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PVD EMI Shielding Thin Film Vacuum Metallizing Equipment,

    Buy cheap PVD EMI Shielding Thin Film Vacuum Metallizing Equipment, from wholesalers
     
    Buy cheap PVD EMI Shielding Thin Film Vacuum Metallizing Equipment, from wholesalers
    • Buy cheap PVD EMI Shielding Thin Film Vacuum Metallizing Equipment, from wholesalers
    • Buy cheap PVD EMI Shielding Thin Film Vacuum Metallizing Equipment, from wholesalers
    • Buy cheap PVD EMI Shielding Thin Film Vacuum Metallizing Equipment, from wholesalers

    PVD EMI Shielding Thin Film Vacuum Metallizing Equipment,

    Ask Lasest Price
    Brand Name : ROYAL
    Model Number : RT1600-EMI
    Certification : TUV CE
    Price : negotiable
    Payment Terms : L/C, T/T, D/A, D/P
    Supply Ability : 10 sets per month
    Delivery Time : 8~12 weeks
    • Product Details
    • Company Profile

    PVD EMI Shielding Thin Film Vacuum Metallizing Equipment,

    EMI Shielding Thin Film Vacuum Metallizing Equipment, Vertical Orientation EMI PVD Coating Machine, Copper Evaporation​


    EMI: Electro-magnetic Interference coating is specially designed for electrical and electronic devices to avoid from interference of electromagnetic.

    Its high conductivity and high magnetc interference shielding properties are widely used in telecommunication devices, computers, consumer electronics, home appliance, aerospace and military devices


    EMI shileding surface treatment has been applied with cell phone industry for years. Our customers are:

    Sumgsung, Iphone, Lenovo, Huawei phones manufactures.


    Electro Magnetic Interference Shielding Metalizer Features

    1) Suitable for plastics,ceramics,glass and metal,surfaces deposition,
    2) Duo jig & rack designed structure,high productivity
    3) High depositing speed,
    4) Good uniformity & accurate coating thickness control

    5) Excellent adhesion


    Electro Magnetic Interference Shielding Metalizer Specifications:


    MODELRTEP1616-SP
    TECHNOLOGY

    THERMAL EVAPORATION, TUNGSTEN ,FILAMENT, glow discharge, magnetron

    sputtering

    MATERIALStainless Steel (S304)
    CHAMBER SIZEΦ1600*1600mm (H)
    CHAMBER TYPECylinder, horizontal, 1-door
    EVAPORTATION SYSTEMEXCLUSIVE DESIGN FOR EMI coating
    DEPOSITION MATERIALSilver, Copper, Stainless Steel, Nickel
    DEPOSITION SOURCETUNGSTEN FILAMENT + magnetron sputtering
    CONTROLPLC(Programmable Logic Controller) + Touch Screen
    PUMP SYSTEMRotary Piston Vacuum Pump
    Rotary Vane Vacuum Pump
    Roots Vacuum Pump
    Difussion Pump + Brooks Polycold
    PRE-TREATMENTPlasma Cleaning
    SAFETY SYSTEMNumerous safety interlocks to protect operators and equipment
    COOLINGCold Water
    POWER ELECTRICAL480V/3 phases/60HZ ( USA compliant)
    460V/3 phases/50HZ ( Asia compliant)
    380V/3 phases/50HZ ( EU-CE compliant)
    FOOTPRINTL9000*W4200*H3000mm
    TOTAL WEIGHT10.0 T
    CYCLE TIME15 minutes (depending on substrate material, substrate geometry and environmental conditions)
    POWER MAX..90KW
    AVERAGE POWER CONSUMPTION (APPROX.)45KW


    EMI Shielding Film Coating Properties

    Film thickness : 1.5 ~ 3 microns depends on the requirement.

    Film resistance: (ohm) better than 0.5Ω


    Adhesion: 3M810 tape > 5B


    Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.


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