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Durable Prototype Circuit Board Assembly , Flexible Pcb Board Nickel Palladium Surface

    Buy cheap Durable Prototype Circuit Board Assembly , Flexible Pcb Board Nickel Palladium Surface from wholesalers
     
    Buy cheap Durable Prototype Circuit Board Assembly , Flexible Pcb Board Nickel Palladium Surface from wholesalers
    • Buy cheap Durable Prototype Circuit Board Assembly , Flexible Pcb Board Nickel Palladium Surface from wholesalers
    • Buy cheap Durable Prototype Circuit Board Assembly , Flexible Pcb Board Nickel Palladium Surface from wholesalers
    • Buy cheap Durable Prototype Circuit Board Assembly , Flexible Pcb Board Nickel Palladium Surface from wholesalers

    Durable Prototype Circuit Board Assembly , Flexible Pcb Board Nickel Palladium Surface

    Ask Lasest Price
    Brand Name : China chao sheng
    Model Number : CSPCB1343
    Certification : ISO/UL/RoHS/TS
    Price : 2.26usd/pcs
    Payment Terms : T/T, Western Union
    Supply Ability : 50-2000K/pcs per month
    Delivery Time : 18-20day
    • Product Details
    • Company Profile

    Durable Prototype Circuit Board Assembly , Flexible Pcb Board Nickel Palladium Surface

    6Layers 2nd order HDI Rigid Flex PCB FR4 / Polyimide Material ENIG Hasl OSP Surface Finish,rigid flex circuit boards,rigid flexpcb

    Product Type: High Pixel Camera

    Size: 12*6.80mm/1PCS

    Productstructure: FR-4+TG170+Panasonic PI, four layers of soft shadow combination, minimum hole 0.15mm, plate thickness 1.60mm, nickel palladium gold 3U",

    Printed circuit board (pcb) and PCBA products
    Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
    Flexible circuit board (FPC) and FPCA product areas
    CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

    Our Services

    We are a Manufacturer & Supplier Specializing in Double Side PCB, Multi-Layer PCB, F4BK PCB, Ceramic PCB, Rogers PCB, Aluminum PCB. Meanwhile, we provide PCBA ( Assembly) and ODM, OEM service. We are specializes in a full SMT and through hole PCBA assembly, obtaining components, building prototype quantities, and testing. High quality,good price and service.

    1. Delivery time:5-7days.
    2. Certificates:UL,ISO9001,RoHS

    Our capability

    1. Our professional engineering team can put your project into production in a short time. Sample pictures and BOM are needed to make customized products
    2. We can supply CAD and Pro-E designed precision moulds. Moulds can be designed and manufactured according to customers' requests or samples. Plastic injection processing available.
    3. We have advanced equipment for through-hole and SMT DIP COB cable assembly.
    4. ROHS compliant and lead-free process.
    5. In-circuit, functional tests& burn-in tests, full system test
    6. High output to guarantee prompt delivery.

    PCB, FPC product application field

    Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products

    Detailed Specification of Flexible PCB Manufacturing

    Technical Specification
    Layers:4~30 Layers(flex Pcb) and 4~80 (rigid flex) 
    Min Panel Size:5mm x 8mm 
    Max Panel Size:250 x 520mm 
    Min Finished board thickness:0.05mm (1 sided inclusive copper) 
    Max Finished board thickness:0.3mm (2 sided inclusive copper) 
    Finished board thickness tolerance:±0.02~0.03mm 
    Material:Kapton, Polyimide, PET 
    Base copper thickness (RA or ED):1/3 oz, 1/2 oz, 1oz, 2oz 
    Base PI thickness:0.5mil, 0.7mil, 0.8mil, 1mil, 2mil 
    Stiffner:Polyimide, PET, FR4, SUS 
    Min Finished hole diameter:Φ 0.15mm 
    Max Finished hole diameter:Φ 6.30mm 
    Finished hole diameter tolerance (PTH):±2 mil ( ±0.050mm) 
    Finished hole diameter tolerance (NPTH):±1 mil ( ±0.025mm) 
    Min width/spacing (1/3oz):0.05mm/0.06mm 
    Min width/spacing (1/2oz):0.06mm/0.07mm 
    Min width/spacing (1oz):Single layer: 0.07mm/0.08mm 
    Double layer: 0.08mm/0.09mm 
    Aspect Ratio6:018:01
    Base Copper1/3Oz--2Oz3 Oz for Prototype
    Size ToleranceConductor Width:±10%W ≤0.5mm
    Hole Size: ±0.05mmH ≤1.5mm
    Hole Registration: ±0.050mm 
    Outline Tolerance:±0.075mmL ≤50mm
    Surface TreatmentENIG: 0.025um - 3um 
    OSP: 
    Immersion Tin: 0.04-1.5um 
    Dielectric StrengthAC500V 
    Solder Float288℃/10sIPC Standard
    Peeling Strength1.0kgf/cmIPC-TM-650
    Flammability94V-OUL94


    Quotation Requirement :
    1) Following specifications are needed for quotation:
    a) Base material
    b) Board thickness:
    c) Copper thickness
    d) Surface treatment:
    e) color of solder mask and silkscreen:
    f) Quantity

    Shiping method:
    1) By DHL, Fedex, UPS, TNT etc.
    2) By sea if it is possible
    3) By air

    Surface treatment:
    full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray

    FAQ:
    Q: What files do you use in PCB fabrication?
    A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
    Q: Is it possible you could offer sample?
    A: Yes, we can custom you sample to test before mass production
    Q: When will I get the quotation after sent Gerber, BOM and test procedure?
    A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
    Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?
    A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing
    Q: How can I make sure the quality of my PCB?
    A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

    PCB, FPC process production capability

    Technical ltemMassProductAdvanced Technology
    201620172018
    Max.Layer Count26L36L80L
    Through-hole plate2~45L2~60L2~80L
    Max.PCBSize(in)24*52"25*62"25*78.75"
    The layer number of FPC1~36L1~50L1~60L
    Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
    Layeredplatelayer2~12L2~18L2~26L
    Max.PCBSize(in)9"*48"9"*52"9"*62"
    Combination of hard and soft layers3~26L3~30L3~50L
    Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
    HDI PCB4~45L4~60L4~80L
    Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
    Max.PCBSize(in)24"*43"24"*49"25"*52"
    MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
    Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
    Build-up MaterialFR-4FR-4FR-4
    BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
    Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
    Min.18L(mm)0.632.0~8.00.51~10.0mm
    Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
    MAX(mm)3.510.0mm10.0mm
    Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
    Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
    BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
    Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
    Gold thick1~40u"1~60u"1~120u"
    Nithick76~127u"76~200u"1~250u"
    Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
    Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
    Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
    DieletricThickness38(1.5)32(1.3)32(1.3)
    125(5)125(5)125(5)
    SKipviaYesYesYes
    viaoNhie(laserviaon BuriedPTH)YesYesYes
    Laser Hole FillingYesYesYes
    TechnicalltemMass ProductAdvanced Technolgy
    2017year2018year2019year
    Drill hole depth ratioThroughHole2017year.40:1.40:1
    Aspet RatioMicro Via.35:11.2:11.2:1
    Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
    Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
    Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
    BGAPitch mm(Mil)0.30.30.3
    Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
    Line Width Control∠2.5MIL±0.50±0.50±0.50
    2.5Mil≤L/W∠4mil±0.50±0.50±0.50
    ≦3mil±0.60±0.60±0.60
    Laminated structureLayer by layer3+N+34+N+45+N+5
    Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
    Multi-layer overlayN+NN+NN+N
    N+X+NN+X+NN+X+N
    sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
    Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
    PTH filling processPTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    Product Tags:

    rigid flex board

      

    flexible pcb board

      
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