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Sapphire Windows Piezoelectric Wafer Semiconductor Scratching Resistant

    Buy cheap Sapphire Windows Piezoelectric Wafer Semiconductor Scratching Resistant from wholesalers
     
    Buy cheap Sapphire Windows Piezoelectric Wafer Semiconductor Scratching Resistant from wholesalers
    • Buy cheap Sapphire Windows Piezoelectric Wafer Semiconductor Scratching Resistant from wholesalers
    • Buy cheap Sapphire Windows Piezoelectric Wafer Semiconductor Scratching Resistant from wholesalers

    Sapphire Windows Piezoelectric Wafer Semiconductor Scratching Resistant

    Ask Lasest Price
    Brand Name : BonTek
    Model Number : Sapphire (Al2O3)
    Certification : ISO:9001
    Price : Negotiable
    Payment Terms : T/T
    Supply Ability : 10000 pieces/Month
    Delivery Time : 1-4 weeks
    • Product Details
    • Company Profile

    Sapphire Windows Piezoelectric Wafer Semiconductor Scratching Resistant

    Semiconductor Sapphire Wafer Sapphire Windows Piezoelectric Wafer


    Sapphire is a material of a unique combination of physical, chemical and optical properties, which make it resistant to high temperature, thermal shock, water and sand erosion, and scratching. It is a superior window material for many IR applications from 3µm to 5µm. C-plane sapphire substrates are widely used to grow III-V and II-VI compounds such as GaN for blue LED and laser diodes, while R-plane sapphire substrates are used for the hetero-epitaxial deposition of silicon for microelectronic IC applications.



    Item

    3-inch C-plane(0001) 500μm Sapphire Wafers

    Crystal Materials

    99,999%, High Purity, Monocrystalline Al2O3

    Grade

    Prime, Epi-Ready

    Surface Orientation

    C-plane(0001)

    C-plane off-angle toward M-axis 0.2 +/- 0.1°

    Diameter

    76.2 mm +/- 0.1 mm

    Thickness

    500 μm +/- 25 μm

    Primary Flat Orientation

    A-plane(11-20) +/- 0.2°

    Primary Flat Length

    22.0 mm +/- 1.0 mm

    Single Side Polished

    Front Surface

    Epi-polished, Ra < 0.2 nm (by AFM)

    (SSP)

    Back Surface

    Fine ground, Ra = 0.8 μm to 1.2 μm

    Double Side Polished

    Front Surface

    Epi-polished, Ra < 0.2 nm (by AFM)

    (DSP)

    Back Surface

    Epi-polished, Ra < 0.2 nm (by AFM)

    TTV

    < 15 μm

    BOW

    < 15 μm

    WARP

    < 15 μm

    Cleaning / Packaging

    Class 100 cleanroom cleaning and vacuum packaging,

    25 pieces in one cassette packaging or single piece packaging.


    Item

    4-inch C-plane(0001) 650μm Sapphire Wafers

    Crystal Materials

    99,999%, High Purity, Monocrystalline Al2O3

    Grade

    Prime, Epi-Ready

    Surface Orientation

    C-plane(0001)

    C-plane off-angle toward M-axis 0.2 +/- 0.1°

    Diameter

    100.0 mm +/- 0.1 mm

    Thickness

    650 μm +/- 25 μm

    Primary Flat Orientation

    A-plane(11-20) +/- 0.2°

    Primary Flat Length

    30.0 mm +/- 1.0 mm

    Single Side Polished

    Front Surface

    Epi-polished, Ra < 0.2 nm (by AFM)

    (SSP)

    Back Surface

    Fine ground, Ra = 0.8 μm to 1.2 μm

    Double Side Polished

    Front Surface

    Epi-polished, Ra < 0.2 nm (by AFM)

    (DSP)

    Back Surface

    Epi-polished, Ra < 0.2 nm (by AFM)

    TTV

    < 20 μm

    BOW

    < 20 μm

    WARP

    < 20 μm

    Cleaning / Packaging

    Class 100 cleanroom cleaning and vacuum packaging,

    25 pieces in one cassette packaging or single piece packaging.


    Item

    6-inch C-plane(0001) 1300μm Sapphire Wafers

    Crystal Materials

    99,999%, High Purity, Monocrystalline Al2O3

    Grade

    Prime, Epi-Ready

    Surface Orientation

    C-plane(0001)

    C-plane off-angle toward M-axis 0.2 +/- 0.1°

    Diameter

    150.0 mm +/- 0.2 mm

    Thickness

    1300 μm +/- 25 μm

    Primary Flat Orientation

    A-plane(11-20) +/- 0.2°

    Primary Flat Length

    47.0 mm +/- 1.0 mm

    Single Side Polished

    Front Surface

    Epi-polished, Ra < 0.2 nm (by AFM)

    (SSP)

    Back Surface

    Fine ground, Ra = 0.8 μm to 1.2 μm

    Double Side Polished

    Front Surface

    Epi-polished, Ra < 0.2 nm (by AFM)

    (DSP)

    Back Surface

    Epi-polished, Ra < 0.2 nm (by AFM)

    TTV

    < 25 μm

    BOW

    < 25 μm

    WARP

    < 25 μm

    Cleaning / Packaging

    Class 100 cleanroom cleaning and vacuum packaging,

    25 pieces in one cassette packaging or single piece packaging.



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