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10 Zones SMT Reflow Machine Lead Free PC PLC Control For PCB

    Buy cheap 10 Zones SMT Reflow Machine Lead Free PC PLC Control For PCB from wholesalers
     
    Buy cheap 10 Zones SMT Reflow Machine Lead Free PC PLC Control For PCB from wholesalers
    • Buy cheap 10 Zones SMT Reflow Machine Lead Free PC PLC Control For PCB from wholesalers

    10 Zones SMT Reflow Machine Lead Free PC PLC Control For PCB

    Ask Lasest Price
    Brand Name : UA
    Model Number : RF-H800Ⅰ
    Certification : CE
    Price : Negotiable
    Payment Terms : T/T
    Supply Ability : USD
    Delivery Time : 5-30 days
    • Product Details
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    10 Zones SMT Reflow Machine Lead Free PC PLC Control For PCB

    10 Zones SMT Reflow Machine PCB Lead Free PLC Control


    Features

    1. Heating mode is "upper circulating hot air + lower infrared hot air". It is equipped with three forced cooling zones.
    2. Upper heating adopts microcirculation heating method, which can achieve large heat-air exchange and has very high heat exchange rate. It can reduce the setting temperature in the temperature zone and protect the heating elements. It is particularly suitable for lead-free welding.
    3. Microcirculation heating mode, vertical air blowing and vertical air collecting can solve the problem of dead angle when using guide rail in reflow soldering.

    Specification

    Temp Accuracy± 1C
    Temp Deviation± 2C
    Weight (kg)Approx.2100
    Cooling TypeForced-air Coooling
    ControlPLC + PC
    Power Supply3P/AC 380V OR 3P/AC 220V
    Parts HeightOn Baoard 35mm / Under Board 20mm
    Temp RangeRoom Temperature ~ 320C
    Mesh Belt Width ( mm )460 ( or Customized )
    Heating Zone Length (mm)2932
    Options Available450/500 max PCB width
    Central support for big PCB
    Extra cooling zone
    Cooling Zone length ( mm )600
    Conveyor TypeChain and Mesh Belt
    Temp Accuracy± 1C
    Running / Starting Power (kw)8.5 / 33
    Machine Dimension (mm)5150*1490*1510
    PCB Width (mm)50 - 400 ( or customized )
    Conveyor Speed (mm/min )20-1500

    Soddle Profile
    The componnetn is brought to a temperature of at least 240C for soldering. Using a saddle profile the board is gradually heated in line with pre-defined, individual temperature ranges. Even components with differing thermal masses are heated homogeneously and temperature differences mimimised.

    Linear profile:

    With a linear profile, the component is not heated in a stepped manner during soldering, in fact it is heated along anidentical linear temperature gradient. Linear profiles can reduce cycle times andcan help to reduce soldering errors suchas tombstoning.


    The Process of Reflow Oven

    The reflow oven process is that when the circuit board with printed solder paste and good components enters the reflow oven furnace, the circuit board is driven by the reflow oven rail transport chain to pass through the preheating zone, heat preservation zone, soldering zone and cooling zone of reflow oven in turn After the temperature changes of the four temperature zones of reflow oven, the reflow oven process of the circuit board is completed. The following specifically explains the soldering change process when the circuit board passes through the four temperature zones of reflow oven in sequence.


    The Pictures Showing of Reflow Oven



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