Custom Electronic Printed Circuit Board PCB Assembly Services Oem
Other Multilayer PCB
What is Multilayer PCBs
In a typical four-layer stack up, to improve the electromagnetic
compatibility (EMI) performance, the signal layers should be spaced
as close to the planes and use a large core between the power and
ground plane. The tight coupling between signal trace and ground
plane often reduces the plane impedance which further reduces the
common-mode radiation from the cables connected to the printed
circuit board. Also, the close trace to plane coupling will
decrease the crosstalk between traces.
PCB Sideplating
Sideplating is the metalization of the board edge in the PCB filed.
Edge plating,plated contour, side metal, these words can also be
used to describe the same function.
Half-cut Castellated Holes
Castellations are plated through holes or vias located in the edges
of a printed circuit board.
Are indentations created in the form of semi-plated holes on the
edges of the PCB boards.
These half holes serve as pads intended to create a link between
the module board and the board that it will be soldered onto.
Parameters
- Layers: 8L multilayer pcb
- Board Thinkness:2.0mm
- Base Material:S1000-2 High tg
- Min Holes:0.2mm
- Minimum Line Width/Clearance:0.25mm/0.25mm
- Minimum Clearance between Inner Layer PTH to Line: 0.2mm
- Size:250.6mm×180.5mm
- Aspect Ratio:10 : 1
- Surface treatment:ENIG+ Selective hard gold
- Process characteristics: High tg, Sideplating, Selective hard gold,
Half-cut Castellated Holes
- Applications: Wi-Fi modules
| YS Multilayer PCB manufacturing capabilities overview |
| Feature | capabilities |
| Layer Count | 3-60L |
| Available Multilayer PCB Technology | Through hole with Aspect Ratio 16:1 |
| buried and blind via |
| Hybrid | High Frequency Material such as RO4350B and FR4 Mix etc. |
| High Speed Material such as M7NE and FR4 Mix etc. |
| Thickness | 0.3mm-8mm |
| Minimum line Width and Space | 0.05mm/0.05mm(2mil/2mil) |
| BGA PITCH | 0.35mm |
| Min mechanical Drilled Size | 0.15mm(6mil) |
| Aspect Ratio for through hole | 10:1 |
| Surface Finish | HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver,
Gold Finger, Electroplating Hard Gold, Selective OSP,ENEPIG.etc. |
| Via Fill Option | The via is plated and filled with either conductive or
non-conductive epoxy then capped and plated over(VIPPO) |
| Copper filled, silver filled |
| Registration | ±4mil |
| Solder Mask | Green, Red, Yellow,White, Black, Purple, Matte Black, Matte
green.etc. |
FQA
1. What is hard gold in PCB?
The Hard Gold surface finish, also known as Hard Electrolytic Gold,
is composed of a layer of gold with added hardeners for increased
durability, plated over a barrier coat of nickel using an
electrolytic process.
2. What is hard gold plating?
Hard gold plating is a gold electrodeposit that has been alloyed
with another element to alter the grain structure of the gold to
achieve a harder deposit with a more refined grain structure.
The most common alloying elements used in hard gold plating are
cobalt, nickel or iron.
3. What is the difference between Enig and hard gold?
ENIG plating is much softer than hard gold plating.
Grain sizes are about 60 times larger with ENIG plating, and
hardness runs between 20 and 100 HK25.
ENIG plating holds up well at only 35 grams of contact force or
less, and ENIG plating typically lasts for fewer cycles than hard
plating.
A popular trend among manufacturers is board-to-board soldering.
This technique allows companies to produce integrated modules
(often containing dozens of parts) on a single board that can be
built into another assembly during production.
One easy way to produce a PCB that is destined to be mounted to
another PCB is to create castellated mounting holes.
These are also known as "castellated vias" or "castellations."
