Silicon Grinding Machines Wafer Chuck Back Grinding With High Efficiency

Wafer Back table for silicon Grinding Machines Porous Chuck Table High planarity 12 Inch fit for Strasbaugh

Our porous ceramic and metal chuck table is a specially designed tool for water absorption and holding purposed during the production of semiconductor wafers. It is mainly used in back grinding and dicing processes. The back grinding chuck tables and dicing chuck tables work well with Japanese, German and Chinese dicing saws and back grinding machines, thus ensuring an excellent cost effectiveness.

Features:

Applications

2, 3, 4, 5, 6, 8 and 12 inch semiconductor wafers back grinding

Applicable Machines

Back grinding machines, dicing saws

Type

Ceramic,Metal

Zhengzhou Hongtuo Superabrasive Tools Co.,Ltd was founded in 1997.It is a high-tech company engaged in R&D,production,sale and service of superabrasive tools.The company has 350 employees,over 300 sets of manufacturing and testing equipments.With 2 advanced metal bonded honing stones and vitrified bonded diamond&CBN grinding wheels production lines,which can produce750 000 pieces honing stones and 4 000 pieces grinding wheels annually.The company has been granted the ISO9001:2000 certificate in 2000.In the same year,it has been obtained the certificate of “high-new technology company”and “high-new technology products”granted by Science&Technology Division of Henan province.

Our products are widely used in the such industries as:automobile parts,motor parts,refrigeration compressor,aviation,hydraulics,sewing-machine parts and bearings.In respect of product quality,development and production capacity,the company is a leading manufacturer in the industry.it can meet all kinds of requirement.At present,a great parts of our proucts are sold to countries and regions as Europe,Japan,Taiwan and South-East Asian countries.

Our customer