ARJM11B1-809-AB-EW2 2.5G Base - T Magnetic RJ45 Socket Connector No
EMI Finger
- Tab Down Single Port Rj45 Ethernet No EMI Finger
- 1x1 2.5G Mbps Configuration No LED
- Compatible to ARJM11B1-809-AB-EW2
- Reach,UL Complaint
- Simplest magnetic component to place androute on PCB
- Conserves minimizing PCB space
| Part Status | Active | |
|---|
| Connector Type | RJ45 | |
|---|
| Number of Ports | 1 | |
|---|
| Number of Rows | 1 | |
|---|
| Applications | 2.5G Base-T, AutoMDIX | |
|---|
| Mounting Type | Through Hole | |
|---|
| Orientation | 90° Angle (Right) | |
|---|
| Termination | Solder | |
|---|
| Height Above Board | 0.535" (13.59mm) | |
|---|
| LED Color | Green - Yellow | |
|---|
| Number of Cores per Jack | 8 | |
|---|
| Shielding | Shielded | |
|---|
| Features | Board Lock | |
|---|
| Tab Direction | Down | |
|---|
| Contact Material | - | |
|---|
| Contact Finish | Gold | |
|---|
| Operating Temperature | -40°C ~ 85°C | |
|---|
| Contact Finish Thickness | 6.00µin (0.152µm) |
|---|
1.Designed to support application,such as SOHO(ADSL
modems),LAN-on-Motherboard(LOM),hub and Switches.
2.Meets IEEE 802.3ab specification
3.Connector Materials:
Housing: Thermoplastic PBT+30%G.F UL94V-0
Contact: Phosphor Bonze C5210R-EH Thickness=0.35mm
Pins: Brass C2680R-H Thickness=0.35mm
Shield: SUS 201-1/2H Thickness=0.2mm
Contact plating: Gold 6 micro-inches min.In contact area.
4.Wave solder tip temperature: 265℃ Max, 5 Sec Max
5.UL Certification: File Number E484635
Why Choose Us
World’s Leader Supplier Of Integrated RJ45 Connector And Discrete
Magnetic Transformers
100% Guarantee Qualtiy
•Manufactured Under Strict Controls.
•100% Tested (Not Just Batch Tested)
•LINK-PP Is OEM Of TE (Tyco) For 9 Years
•Successful Customer: Texas Instruments Samsung Cisco Siemens And
Intel…
•LINK-PP Is The Preferred Supplier Of TI (Texas Instruments)
•Quality Guarantee:6 Years
Main Customer
Design for Ti , Intel , Samsung , Fluke , Jabil , Flextronics
,Cypress, Freescale,EKF.......
EMS ApplicationBuilt-in Flexible PCB Assembly; Rigid-Flexible PCB Assembly;
Microelectronic, Flip Chip; Microelectronic, Chip On Board;
Optoelectronic Assembly; RF / Wireless Assembly; Through Hole
Assembly; Surface Mount Assembly; System Assembly; Printed Circuit
Board Assembly
