8 layers Anylayer 5GLED small pitch HDIPCB
1: 8-Layer Anylayer, 5GLED small pitch
2: RT6010.2LM+M7, TG240, Anylayer, minimum line width 3/3mil,
minimum hole 0.10mm, mechanical blind hole, electric gold +
immersion gold, green oil, white characters
3: plate thickness 2.50mm, PAD minimum spacing 0.075mm
4: deep drilling, blind hole, resin plug hole + plating hole
filling
Printed Circuit Boards are 94V0 compliant, and adhere to IPC610
Class 2 international PCB
Standard.
Quantities range from prototype to volume production.
100% E-Test
Printed circuit board (pcb) and PCBA product areas
Communication terminals, communication stations, electronic
communications, computers, household appliances, appliances, SD
cards, SG cards, mobile phones, antennas, computers, automobiles,
music equipment, playback equipment, banking equipment, medical
instruments, medical equipment, medical equipment, aerospace,
Aviation, military, LED, OLED, OLCD power control power supply,
industrial power supply, communication power supply, automotive
power supply, office equipment, digital products, computers and
other product applications;
Winding circuit board (fpc) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone,
connector, module, walkie-talkie antenna card, high-end camera,
digital, camera, laser head, CD, medical, instrumentation, drive,
automotive instrumentation, medical instrument , Medical equipment,
banking equipment, industrial instruments, LED strips, military
industry, aviation, aerospace, national defense and other high-tech
products, more than 70% of the products are exported to the
Americas, Europe, Japan, Asia Pacific and other countries and
regions.
PCB, FPC process production capability
It is imperative that the clients and software development firms be
well acquainted with each other in order to ensure the smooth flow
of business. As a firm with “ service first”, we believe in working
together. We are aware that right from the minute of getting
started; we make sure that we know the needs of our clients as much
as they need to be familiar with our business policies.
Share Your needs: It is important for us to know your needs in
definite terms, For a free consultation email us
PCB, FPC product application field
Various digital products, automotive new energy, automotive
products, military, aerospace, medical, wireless terminals, wired
terminals, communication equipment, communication stations,
finance, industrial industrial control, consumer electronics,
educational equipment, smart devices, smart products, security,
LED, computer, mobile phone and other electronic products
Product Description
- 18layers of third-order HDI, FR-4, TG150, plate thickness 3.0mm,smt pcb assembly,circuit board assembly services
- Product area: financial system products
- Number of layers: 18layers of third-order HDI, FR-4, TG150, plate thickness 3.0mm, laser hole 0.1mm, hole in the
plate, copper filled copper,
- Impedance tolerance: ±10%
- Surface treatment: OSP + immersion gold,
- Test method: computer 100% E-Test
- Packing: vacuum packaging + desiccant + humidity card + carton
- Mode of transport: air, sea, motor, logistics, express
PCB, FPC process production capability
| Technical ltem | MassProduct | Advanced Technology |
| 2016 | 2017 | 2018 |
| Max.Layer Count | 26L | 36L | 80L |
| Through-hole plate | 2～45L | 2～60L | 2～80L |
| Max.PCBSize(in) | 24*52" | 25*62" | 25*78.75" |
| The layer number of FPC | 1～36L | 1～50L | 1～60L |
| Max.PCBSize(in) | 9.8"*196" | 9.8"*196" | 10"*196"Reel to reel |
| Layeredplatelayer | 2～12L | 2～18L | 2～26L |
| Max.PCBSize(in) | 9"*48" | 9"*52" | 9"*62" |
| Combination of hard and soft layers | 3～26L | 3～30L | 3～50L |
| Interconnect HDI | 5+X+5Interconnect HDI | 7+X+7Interconnect HDI | 8+X+8,Interconnect HDI |
| HDI PCB | 4～45L | 4～60L | 4～80L |
| Interconnect HDI | 3+20+3 | 4+X+4Interconnect HDI | 4+X+4,Interconnect HDI |
| Max.PCBSize(in) | 24"*43" | 24"*49" | 25"*52" |
| Material | FR-4 Rogers | FR-4 Rogers | FR-4 Rogers |
| Base material | Halogenfree,LowDK | Halogenfree,LowDK | Halogenfree,LowDK |
| Build-up Material | FR-4 | FR-4 | FR-4 |
| BOard,Thickness(mm) | Min.12L(mm) | 0.43 | 0.42～8.0mm | 0.38～10.0mm |
| Min.16L(mm) | 0.53 | 1.60～8.0mm | 0.45～10.0mm |
| Min.18L(mm) | 0.63 | 2.0～8.0 | 0.51～10.0mm |
| Min.52L(mm) | 0.8 | 2.50～8.0mm | 0.65～10.0mm |
| MAX(mm) | 3.5 | 10.0mm | 10.0mm |
| Min.CoreThickness um(mil) | 254"(10.0) | 254"(10.0) | 0.10～254(10.0mm) |
| Min.Build up Dielectric | 38(1.5) | 32(1.3) | 25(1.0) |
| BaseCopperWeight | Inner Layer | 4/1-8 OZ | 4/1-15 OZ | 4/1-0.30mm |
| Out Layer | 4/1-10 OZ | 4/1-15 OZ | 4/1-30 OZ |
| Gold thick | 1～40u" | 1～60u" | 1～120u" |
| Nithick | 76～127u" | 76～200u" | 1～250u" |
| Min.HOle/Land um(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) |
|
| Min.Laser via/landum(mil) | 60/170(2.4/6.8) | 50/150(2/6) | 50/150(2/6) |
|
| Min. IVH,Hole size/landum(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) |
|
| DieletricThickness | 38(1.5) | 32(1.3) | 32(1.3) |
| 125(5) | 125(5) | 125(5) |
| SKipvia | Yes | Yes | Yes |
|
| viaoNhie(laserviaon BuriedPTH) | Yes | Yes | Yes |
|
| Laser Hole Filling | Yes | Yes | Yes |
|
| Technicalltem | Mass Product | Advanced Technolgy |
| 2017year | 2018year | 2019year |
| Drill hole depth ratio | ThroughHole | 2017year | .40:1 | .40:1 |
| Aspet Ratio | Micro Via | .35:1 | 1.2:1 | 1.2:1 |
| Copper Filling Dimple Size um(Mil) | 10(0.4) | 10(0.4) | 10(0.4) |
| Min.LineWidth＆space | lnner Layer um(mil) | 45/45(1.8/1.8) | 38/38(1.5/1.5) | 38/38(1.5/1.5) |
| Plated Layer um(mil) | 45/45(1.8/1.8) | 38/38(1.5/1.5) | 38/38(1.5/1.5) |
| BGAPitch mm(Mil) | 0.3 | 0.3 | 0.3 |
| Min.PTH Hole ring um(mil) | 75(3mil) | 62.5(2.5mil) | 62.5(2.5mil) |
| Line Width Control | ∠2.5MIL | ±0.50 | ±0.50 | ±0.50 |
| 2.5Mil≤L/W∠4mil | ±0.50 | ±0.50 | ±0.50 |
| ≦3mil | ±0.60 | ±0.60 | ±0.60 |
| Laminated structure | Layer by layer | 3+N+3 | 4+N+4 | 5+N+5 |
| Sequential Build-up | 20L Any Layer | 36L Any Layer | 52L Any Layer |
| Multi-layer overlay | N+N | N+N | N+N |
| N+X+N | N+X+N | N+X+N |
| sequential Lamination | 2+(N+X+N)+2 | 2+(N+X+N)+2 | 2+(N+X+N)+2 |
| Soft and hard bonding | 2+(N+X+N)+2 | 2+(N+X+N)+2 | 2+(N+X+N)+2 |
| PTH filling process | PTH resin plug hole + plating fill
Electroplated hole/copper plug hole | PTH resin plug hole + plating fill
Electroplated hole/copper plug hole | PTH resin plug hole + plating fill
Electroplated hole/copper plug hole |
|
|
Surface treatment:
full board OSP, full board immersion gold, whole board electric
nickel gold, electric gold + immersion gold, electric gold + OSP,
OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold
finger, immersion gold + gold finger, Shen tin, immersion silver,
lead-free tin spray |
FAQ:
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and
Components Position
Q: Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test
procedure?
A: Within 6-48hours for PCB quotation and around 24-48 hours for
PCBA quotation.
Q: According to the difficulty of high-layer boards, How can I know
the process of my PCB production?
A: 7-35days for PCB production and components purchasing, and
14-20days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB, PCBA products work well before
shipping. We'll test all of them according to your test procedure.
