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High Frequency PCB Copper Circuit Board Impedance Controlled With RoHS Compliance

    Buy cheap High Frequency PCB Copper Circuit Board  Impedance Controlled With RoHS Compliance from wholesalers
     
    Buy cheap High Frequency PCB Copper Circuit Board  Impedance Controlled With RoHS Compliance from wholesalers
    • Buy cheap High Frequency PCB Copper Circuit Board  Impedance Controlled With RoHS Compliance from wholesalers
    • Buy cheap High Frequency PCB Copper Circuit Board  Impedance Controlled With RoHS Compliance from wholesalers

    High Frequency PCB Copper Circuit Board Impedance Controlled With RoHS Compliance

    Ask Lasest Price
    Brand Name : China chao sheng
    Model Number : CSPCB1520
    Certification : ISO/UL/RoHS/TS
    Price : usd1.90/pcs
    Payment Terms : T/T, Western Union
    Supply Ability : 2000000pcs/per month
    Delivery Time : 15-18day
    • Product Details
    • Company Profile

    High Frequency PCB Copper Circuit Board Impedance Controlled With RoHS Compliance

    High Frequency PCB Impedance Controlled PCB Built on High Tg Fr-4 with RoHS Compliance Buried Via PCB Built on 26 Layer with Immersion Gold


    Metal Edge PCB With Fr4 IT180A Material ELIC Any interconnection Circuit Board


    PCB information:

    Brand:Oneseine

    10 layer PCB with bonding layers

    Substrate material: IT180A 1.0mm

    Surface finish:ENIG+OSP

    Copper:0.5OZ

    Min line width&space:2.5mil

    Special: ELIC Any interconnection and metal edge

    ELIC 1-2,1-3,1-4,1-5,1-6,1-7,1-8,1-9,1-10

    All via holes are plated with metal to ensure good connection

    The two side walls of PCB are required to be plated with metal.

    OSP Processing is required.

    Please carefully control the fabrication accuracy all layer dimensions within ±0.01mm in Gerber.

    1. Printed circuit board (pcb) and PCBA products
      Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
      Flexible circuit board (FPC) and FPCA product areas
      CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

    Our Service

    1. PCB Production Service.
    2. PCB FPC design Service.
    3. PCB Assembly Service. (SMT, BGA, DIP)
    4. PCBA Housing assembly serivce.
    5. PCBA Final Functional Testing.
    6. PCB PCBA Copy Service.
    7. Electronic Components Purchasing & BOM List Purchasing Services.
    8. PCB SMT Stencil. (Laser cut & Etching)
    9. Quality Assurance:
      Our Quality processes include:
      1. IQC: Incoming Quality Control (Incoming Materials Inspection)
      2. First Article Inspection for every process
      3. IPQC: In Process Quality Control
      4. QC: 100% Test & Inspection
      5. QA: Quality Assurance based on QC inspection again
      6. Workmanship: IPC-A-610, ESD
      7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004

      Certificates:
      ISO9001-2008
      ISO/TS16949
      UL
      IPC-A-600G and IPC-A-610E Class II compliance
      Customer's requirements


      Quick Detail:

      1. PCB Assembly on SMT and DIP

      2. PCB schematic drawing/ layout /producing

      3. PCBA clone/change board

      4. Components sourcing and purchasing for PCBA

      5. Enclosure design and plastic injection molding

      6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,

      7. IC programming


      PCB, FPC product application field
      Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products


      FAQ:
      Q: What files do you use in PCB fabrication?
      A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
      Q: Is it possible you could offer sample?
      A: Yes, we can custom you sample to test before mass production
      Q: When will I get the quotation after sent Gerber, BOM and test procedure?
      A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
      Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?
      A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing
      Q: How can I make sure the quality of my PCB?
      A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

    10. PCB, FPC process production capability

      Technical ltemMassProductAdvanced Technology
      201620172018
      Max.Layer Count26L36L80L
      Through-hole plate2~45L2~60L2~80L
      Max.PCBSize(in)24*52"25*62"25*78.75"
      The layer number of FPC1~36L1~50L1~60L
      Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
      Layeredplatelayer2~12L2~18L2~26L
      Max.PCBSize(in)9"*48"9"*52"9"*62"
      Combination of hard and soft layers3~26L3~30L3~50L
      Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
      HDI PCB4~45L4~60L4~80L
      Interconnect HDI3+20+34+X+4Interconnect HDI

      4+X+4,

      Interconnect HDI

      Max.PCBSize(in)24"*43"24"*49"25"*52"
      MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
      Base material

      Halogenfree,

      LowDK

      Halogenfree,

      LowDK

      Halogenfree,

      LowDK

      Build-up MaterialFR-4FR-4FR-4
      BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
      Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
      Min.18L(mm)0.632.0~8.00.51~10.0mm
      Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
      MAX(mm)3.510.0mm10.0mm
      Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
      Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
      BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
      Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
      Gold thick1~40u"1~60u"1~120u"
      Nithick76~127u"76~200u"1~250u"
      Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
      Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
      Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
      DieletricThickness38(1.5)32(1.3)32(1.3)
      125(5)125(5)125(5)
      SKipviaYesYesYes
      viaoNhie(laserviaon BuriedPTH)YesYesYes
      Laser Hole FillingYesYesYes
      TechnicalltemMass ProductAdvanced Technolgy
      2017year2018year2019year
      Drill hole depth ratioThroughHole2017year.40:1.40:1
      Aspet RatioMicro Via.35:11.2:11.2:1
      Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
      Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
      Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
      BGAPitch mm(Mil)0.30.30.3
      Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
      Line Width Control∠2.5MIL±0.50±0.50±0.50
      2.5Mil≤L/W∠4mil±0.50±0.50±0.50
      ≦3mil±0.60±0.60±0.60
      Laminated structureLayer by layer3+N+34+N+45+N+5
      Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
      Multi-layer overlayN+NN+NN+N
      N+X+NN+X+NN+X+N
      sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
      Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
      PTH filling processPTH resin plug hole + plating fill
      Electroplated hole/copper plug hole
      PTH resin plug hole + plating fill
      Electroplated hole/copper plug hole
      PTH resin plug hole + plating fill
      Electroplated hole/copper plug hole
      18 layers of second-order HDI FR-4, TG170,+M6 inner and outer copper ,HDI Printed Circuit18 layers of second-order HDI FR-4, TG170,+M6 inner and outer copper ,HDI Printed Circuit
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