Standard SGS ROHS Compliant Waffle Pack For Optoelectronic Chips
Hiner-pack has the professional technical teams, leading mold
processing and the most advanced injection molding equipment. High
level clean cleaning equipment and a variety of testing equipment
for your products to provide the best quality service. At the same
time, we has established deep cooperation with many well-known
enterprises in the world, and built a research and development base
of polymer materials with well-known universities and research
institutions in China.
Master special technology and manufacturing in the field of
semiconductor packaging raw materials.Through years of efforts, our
company constantly improve semiconductor packaging products,
introduce new products and solve customers' needs for high-quality
products.
Details of HN21134 Waffle Pack
HN21134 waffle pack is usually used to carry smaller chips, while
the 5 x 6 matrix design which not only realizes easy
transportation, but also can carry a large number of chips. The
product is mainly made of PC material, which has excellent
electrical insulation, elongation,dimensional stability and
chemical corrosion resistance.This makes it self-extinguishing,
flame retardant, non-toxic pollution and other advantages to ensure
product safety.
In order to avoid products jumping out of waffle pack pockets
during shipping, we can also provide matching lids, clamps, and
other appropriate accessories. High quality and complete service
packaging ensures the transfer, transportation and storage of
customers' products to avoid risks to the greatest extent.
| Outline Line Size | 50.7*50.7*4mm | Brand | Hiner-pack |
| Model | HN21134 | Package Type | Die |
| Cavity Size | 4.8*6.0*0.6 | Matrix QTY | 5*6=30PCS |
| Material | PC | Flatness | MAX 0.2mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS SGS |
Application Of HN21134 Chip Tray
Semiconductor Electronic Component Factories
SMT Surfacing Factories Optical Industry
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | TBC | Customizable |
| Provide professional design and packaging for your products |
Advantages
1. Light weight, saving transportation and packaging costs.
2. Size specification, compatible in any 2 ", 3 "or 4" Waffle Pack
Feeder Machine.
3. Good anti-static performance, effectively ensure that the
product is not damaged by anti-static release.
4. High temperature resistance, suitable for high temperature
automation equipment assembly.
5. Corrosion resistance, suitable for all kinds of production
conditions of products.
FAQ
Q1: Are you a manufacturer?
Ans:Yes, We have ISO 9000 Quality Management System.
Q2: What information should we supply if we want a quotation?
Ans: Drawing of your IC or component, Quantity and size normally.
Q3: How long you could prepare samples?
Ans:Normally 3 days. If customized one, open new mold 25~30days
around.
Q4: How about batch order production?
Ans: Normally 5-8days or so.
Q5:Do you inspect the finished products?
Ans:Yes, We will do inspection according to ISO 9000 standard and
ruled by our QC staff.
