United States
    9Nippon SteelPI, covering membrane,Copper berthTaiwan
    10sanyoPI, covering membrane,Copper berthJapan
    11South AsiaFR-4,PI,PP,Copper berthTaiwan
    12doosanFR-4,PPSouth Korea
    13Tai Yao plateFR-4,PP,Copper berthTaiwan
    14AlightFR-4,PP,Copper berthTaiwan
    15YaoguangFR-4,PP,Copper berthTaiwan
    16YalongFR-4,PPThe United States
    17ISOALFR-4,PPJapan
    18OAKBuried, buried resistance, PPJapan
    19United States 3MFR-4,PPThe United States
    20BergsCopper and aluminum matrixJapan
    21The suninkTaiwan
    22MuratainkJapan
    23generous andbenevolentPI, covering membrane,Copper berthChina's jiangxi
    24YasenPPI, covering membraneChina jiangsu
    25Yong Sheng TaiinkChina guangdong panyu
    26mitainkJapan
    27Transcriptceramic materialTaiwan
    28HOMEceramic materialJapan
    29Fe-Ni-MnAlloy Invar, Section SteelTaiwan

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