DPC Direct Copper Plating on Ceramics, Al2O3 / AlN Circuit Boards
Copper Deposition Machine
Performance
1. Ultimate Vacuum Pressure: better than 5.0×10-6 Torr.
2. Operating Vacuum Pressure: 1.0×10-4 Torr.
3. Pumpingdown Time: from 1 atm to 1.0×10-4 Torr≤ 3 minutes ( room temperature, dry, clean and empty chamber)
4. Metalizing material (sputtering + Arc evaporation): Ni, Cu, Ag,
Au, Ti, Zr, Cr etc.
5. Operating Model: Full Automatically /Semi-Auto/ Manually
Structure
The vacuum coating machine contains key completed system listed
below:
1. Vacuum Chamber
2. Rouhging Vacuum Pumping System (Backing Pump Package)
3. High Vacuum Pumping System ( Magnetically Suspension Molecular
Pump)
4. Electrical Control and Operation System
5. Auxiliarry Facility System (Sub System)
6. Deposition System
Copper Sputtering Coating Machine Key Features
1. Equipped with 8 steer arc cathodes and DC Sputtering Cathodes,
MF Sputtering Cathodes, Ion source unit.
2. Multilayer and co-deposition coating available
3. Ion source for plasma cleaning pre-treatment and Ion-beam
assisted deposition to enhance the film adhesion.
4. Ceramic/ Al2O3/AlN substrates heating up unit;
5. Substrate rotation and revolution system, for 1-side coating and
2-sides coating.
Cooper Magnetron Sputtering Coating Plant on Ceramic Radiating
Substrate
The DPC process- Direct Plating Copper is an advanced coating
technology applied with LED / semiconductor / electronic
industries. One typical application is Ceramic Radiating Substrate.
Cooper conductive film deposition on Al2O3, AlN substrates by PVD
vacuum sputtering technology, compared with traditional
manufacturing methods: DBC LTCC HTCC, much lower production cost is
its high feature.
Royal technology team assited our customer to developed the DPC
process sucessfully with PVD sputtering technology.
The RTAC1215-SP machine designed exclusively for Copper conductive
film coating on Ceramic chips, ceramic circuit board.
How Does PVD Coating Work?
The solid metal is vaporized or ionized in a high vacuum
environment and deposited on electrically conductive materials as a
pure metal or metal alloy films. When a reactive gas, such as
nitrogen, oxygen or a hydrocarbon-based gas is introduced to the
metallic vapor, it creates nitride, oxide, or carbide coatings as
the metallic vapor stream, chemically reacts with the gasses. PVD
coating must be done in a specialized reaction chamber so that the
vaporized material doesn’t react with any contaminants that would
otherwise be present in the room.
During the process of PVD coating, the process parameters are
closely monitored and controlled so that the resulting film
hardness, adhesion, chemical resistance, film structure, and other
properties are repeatable for each run. Various PVD coating are
used to increase wear resistance, reduce friction, improve
appearance, and achieve other performance enhancements.
In order to deposit high purity materials such as titanium,
chromium, or zirconium, silver, gold, aluminum, copper, stainless
steel, the physical process of PVD coating utilizes one of several
different PVD coating methods, including:
Arc evaporation
Thermal evaporation
DC/MF sputtering(the bombardment of ions)
Ion Beam Deposition
Ion plating
Enhanced sputtering
Please contact us for more specifications, Royal Technology is
honored to provide you total coating solutions.
