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1.6mm Thickness Printed Circuit Board Services 8 Layer Carbon Oil FR4 TG 150

    Buy cheap 1.6mm Thickness Printed Circuit Board Services 8 Layer Carbon Oil FR4 TG 150 from wholesalers
     
    Buy cheap 1.6mm Thickness Printed Circuit Board Services 8 Layer Carbon Oil FR4 TG 150 from wholesalers
    • Buy cheap 1.6mm Thickness Printed Circuit Board Services 8 Layer Carbon Oil FR4 TG 150 from wholesalers
    • Buy cheap 1.6mm Thickness Printed Circuit Board Services 8 Layer Carbon Oil FR4 TG 150 from wholesalers

    1.6mm Thickness Printed Circuit Board Services 8 Layer Carbon Oil FR4 TG 150

    Ask Lasest Price
    Brand Name : China chao sheng
    Model Number : CSPCB1516
    Certification : ISO/UL/RoHS/TS
    Price : USD2.2/pcs
    Payment Terms : T/T, Western Union
    Supply Ability : 500000pcs per month
    Delivery Time : 15-18day
    • Product Details
    • Company Profile

    1.6mm Thickness Printed Circuit Board Services 8 Layer Carbon Oil FR4 TG 150

    8-layer carbon oil + FR4 TG 150, type PCB, printed circuit board pcb multilayer pcb board Contact PCB PCBway-The PCB

    1. Printed circuit board (pcb) and PCBA products
      Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
      Flexible circuit board (FPC) and FPCA product areas
      CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

    8 layer FR4 Multilayer PCB with ENIG surface finish,1.6mm board thickness with 2.0oz copper thickness for communication products.

    PRODUCT’S DETAILS
    Raw Material FR-4 (Tg 180 available)
    Layer Count 8-Layer
    Board Thickness 1.6mm
    Copper Thickness 2.0oz
    Surface Finish ENIG(Electroless Nickel Immersion Gold)
    Solder Mask Green
    Silkscreen White
    Min. Trace Width/Spacing 0.075/0.075mm
    Min. Hole Size 0.25mm
    Hole Wall Copper Thickness ≥20μm
    Measurement 300×400mm
    Packaging Inner: Vacuum-packed in soft plastic bales
    Outer: Cardboard Cartons with double straps
    Application Communication,automobile,cell,computer,medical
    Advantage Competitive Price,Fast Delivery,OEM&ODM,Free Samples,
    Special Requirements Buried And Blind Via, Impedance Control, Via Plug,
    BGA Soldering And Gold Finger Are Acceptable
    Certification UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

    PRODUCTION CAPABILITY OF PCB
    Process Engineering Items Manufacturing Capability
    Laminate Thickness 0.2~3.2mm
    Production Type Layer Count 2L-16L
    Cut Lamination Max. Working Panel size 1000×1200mm
    Inner Layer Internal Core Thickness 0.1~2.0mm
    Internal width/spacing Min: 4/4mil
    Internal Copper Thickness 1.0~3.0oz
    Dimension Board Thickness Tolerance ±10%
    Interlayer Alignment ±3mil
    Drilling Manufacture Panel Size Max: 650×560mm
    Drilling Diameter ≧0.25mm
    Hole Diameter Tolerance ±0.05mm
    Hole Position Tolerance ±0.076mm
    Min.Annular Ring 0.05mm
    PTH+Panel Plating Hole Wall copper Thickness ≧20um
    Uniformity ≧90%
    Outer Layer Track Width Min: 0.08mm
    Track Spacing Min: 0.08mm
    Pattern Plating Finished Copper Thickness 1oz~3oz
    EING/Flash Gold Nickel Thickness 2.5um~5.0um
    Gold Thickness 0.03~0.05um
    Solder Mask Thickness 15~35um
    Solder Mask Bridge 3mil
    Legend Line width/Line spacing 6/6mil
    Gold Finger Nickel Thickness ≧120u〞
    Gold Thickness 1~50u〞
    Hot Air Level Tin Thickness 100~300u〞
    Routing Tolerance of Dimension ±0.1mm
    Slot Size Min:0.4mm
    Cutter Diameter 0.8~2.4mm
    Punching Outline Tolerance ±0.1mm
    Slot Size Min:0.5mm
    V-CUT V-CUT Dimension Min:60mm
    Angle 15°30°45°
    Remain Thickness Tolerance ±0.1mm
    Beveling Beveling Dimension 30~300mm
    Test Testing Voltage 250V
    Max.Dimension 540×400mm
    Impedance Control Tolerance ±10%
    Aspect Ration 12:1
    Laser Drilling Size 4mil(0.1mm)
    Quality ITEQ 8 Layer PCB FR 4 Multi Layer PCB With 2.0oz Copper Thickness For Automobile for sale

    FAQ:

    Q: What files do you use in PCB fabrication?

    A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

    Q: Is it possible you could offer sample?

    A: Yes, we can custom you sample to test before mass production

    Q: When will I get the quotation after sent Gerber, BOM and test procedure?

    A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

    Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

    A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

    Q: How can I make sure the quality of my PCB?

    A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

    PCB, FPC process production capability

    1: Medical Bluetooth module motherboard
    2:
    Halogen-free FR-4 TG180, inner and outer copper thickness 35um, minimum line width line spacing 3/3mil, hole ratio 10:1, minimum hole 0.10mm, blind hole buried hole, immersion gold, red solder resist, white
    3: The board thickness is 1.60mm,
    4: blind hole, resin plug hole + plating hole
    Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB
    Standard.
    Quantities range from prototype to volume production.
    100% E-Test

    FAQ:

    Q: What files do you use in PCB fabrication?

    A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

    Q: Is it possible you could offer sample?

    A: Yes, we can custom you sample to test before mass production

    Q: When will I get the quotation after sent Gerber, BOM and test procedure?

    A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

    Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

    A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

    Q: How can I make sure the quality of my PCB?

    A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

    PCB, FPC process production capability

    Technical ltem MassProduct Advanced Technology
    2016 2017 2018
    Max.Layer Count 26L 36L 80L
    Through-hole plate 2~45L 2~60L 2~80L
    Max.PCBSize(in) 24*52" 25*62" 25*78.75"
    The layer number of FPC 1~36L 1~50L 1~60L
    Max.PCBSize(in) 9.8"*196" 9.8"*196" 10"*196"Reel to reel
    Layeredplatelayer 2~12L 2~18L 2~26L
    Max.PCBSize(in) 9"*48" 9"*52" 9"*62"
    Combination of hard and soft layers 3~26L 3~30L 3~50L
    Interconnect HDI 5+X+5Interconnect HDI 7+X+7Interconnect HDI 8+X+8,Interconnect HDI
    HDI PCB 4~45L 4~60L 4~80L
    Interconnect HDI 3+20+3 4+X+4Interconnect HDI 4+X+4,Interconnect HDI
    Max.PCBSize(in) 24"*43" 24"*49" 25"*52"
    Material FR-4 Rogers FR-4 Rogers FR-4 Rogers
    Base material Halogenfree,LowDK Halogenfree,LowDK Halogenfree,LowDK
    Build-up Material FR-4 FR-4 FR-4
    BOard,Thickness(mm) Min.12L(mm) 0.43 0.42~8.0mm 0.38~10.0mm
    Min.16L(mm) 0.53 1.60~8.0mm 0.45~10.0mm
    Min.18L(mm) 0.63 2.0~8.0 0.51~10.0mm
    Min.52L(mm) 0.8 2.50~8.0mm 0.65~10.0mm
    MAX(mm) 3.5 10.0mm 10.0mm
    Min.CoreThickness um(mil) 254"(10.0) 254"(10.0) 0.10~254(10.0mm)
    Min.Build up Dielectric 38(1.5) 32(1.3) 25(1.0)
    BaseCopperWeight Inner Layer 4/1-8 OZ 4/1-15 OZ 4/1-0.30mm
    Out Layer 4/1-10 OZ 4/1-15 OZ 4/1-30 OZ
    Gold thick 1~40u" 1~60u" 1~120u"
    Nithick 76~127u" 76~200u" 1~250u"
    Min.HOle/Land um(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
    Min.Laser via/landum(mil) 60/170(2.4/6.8) 50/150(2/6) 50/150(2/6)
    Min. IVH,Hole size/landum(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
    DieletricThickness 38(1.5) 32(1.3) 32(1.3)
    125(5) 125(5) 125(5)
    SKipvia Yes Yes Yes
    viaoNhie(laserviaon BuriedPTH) Yes Yes Yes
    Laser Hole Filling Yes Yes Yes
    Technicalltem Mass Product Advanced Technolgy
    2017year 2018year 2019year
    Drill hole depth ratio ThroughHole 2017year .40:1 .40:1
    Aspet Ratio Micro Via .35:1 1.2:1 1.2:1
    Copper Filling Dimple Size um(Mil) 10(0.4) 10(0.4) 10(0.4)
    Min.LineWidth&space lnner Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
    Plated Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
    BGAPitch mm(Mil) 0.3 0.3 0.3
    Min.PTH Hole ring um(mil) 75(3mil) 62.5(2.5mil) 62.5(2.5mil)
    Line Width Control ∠2.5MIL ±0.50 ±0.50 ±0.50
    2.5Mil≤L/W∠4mil ±0.50 ±0.50 ±0.50
    ≦3mil ±0.60 ±0.60 ±0.60
    Laminated structure Layer by layer 3+N+3 4+N+4 5+N+5
    Sequential Build-up 20L Any Layer 36L Any Layer 52L Any Layer
    Multi-layer overlay N+N N+N N+N
    N+X+N N+X+N N+X+N
    sequential Lamination 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
    Soft and hard bonding 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
    PTH filling process PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole

    Technical ltem MassProduct Advanced Technology
    2016 2017 2018
    Max.Layer Count 26L 36L 80L
    Through-hole plate 2~45L 2~60L 2~80L
    Max.PCBSize(in) 24*52" 25*62" 25*78.75"
    The layer number of FPC 1~36L 1~50L 1~60L
    Max.PCBSize(in) 9.8"*196" 9.8"*196" 10"*196"Reel to reel
    Layeredplatelayer 2~12L 2~18L 2~26L
    Max.PCBSize(in) 9"*48" 9"*52" 9"*62"
    Combination of hard and soft layers 3~26L 3~30L 3~50L
    Interconnect HDI 5+X+5Interconnect HDI 7+X+7Interconnect HDI 8+X+8,Interconnect HDI
    HDI PCB 4~45L 4~60L 4~80L
    Interconnect HDI 3+20+3 4+X+4Interconnect HDI 4+X+4,Interconnect HDI
    Max.PCBSize(in) 24"*43" 24"*49" 25"*52"
    Material FR-4 Rogers FR-4 Rogers FR-4 Rogers
    Base material Halogenfree,LowDK Halogenfree,LowDK Halogenfree,LowDK
    Build-up Material FR-4 FR-4 FR-4
    BOard,Thickness(mm) Min.12L(mm) 0.43 0.42~8.0mm 0.38~10.0mm
    Min.16L(mm) 0.53 1.60~8.0mm 0.45~10.0mm
    Min.18L(mm) 0.63 2.0~8.0 0.51~10.0mm
    Min.52L(mm) 0.8 2.50~8.0mm 0.65~10.0mm
    MAX(mm) 3.5 10.0mm 10.0mm
    Min.CoreThickness um(mil) 254"(10.0) 254"(10.0) 0.10~254(10.0mm)
    Min.Build up Dielectric 38(1.5) 32(1.3) 25(1.0)
    BaseCopperWeight Inner Layer 4/1-8 OZ 4/1-15 OZ 4/1-0.30mm
    Out Layer 4/1-10 OZ 4/1-15 OZ 4/1-30 OZ
    Gold thick 1~40u" 1~60u" 1~120u"
    Nithick 76~127u" 76~200u" 1~250u"
    Min.HOle/Land um(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
    Min.Laser via/landum(mil) 60/170(2.4/6.8) 50/150(2/6) 50/150(2/6)
    Min. IVH,Hole size/landum(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
    DieletricThickness 38(1.5) 32(1.3) 32(1.3)
    125(5) 125(5) 125(5)
    SKipvia Yes Yes Yes
    viaoNhie(laserviaon BuriedPTH) Yes Yes Yes
    Laser Hole Filling Yes Yes Yes
    Technicalltem Mass Product Advanced Technolgy
    2017year 2018year 2019year
    Drill hole depth ratio ThroughHole 2017year .40:1 .40:1
    Aspet Ratio Micro Via .35:1 1.2:1 1.2:1
    Copper Filling Dimple Size um(Mil) 10(0.4) 10(0.4) 10(0.4)
    Min.LineWidth&space lnner Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
    Plated Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
    BGAPitch mm(Mil) 0.3 0.3 0.3
    Min.PTH Hole ring um(mil) 75(3mil) 62.5(2.5mil) 62.5(2.5mil)
    Line Width Control ∠2.5MIL ±0.50 ±0.50 ±0.50
    2.5Mil≤L/W∠4mil ±0.50 ±0.50 ±0.50
    ≦3mil ±0.60 ±0.60 ±0.60
    Laminated structure Layer by layer 3+N+3 4+N+4 5+N+5
    Sequential Build-up 20L Any Layer 36L Any Layer 52L Any Layer
    Multi-layer overlay N+N N+N N+N
    N+X+N N+X+N N+X+N
    sequential Lamination 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
    Soft and hard bonding 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
    PTH filling process PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole

    10 layers ​ FR-4, TG140  Seeed Fusion PCB Specification Panelization and Bridge Design Component Layout Considerations P10 layers ​ FR-4, TG140  Seeed Fusion PCB Specification Panelization and Bridge Design Component Layout Considerations P

    Quality 1.6mm Thickness Printed Circuit Board Services 8 Layer Carbon Oil FR4 TG 150 for sale
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