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RF PCB 1.27mm 2 Layer Circuit Boards 50mil AD1000 Immersion Gold

    Buy cheap RF PCB 1.27mm 2 Layer Circuit Boards 50mil AD1000 Immersion Gold from wholesalers
     
    Buy cheap RF PCB 1.27mm 2 Layer Circuit Boards 50mil AD1000 Immersion Gold from wholesalers
    • Buy cheap RF PCB 1.27mm 2 Layer Circuit Boards 50mil AD1000 Immersion Gold from wholesalers
    • Buy cheap RF PCB 1.27mm 2 Layer Circuit Boards 50mil AD1000 Immersion Gold from wholesalers
    • Buy cheap RF PCB 1.27mm 2 Layer Circuit Boards 50mil AD1000 Immersion Gold from wholesalers
    • Buy cheap RF PCB 1.27mm 2 Layer Circuit Boards 50mil AD1000 Immersion Gold from wholesalers

    RF PCB 1.27mm 2 Layer Circuit Boards 50mil AD1000 Immersion Gold

    Ask Lasest Price
    Brand Name : Bicheng
    Model Number : BIC-6.V1.0
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
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    RF PCB 1.27mm 2 Layer Circuit Boards 50mil AD1000 Immersion Gold

    50mil AD1000 Immersion Gold RF PCB 1.27mm 2 Layer Circuit Boards


    This style of PTFE/woven fiberglass/ceramic filled laminate AD1000 material is used to create immersion gold RF PCBs. The circuit board has finished 1oz copper in two layers. No silkscreen and solder mask. The layer is completely exposed in air. It is 50 vacuum-packed boards and the board thickness is 0.8mm.


    AD1000 is widely use in Aircraft Collision Avoidance Systems (TCAS), Ground Based Radar Surveillance Systems, Low Noise Amplifiers (LNAs), Miniaturized Circuitry & Patch Antennas, Power Amplifiers (PAs), Radar Modules and Manifolds and X-Band and Below.


    Typical property of AD1000

    PropertyUnitsValueTest Method
    1. Electrical Properties
    Dielectric Constant (may vary by thickness)
    @1 MHz-IPC TM-650 2.5.5.3
    @ 10 GHz-10.2IPC TM-650 2.5.5.5
    Dissipation Factor
    @ 1 MHz-IPC TM-650 2.5.5.3
    @ 10 GHz-0.0023IPC TM-650 2.5.5.5
    Temperature Coefficient of Dielectric-
    TCεr @ 10 GHz (-40-150°C)ppm/℃-380IPC TM-650 2.5.5.5
    Volume Resistivity
    C96/35/90MΩ-cm1.40x109IPC TM-650 2.5.17.1
    E24/125MΩ-cm5.36x107IPC TM-650 2.5.17.1
    Surface Resistivity
    C96/35/901.80x109IPC TM-650 2.5.17.1
    E24/1253.16x108IPC TM-650 2.5.17.1
    Electrical StrengthVolts/mil (kV/mm)622 (24.5)IPC TM-650 2.5.6.2
    Dielectric BreakdownkV>45IPC TM-650 2.5.6
    Arc Resistancesec>180IPC TM-650 2.5.1
    2. Thermal Properties
    Decomposition Temperature (Td)
    Initial>500IPC TM-650 2.4.24.6
    5%>500IPC TM-650 2.4.24.6
    T260min>60IPC TM-650 2.4.24.1
    T288min>60IPC TM-650 2.4.24.1
    T300min>60IPC TM-650 2.4.24.1
    Thermal Expansion, CTE (x,y) 50-150ºCppm/℃8, 10IPC TM-650 2.4.41
    Thermal Expansion, CTE (z) 50-150ºCppm/℃20IPC TM-650 2.4.24
    % z-axis Expansion (50-260ºC)%IPC TM-650 2.4.24
    3. Mechanical Properties
    Peel Strength to Copper (1 oz/35 micron)
    After Thermal Stresslb/in (N/mm)>12 (2.1)IPC TM-650 2.4.8
    At Elevated Temperatures (150º)lb/in (N/mm)13.6 (2.4)IPC TM-650 2.4.8.2
    After Process Solutionslb/in (N/mm)IPC TM-650 2.4.8
    Young’s Moduluskpsi (GPa)200 (1.38)IPC TM-650 2.4.18.3
    Flexural Strength (Machine/Cross)kpsi (MPa)9.9/7.5 (68/52)IPC TM-650 2.4.4
    Tensile Strength (Machine/Cross)kpsi (MPa)5.1/4.3 (35/30)IPC TM-650 2.4.18.3
    Compressive Moduluskpsi (GPa)>425 (>2.93)ASTM D-3410
    Poisson’s Ratio-0.16ASTM D-3039
    4. Physical Properties
    Water Absorption%0.03IPC TM-650 2.6.2.1
    Density, ambient 23ºCg/cm33.20ASTM D792 Method A
    Thermal ConductivityW/mK0.81ASTM E1461
    FlammabilityclassMeets V0UL-94
    NASA Outgassing, 125ºC, ≤10-6 torr%NASA SP-R-0022A
    Total Mass Loss%0.01NASA SP-R-0022A
    Collected Volatiles%0.00NASA SP-R-0022A
    Water Vapor Recovered%0.00NASA SP-R-0022A



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